Inventor · disambiguated record
Chia-Lin Yu
Also filed as: YU CHIA-LIN
39 granted patents·9 pending applications·176 citations·filing 2008–2025
97Inventor score
Files withYU CHEN-HUA13TAIWAN SEMICONDUCTOR MFG8TAIWAN SEMICONDUCTOR MFG CO LTD7MEDIATEK INC4EPISTAR CORP3
Top patents by PatentIndex Score
48 records- 0197US8629465B2Light-emitting diodes on concave texture substrateYU CHEN-HUA·Filed 2012·Granted Jan 14, 2014·16 cites·19 claims
- 0295US8058082B2Light-emitting diode with textured substrateYU CHEN-HUA·Filed 2008·Granted Nov 15, 2011·28 cites·19 claims
- 0391US8546953B2Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuitHORNG JAW-JUINN·Filed 2011·Granted Oct 1, 2013·12 cites·20 claims
- 0491US8134163B2Light-emitting diodes on concave texture substrateYU CHEN-HUA·Filed 2008·Granted Mar 13, 2012·14 cites·14 claims
- 0590US8487410B2Through-silicon vias for semicondcutor substrate and method of manufactureYU CHEN-HUA·Filed 2011·Granted Jul 16, 2013·8 cites·9 claims
- 0690US8377796B2III-V compound semiconductor epitaxy from a non-III-V substrateTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Feb 19, 2013·11 cites·26 claims
- 0789US9214613B2Method of forming light-generating device including reflective layerTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Dec 15, 2015·3 cites·16 claims
- 0889US8946742B2Semiconductor package with through silicon viasYU CHEN-HUA·Filed 2010·Granted Feb 3, 2015·7 cites·20 claims
- 0988US8659033B2Light-emitting diode with textured substrateYU CHEN-HUA·Filed 2011·Granted Feb 25, 2014·4 cites·15 claims
- 1088US7947588B2Structure and method for a CMOS device with doped conducting metal oxide as the gate electrodeTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted May 24, 2011·16 cites·18 claims
- 1188US7875534B2Realizing N-face III-nitride semiconductors by nitridation treatmentTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Jan 25, 2011·10 cites·15 claims
- 1285US8044409B2III-nitride based semiconductor structure with multiple conductive tunneling layerTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Oct 25, 2011·9 cites·17 claims
- 1381US8252682B2Method for thinning a waferYANG KU-FENG·Filed 2010·Granted Aug 28, 2012·8 cites·27 claims
- 1480US8716723B2Reflective layer between light-emitting diodesCHEN DING-YUAN·Filed 2008·Granted May 6, 2014·4 cites·20 claims
- 1577US10784162B2Method of making a semiconductor component having through-silicon viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·1 cites·20 claims
- 1677US8519414B2III-nitride based semiconductor structure with multiple conductive tunneling layerYU CHIA-LIN·Filed 2011·Granted Aug 27, 2013·3 cites·14 claims
- 1776US9305864B2Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 5, 2016·3 cites·20 claims
- 1874US8507940B2Heat dissipation by through silicon plugsYU CHEN-HUA·Filed 2010·Granted Aug 13, 2013·2 cites·20 claims
- 1973US11545392B2Semiconductor component having through-silicon viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 2073US10115634B2Semiconductor component having through-silicon vias and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·1 cites·20 claims
- 2173US9373755B2Light-emitting diodes on concave texture substrateEPISTAR CORP·Filed 2013·Granted Jun 21, 2016·1 cites·16 claims
- 2273US8138076B2MOSFETs having stacked metal gate electrodes and methodLIN CHENG-TUNG·Filed 2008·Granted Mar 20, 2012·4 cites·15 claims
- 2372US10049931B2Method of manufacturing a semiconductor device including through silicon plugsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·1 cites·20 claims
- 2472US8486807B2Realizing N-face III-nitride semiconductors by nitridation treatmentYU CHEN-HUA·Filed 2010·Granted Jul 16, 2013·2 cites·7 claims
- 2568US9418923B2Semiconductor component having through-silicon vias and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·1 cites·7 claims
- 2668US8575725B2Through-silicon vias for semicondcutor substrate and method of manufactureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 5, 2013·1 cites·21 claims
- 2766US2025021827A1Method for finding at least one optimal post-training quantization model and a non-transitory machine-readable mediumMEDIATEK INC·Filed 2024·Application pending·0 cites
- 2865US9130115B2Light-emitting diode with textured substrateTSMC SOLID STATE LIGHTING LTD·Filed 2014·Granted Sep 8, 2015·0 cites·20 claims
- 2965US2025371329A1Mixed-Precision Model Quantization Method and System for a Residual Connection of a Trained ModelMEDIATEK INC·Filed 2025·Application pending·0 cites
- 3064US10062821B2Light-emitting deviceEPISTAR CORP·Filed 2017·Granted Aug 28, 2018·0 cites·11 claims
- 3164US8779445B2Stress-alleviation layer for LED structuresYU CHEN-HUA·Filed 2008·Granted Jul 15, 2014·2 cites·21 claims
- 3264US8148732B2Carbon-containing semiconductor substrateYU CHEN-HUA·Filed 2009·Granted Apr 3, 2012·1 cites·20 claims
- 3363US10497619B2Method of manufacturing a semiconductor device including through silicon plugsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·0 cites·20 claims
- 3463US8803189B2III-V compound semiconductor epitaxy using lateral overgrowthYU CHEN-HUA·Filed 2009·Granted Aug 12, 2014·1 cites·30 claims
- 3562US9448585B2Clamping structure, electronic device and clamping componentWISTRON CORP·Filed 2014·Granted Sep 20, 2016·2 cites·34 claims
- 3660US9698325B2Light-emitting device including reflective layerEPISTAR CORP·Filed 2015·Granted Jul 4, 2017·0 cites·21 claims
- 3759US8878252B2III-V compound semiconductor epitaxy from a non-III-V substrateTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 4, 2014·0 cites·20 claims
- 3857US9287440B2Method of manufacturing a semiconductor device including through silicon plugsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 15, 2016·0 cites·20 claims
- 3956US8686474B2III-V compound semiconductor epitaxy from a non-III-V substrateTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 1, 2014·0 cites·19 claims
- 4054US2025245495A1Data processing methodsMEDIATEK INC·Filed 2025·Application pending·0 cites
- 4154US2015147834A1Novel semiconductor package with through silicon viasTSMC SOLID STATE LIGHTING LTD·Filed 2015·Application pending·0 cites
- 4252US2022156567A1Neural network processing unit for hybrid and mixed precision computingMEDIATEK INC·Filed 2021·Application pending·0 cites
- 4350US8154038B2Group-III nitride for reducing stress caused by metal nitride reflectorYU CHEN-HUA·Filed 2008·Granted Apr 10, 2012·0 cites·18 claims
- 4449US9827653B2Screwing accessory deviceWISTRON CORP·Filed 2014·Granted Nov 28, 2017·0 cites·15 claims
- 4547US2010012954A1Vertical III-Nitride Light Emitting Diodes on Patterned Substrates with Embedded Bottom ElectrodesYU CHEN-HUA·Filed 2008·Application pending·0 cites
- 4647US2009272975A1Poly-Crystalline Layer Structure for Light-Emitting DiodesCHEN DING-YUAN·Filed 2008·Application pending·0 cites
- 4738US2024004952A1Hardware-Aware Mixed-Precision QuantizationMEDIATEK SINGAPORE PTE LTD·Filed 2022·Application pending·0 cites
- 4838US2012068218A1Thermally efficient packaging for a photonic deviceCHANG HUNG-PIN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →