Inventor · disambiguated record
Edgar Zuniga-Ortiz
Also filed as: ZUNIGA-ORTIZ EDGAR R · ZUNIGA-ORTIZ EDGAR ROLANDO
10 granted patents·6 pending applications·122 citations·filing 2001–2014
89Inventor score
Files withTEXAS INSTRUMENTS INC9ZUNIGA-ORTIZ EDGAR R3ZUNIGA-ORTIZ EDGAR ROLANDO2GLOVER KERRY C1KODURI SREENIVASAN K1
Top patents by PatentIndex Score
16 records- 0187US8304274B2Micro-electro-mechanical system having movable element integrated into substrate-based packageZUNIGA-ORTIZ EDGAR ROLANDO·Filed 2010·Granted Nov 6, 2012·10 cites·18 claims
- 0287US6768210B2Bumpless wafer scale device and board assemblyTEXAS INSTRUMENTS INC·Filed 2001·Granted Jul 27, 2004·51 cites·25 claims
- 0381US7268415B2Semiconductor device having post-mold nickel/palladium/gold plated leadsTEXAS INSTRUMENTS INC·Filed 2004·Granted Sep 11, 2007·27 cites·13 claims
- 0480US7368328B2Semiconductor device having post-mold nickel/palladium/gold plated leadsTEXAS INSTRUMENTS INC·Filed 2007·Granted May 6, 2008·8 cites·10 claims
- 0576US8338208B2Micro-electro-mechanical system having movable element integrated into leadframe-based packageZUNIGA-ORTIZ EDGAR ROLANDO·Filed 2010·Granted Dec 25, 2012·4 cites·12 claims
- 0675US8648430B2Microelectromechanical system having movable element integrated into substrate-based packageTEXAS INSTRUMENTS INC·Filed 2012·Granted Feb 11, 2014·3 cites·16 claims
- 0772US6914332B2Flip-chip without bumps and polymer for board assemblyTEXAS INSTRUMENTS INC·Filed 2002·Granted Jul 5, 2005·16 cites·24 claims
- 0864US8722444B1Microelectromechanical system having movable element integrated into substrate-based packageTEXAS INSTRUMENTS INC·Filed 2014·Granted May 13, 2014·1 cites·20 claims
- 0963US8796792B2Micro-electro-mechanical system having movable element integrated into leadframe-based packageTEXAS INSTRUMENTS INC·Filed 2012·Granted Aug 5, 2014·1 cites·17 claims
- 1050US2008012101A1Semiconductor Package Having Improved Adhesion and SolderabilityTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1145US2006006532A1Flip-chip without bumps and polymer for board assemblyZUNIGA-ORTIZ EDGAR R·Filed 2005·Application pending·0 cites
- 1244US7910471B2Bumpless wafer scale device and board assemblyTEXAS INSTRUMENTS INC·Filed 2004·Granted Mar 22, 2011·1 cites·6 claims
- 1342US2006125062A1Semiconductor package having improved adhesion and solderabilityZUNIGA-ORTIZ EDGAR R·Filed 2004·Application pending·0 cites
- 1441US2007246822A1Hard disk drive preamp heat dissipation methodsGLOVER KERRY C·Filed 2006·Application pending·0 cites
- 1539US2006189029A1Method for efficient annealing of plated semiconductor package leadsKODURI SREENIVASAN K·Filed 2005·Application pending·0 cites
- 1637US2006170080A1Semiconductor device having directly attached heat spreaderZUNIGA-ORTIZ EDGAR R·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →