Inventor · disambiguated record
Cornelius A. Van Der Jeugd
Also filed as: VAN DER JEUGD CORNELIUS A · VAN DER JEUGD CORNELIUS ALEXAN
23 granted patents·3 pending applications·3,158 citations·filing 1996–2016
97Inventor score
Top patents by PatentIndex Score
26 records- 0199US6692576B2Wafer support systemASM INC·Filed 2002·Granted Feb 17, 2004·552 cites·11 claims
- 0299US6093252AProcess chamber with inner supportASM INC·Filed 1996·Granted Jul 25, 2000·638 cites·49 claims
- 0399US6053982AWafer support systemASM INC·Filed 1996·Granted Apr 25, 2000·690 cites·30 claims
- 0498US6126744AMethod and system for adjusting semiconductor processing equipmentASM INC·Filed 1997·Granted Oct 3, 2000·423 cites·24 claims
- 0596US9552979B2Cyclic aluminum nitride deposition in a batch reactorASM IP HOLDING BV·Filed 2013·Granted Jan 24, 2017·43 cites·25 claims
- 0696US6343183B1Wafer support systemASM INC·Filed 2000·Granted Jan 29, 2002·87 cites·6 claims
- 0795US7294582B2Low temperature silicon compound depositionASM INT·Filed 2005·Granted Nov 13, 2007·116 cites·44 claims
- 0895US6335280B1Tungsten silicide deposition processASM INC·Filed 1997·Granted Jan 1, 2002·196 cites·37 claims
- 0995US6203622B1Wafer support systemASM INC·Filed 2000·Granted Mar 20, 2001·85 cites·34 claims
- 1092US6491757B2Wafer support systemASM INC·Filed 2001·Granted Dec 10, 2002·42 cites·24 claims
- 1192US6113702AWafer support systemASM INC·Filed 1997·Granted Sep 5, 2000·93 cites·29 claims
- 1291US6454866B1Wafer support systemASM INC·Filed 2000·Granted Sep 24, 2002·38 cites·9 claims
- 1387US7691750B2Methods of forming films in semiconductor devices with solid state reactantsASM INT·Filed 2006·Granted Apr 6, 2010·13 cites·22 claims
- 1487US6086680ALow-mass susceptorASM INC·Filed 1996·Granted Jul 11, 2000·88 cites·15 claims
- 1583US7629270B2Remote plasma activated nitridationASM INC·Filed 2005·Granted Dec 8, 2009·11 cites·51 claims
- 1682US7153772B2Methods of forming silicide films in semiconductor devicesASM INT·Filed 2004·Granted Dec 26, 2006·27 cites·27 claims
- 1780US10343907B2Method and system for delivering hydrogen peroxide to a semiconductor processing chamberASM IP HOLDING BV·Filed 2015·Granted Jul 9, 2019·3 cites·11 claims
- 1880US7655093B2Wafer support systemASM INC·Filed 2007·Granted Feb 2, 2010·4 cites·17 claims
- 1975US9837271B2Process for forming silicon-filled openings with a reduced occurrence of voidsASM IP HOLDING BV·Filed 2015·Granted Dec 5, 2017·2 cites·26 claims
- 2069US7645486B2Method of manufacturing a silicon dioxide layerSOITEC SILICON ON INSULATOR·Filed 2007·Granted Jan 12, 2010·3 cites·20 claims
- 2168US9431238B2Reactive curing process for semiconductor substratesASM IP HOLDING BV·Filed 2015·Granted Aug 30, 2016·1 cites·31 claims
- 2264US9443730B2Process for forming silicon-filled openings with a reduced occurrence of voidsASM IP HOLDING BV·Filed 2014·Granted Sep 13, 2016·1 cites·25 claims
- 2354US7186298B2Wafer support systemASM INC·Filed 2003·Granted Mar 6, 2007·2 cites·8 claims
- 2448US2017011910A1Reactive curing process for semiconductor substratesASM IP HOLDING BV·Filed 2016·Application pending·0 cites
- 2545US2016020094A1Process for forming silicon-filled openings with a reduced occurrence of voidsASM IP HOLDING BV·Filed 2014·Application pending·0 cites
- 2633US2016240373A1Method for forming oxide layer by oxidizing semiconductor substrate with hydrogen peroxideASM IP HOLDING BV·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →