Inventor · disambiguated record
Martin S. Wohlert
Also filed as: WOHLERT MARTIN · WOHLERT MARTIN S
12 granted patents·7 pending applications·60 citations·filing 2004–2023
91Inventor score
Top patents by PatentIndex Score
19 records- 0198US11260500B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2020·Granted Mar 1, 2022·4 cites·9 claims
- 0296US10766117B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2018·Granted Sep 8, 2020·5 cites·3 claims
- 0396US8066551B2Retaining ring with shaped surfaceCHEN HUNG CHIH·Filed 2011·Granted Nov 29, 2011·14 cites·19 claims
- 0494US8585468B2Retaining ring with shaped surfaceCHEN HUNG CHIH·Filed 2011·Granted Nov 19, 2013·8 cites·5 claims
- 0590US7927190B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2008·Granted Apr 19, 2011·9 cites·19 claims
- 0688US9937601B2Retaining ring with Shaped SurfaceAPPLIED MATERIALS INC·Filed 2015·Granted Apr 10, 2018·4 cites·13 claims
- 0787US11850703B2Method of forming retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2023·Granted Dec 26, 2023·0 cites·20 claims
- 0883US11577361B2Retaining ring with shaped surface and method of formingAPPLIED MATERIALS INC·Filed 2022·Granted Feb 14, 2023·0 cites·4 claims
- 0982US7210988B2Method and apparatus for reduced wear polishing pad conditioningAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·9 cites·35 claims
- 1081US9412619B2Method of outgassing a mask material deposited over a workpiece in a process toolAPPLIED MATERIALS INC·Filed 2014·Granted Aug 9, 2016·4 cites·14 claims
- 1177US9186773B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2013·Granted Nov 17, 2015·2 cites·13 claims
- 1263US7879255B2Method and composition for electrochemically polishing a conductive material on a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Feb 1, 2011·1 cites·2 claims
- 1353US2010263715A1Integrated Edge Clamping Mechanism for Processing of LaminatesAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 1448US2012168135A1Apparatus and method for solar cell module edge cooling during laminationLINKE ROBERT C·Filed 2011·Application pending·0 cites
- 1542US2006219663A1Metal CMP process on one or more polishing stations using slurries with oxidizersAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1641US2005194681A1Conductive pad with high abrasionFiled 2005·Application pending·0 cites
- 1740US2006021974A1Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 1840US2006276111A1Conditioning element for electrochemical mechanical processingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1939US2005092621A1Composite pad assembly for electrochemical mechanical processing (ECMP)Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Martin S. Wohlert files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →