Assignee
IWASE TEPPEI
JP·3 granted patents·9 citations·filing 2007–2012
Top patents by PatentIndex Score
3 records- 0167US8106521B2Semiconductor device mounted structure with an underfill sealing-bonding resin with voidsIWASE TEPPEI·Filed 2007·Granted Jan 31, 2012·4 cites·9 claims
- 0266US8426965B2Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing toolIWASE TEPPEI·Filed 2012·Granted Apr 23, 2013·2 cites·6 claims
- 0365US8264079B2Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing toolIWASE TEPPEI·Filed 2008·Granted Sep 11, 2012·3 cites·7 claims
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