Inventor · disambiguated record
Vincent Jarry
Also filed as: JARRY VINCENT
11 granted patents·4 pending applications·13 citations·filing 2005–2022
84Inventor score
Top patents by PatentIndex Score
15 records- 0172US11575172B2Electronic device including interposer substrate carrying mica substrate with battery layer environmentally sealed theretoST MICROELECTRONICS TOURS SAS·Filed 2022·Granted Feb 7, 2023·0 cites·14 claims
- 0272US11251478B2Encapsulated flexible thin-film micro-batteriesST MICROELECTRONICS TOURS SAS·Filed 2019·Granted Feb 15, 2022·0 cites·6 claims
- 0368US8309403B2Method for encapsulating electronic components on a waferFERON MARC·Filed 2010·Granted Nov 13, 2012·4 cites·7 claims
- 0465US8785297B2Method for encapsulating electronic components on a waferST MICROELECTRONICS TOURS SAS·Filed 2012·Granted Jul 22, 2014·2 cites·22 claims
- 0564US8409967B2Method for manufacturing semiconductor chips from a semiconductor waferJARRY VINCENT·Filed 2011·Granted Apr 2, 2013·2 cites·9 claims
- 0663US8486763B2Method for thinning and dicing electronic circuit wafersJARRY VINCENT·Filed 2011·Granted Jul 16, 2013·2 cites·6 claims
- 0763US8319339B2Surface-mounted silicon chipSERRE CHRISTOPHE·Filed 2010·Granted Nov 27, 2012·1 cites·18 claims
- 0862US10290838B2Methods for encapsulating flexible thin-film micro-batteries to protect against environmental intrusionST MICROELECTRONICS TOURS SAS·Filed 2015·Granted May 14, 2019·0 cites·18 claims
- 0960US9356310B2Method for forming a microbatteryST MICROELECTRONICS TOURS SAS·Filed 2013·Granted May 31, 2016·0 cites·14 claims
- 1058US10444002B2Sensor device for geometrically testing partsACTIMESURE·Filed 2015·Granted Oct 15, 2019·2 cites·14 claims
- 1157US2016240864A1Method for forming a microbatteryST MICROELECTRONICS TOURS SAS·Filed 2016·Application pending·0 cites
- 1250US8772134B2Method for manufacturing semiconductor chips from a semiconductor waferST MICROELECTRONICS TOURS SAS·Filed 2013·Granted Jul 8, 2014·0 cites·18 claims
- 1338US2006134903A1Connection ball positioning method and device for integrated circuitsST MICROELECTRONICS SA·Filed 2005·Application pending·0 cites
- 1433US2012009763A1Semiconductor chip manufacturing methodJARRY VINCENT·Filed 2011·Application pending·0 cites
- 1532US2013192435A1Wafer cutting method and deviceST MICROELECTRONICS TOURS SAS·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →