Inventor · disambiguated record
Takayuki Komiya
Also filed as: KOMIYA TAKAYUKI
10 granted patents·14 pending applications·308 citations·filing 1994–2023
90Inventor score
Top patents by PatentIndex Score
24 records- 0192US6001729AMethod of forming wiring structure for semiconductor deviceKAWASAKI STEEL CO·Filed 1998·Granted Dec 14, 1999·104 cites·36 claims
- 0284US5834846ASemiconductor device with contact structure and method of manufacturing the sameKAWASAKI STEEL CO·Filed 1995·Granted Nov 10, 1998·61 cites·69 claims
- 0382US6786974B2Insulating film forming method and insulating film forming apparatusTOKYO ELECTRON LTD·Filed 2003·Granted Sep 7, 2004·28 cites·7 claims
- 0472US5904557AMethod for forming multilevel interconnection of semiconductor deviceTOKYO ELECTRON LTD·Filed 1997·Granted May 18, 1999·43 cites·13 claims
- 0567US2024111945A1Experiment support apparatus, experiment support system, experiment support method, and computer-readable mediumEVIDENT CORP·Filed 2023·Application pending·0 cites
- 0666US5830280AWashing liquid for post-polishing and polishing-cleaning method in semiconductor processTOKYO ELECTRON LTD·Filed 1997·Granted Nov 3, 1998·33 cites·10 claims
- 0766US5652180AMethod of manufacturing semiconductor device with contact structureKAWASAKI STEEL CO·Filed 1994·Granted Jul 29, 1997·35 cites·25 claims
- 0862US2022108064A1Experiment support apparatus, experiment support system, experiment support method, and computer-readable mediumOLYMPUS CORP·Filed 2021·Application pending·0 cites
- 0953US2007134602A1High-pressure processing apparatusMATSUMOTO KENJI·Filed 2006·Application pending·0 cites
- 1051US11867496B2Measurement system, measurement support method, and computer-readable mediumEVIDENT CORP·Filed 2021·Granted Jan 9, 2024·0 cites·15 claims
- 1151US2014174363A1Film forming apparatusTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 1250US2023295797A1Film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1348US2024274433A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1445US6573191B1Insulating film forming method and insulating film forming apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Jun 3, 2003·1 cites·6 claims
- 1544US8679978B2Method for forming a film including Zr, Hf or the like, and method for manufacturing a semiconductor device using the sameKOMIYA TAKAYUKI·Filed 2011·Granted Mar 25, 2014·0 cites·6 claims
- 1642US2019237326A1Selective film forming method and film forming apparatusTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 1741US2006174835A1Vacuum processing apparatus and method of using the sameSAITO MISAKO·Filed 2006·Application pending·0 cites
- 1839US2005104525A1Reducing apparatus and methodTOKYO ELECTRON LTD·Filed 2004·Application pending·0 cites
- 1939US2006084266A1Film formation methodEIICHI KONDOH·Filed 2005·Application pending·0 cites
- 2038US2005158477A1Deposition apparatus and a deposition method using medium in a supercritical stateEIICHI KONDOH·Filed 2004·Application pending·0 cites
- 2138US2006121307A1Film deposition methodEIICHI KONDOH·Filed 2005·Application pending·0 cites
- 2237US2006037858A1Electroless plating apparatus and electroless plating methodTOKYO ELECTRON LTD·Filed 2003·Application pending·0 cites
- 2335US6515945B2Recording media library apparatus with a function to detect a position of a recording medium transferred in the libraryHITACHI ELECTR ENG·Filed 1999·Granted Feb 4, 2003·3 cites·5 claims
- 2435US2006099348A1Deposition methodEIICHI KONDOH·Filed 2005·Application pending·0 cites
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