Inventor · disambiguated record
Kentaro Kumazawa
Also filed as: KUMAZAWA KENTARO
15 granted patents·1 pending application·21 citations·filing 2005–2023
87Inventor score
Top patents by PatentIndex Score
16 records- 0170US8080884B2Mounting structure and mounting methodNAKAMURA KOJIRO·Filed 2009·Granted Dec 20, 2011·7 cites·8 claims
- 0268US8895359B2Semiconductor device, flip-chip mounting method and flip-chip mounting apparatusTOMURA YOSHIHIRO·Filed 2009·Granted Nov 25, 2014·4 cites·2 claims
- 0366US8426965B2Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing toolIWASE TEPPEI·Filed 2012·Granted Apr 23, 2013·2 cites·6 claims
- 0466US8163599B2Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatusTOMURA YOSHIHIRO·Filed 2009·Granted Apr 24, 2012·4 cites·5 claims
- 0565US8264079B2Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing toolIWASE TEPPEI·Filed 2008·Granted Sep 11, 2012·3 cites·7 claims
- 0660US7985078B2Electrode junction structure and manufacturing method thereofPANASONIC CORP·Filed 2009·Granted Jul 26, 2011·1 cites·15 claims
- 0751US8050049B2Semiconductor devicePANASONIC CORP·Filed 2009·Granted Nov 1, 2011·0 cites·4 claims
- 0850US8436253B2Method of manufacturing mounting structure and mounting structureHIGUCHI TAKAYUKI·Filed 2009·Granted May 7, 2013·0 cites·7 claims
- 0949US2023311509A1Coating headPANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 1048US8358018B2Resin sealing structure for electronic component and resin sealing method for electronic componentPANASONIC CORP·Filed 2009·Granted Jan 22, 2013·0 cites·2 claims
- 1147US11279133B2Ink jet devicePANASONIC IP MAN CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·11 claims
- 1247US7994638B2Semiconductor chip and semiconductor devicePANASONIC CORP·Filed 2008·Granted Aug 9, 2011·0 cites·9 claims
- 1344US10369783B2Ink jet printing method printing a test substrate and a printing targetPANASONIC IP MAN CO LTD·Filed 2018·Granted Aug 6, 2019·0 cites·14 claims
- 1442US7910406B2Electronic circuit device and method for manufacturing samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·0 cites·6 claims
- 1540US8035225B2Semiconductor chip assembly and fabrication method thereforPANASONIC CORP·Filed 2005·Granted Oct 11, 2011·0 cites·5 claims
- 1639US8415794B2Semiconductor device having stable signal transmission at high speed and high frequencyKUMAZAWA KENTARO·Filed 2009·Granted Apr 9, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →