Inventor · disambiguated record
Chi-Yeh Yu
Also filed as: YU CHI-YEH
28 granted patents·5 pending applications·192 citations·filing 2007–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23MEDIATEK INC3YU CHI-YEH3TAIWAN SEMICONDUCTOR MFG2KAO JERRY1
Top patents by PatentIndex Score
33 records- 0197US8701073B1System and method for across-chip thermal and power management in stacked IC designsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Apr 15, 2014·72 cites·17 claims
- 0293US9911697B2Power strap structure for high performance and low current densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·8 cites·20 claims
- 0393US8631372B2System and method of electromigration mitigation in stacked IC designsYU CHI-YEH·Filed 2012·Granted Jan 14, 2014·45 cites·17 claims
- 0491US11251124B2Power grid structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 15, 2022·6 cites·20 claims
- 0588US10510688B2Via rail solution for high power electromigrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·4 cites·20 claims
- 0688US10170422B2Power strap structure for high performance and low current densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 1, 2019·4 cites·20 claims
- 0787US9165882B2Power rail for preventing DC electromigrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 20, 2015·8 cites·20 claims
- 0886US9223919B2System and method of electromigration mitigation in stacked IC designsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 29, 2015·9 cites·18 claims
- 0984US12243821B2Conductive line structures and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 4, 2025·0 cites·20 claims
- 1084US9405883B2Power rail for preventing DC electromigrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 2, 2016·4 cites·20 claims
- 1183US8766409B2Method and structure for through-silicon via (TSV) with diffused isolation wellYU CHI-YEH·Filed 2011·Granted Jul 1, 2014·6 cites·13 claims
- 1281US10861790B2Power strap structure for high performance and low current densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·2 cites·20 claims
- 1381US9064081B1Generating database for cells routable in pin layerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 23, 2015·6 cites·13 claims
- 1477US11063005B2Via rail solution for high power electromigrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
- 1577US2025167120A1Conductive line structures and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1677US2025021736A1Dummy cells placed adjacent functional blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1774US11935833B2Method of forming power grid structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 1874US9311440B2System and method of electromigration avoidance for automatic place-and-routeKAO JERRY·Filed 2012·Granted Apr 12, 2016·5 cites·20 claims
- 1971US2021366844A1Via rail solution for high power electromigrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2070US12299371B2Dummy cells placed adjacent functional blocksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 2170US9900005B2Switch cell structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·2 cites·20 claims
- 2269US2024202420A1Integrated circuit with dummy boundary cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2367US11941338B2Integrated circuit with dummy boundary cellsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
- 2465US8680882B23D-IC interposer testing structure and method of testing the structureTSENG NAN-HSIN·Filed 2011·Granted Mar 25, 2014·2 cites·13 claims
- 2565US7937643B1Mobile communication device and data reception methodMEDIATEK INC·Filed 2007·Granted May 3, 2011·6 cites·10 claims
- 2664US9214390B2Method for forming through-silicon via (TSV) with diffused isolation wellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 15, 2015·1 cites·25 claims
- 2762US9893009B2Duplicate layering and routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·1 cites·20 claims
- 2860US11088092B2Via rail solution for high power electromigrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 10, 2021·0 cites·20 claims
- 2952US11443094B2Method of inserting dummy boundary cells for macro/IP and ICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 3050US9619599B2System for and method of checking joule heating of an integrated circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 11, 2017·0 cites·20 claims
- 3146US8374295B2Method of scaling input data and mobile device utilizing the sameMEDIATEK INC·Filed 2007·Granted Feb 12, 2013·0 cites·21 claims
- 3246US7936856B1Timing synchronization in wireless communication systemMEDIATEK INC·Filed 2007·Granted May 3, 2011·0 cites·28 claims
- 3336US2012120198A1Three-dimensional size measuring system and three-dimensional size measuring methodYU CHI-YEH·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →