Assignee
JARRY VINCENT
FR·2 granted patents·1 pending application·4 citations·filing 2011–2011
Top patents by PatentIndex Score
3 records- 0164US8409967B2Method for manufacturing semiconductor chips from a semiconductor waferJARRY VINCENT·Filed 2011·Granted Apr 2, 2013·2 cites·9 claims
- 0263US8486763B2Method for thinning and dicing electronic circuit wafersJARRY VINCENT·Filed 2011·Granted Jul 16, 2013·2 cites·6 claims
- 0333US2012009763A1Semiconductor chip manufacturing methodJARRY VINCENT·Filed 2011·Application pending·0 cites
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