Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

Abstract

The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

1 - 8 . (canceled)  
   
   
       9 . A method of manufacturing a multilayer wiring substrate, in which a first wiring substrate having a first conductor pattern and a second wiring substrate having a second conductor pattern are stacked on each other, including the steps of: 
 forming an adhesive layer on a supporting sheet made of metal;    forming a conductive interlayer connection for linking between the layers for said adhesive layer;    stacking said second wiring substrate on said adhesive layer and electrically connecting said interlayer connection and said second conductor pattern;    removing said supporting sheet from said adhesive layer; and    stacking said second wiring substrate through said adhesive layer on a predetermined region of said first wiring substrate, and electrically connecting said interlayer connection and said first conductor pattern.    
   
   
       10 . The method of manufacturing a multilayer wiring substrate according to  claim 9 , wherein the removal of said supporting sheet includes a step of melting and removing at least a part of said supporting sheet.  
   
   
       11 . The method of manufacturing a multilayer wiring substrate according to  claim 9 , wherein said supporting sheet includes a metal base member and a melting metal layer on which said adhesive layer is formed and which is separately stacked on said metal base member, and 
 the step of removing said supporting sheet includes a step of separating and removing said metal base member from said melting metal layer and a step of selectively melting and removing only said melting metal layer from said adhesive layer containing said interlayer connection.    
   
   
       12 . The method of manufacturing a multilayer wiring substrate according to  claim 11 , wherein said melting metal layer and said interlayer connection are made of metal materials different from each other, and the step of melting and removing said melting metal layer is carried out by using an etching solution which melts said melting metal layer and does not melt said interlayer connection.  
   
   
       13 . The method of manufacturing a multilayer wiring substrate according to  claim 9 , wherein a photosensitive adhesive is used as said adhesive layer, and said interlayer connection is formed by an electroplating method that uses said photosensitive adhesive as a resist for plating.  
   
   
       14 . The method of manufacturing a multilayer wiring substrate according to  claim 9 , further including a step of: 
 cutting said second wiring substrate together with said supporting sheet to a piece of a predetermined shape before a step of stacking said second wiring substrate and said first wiring substrate.    
   
   
       15 . The method of manufacturing a multilayer wiring substrate according to  claim 9 , further including a step of: 
 flattening the surface on said first wiring substrate by coating an insulating material on a region in which said first conductor pattern on said first wiring substrate is not formed, before the step of stacking said second wiring substrate on said first wiring substrate.    
   
   
       16 - 23 . (canceled)