Inventor · disambiguated record
Kou Hasegawa
Also filed as: HASEGAWA KOU
22 granted patents·9 pending applications·421 citations·filing 1988–2008
96Inventor score
Top patents by PatentIndex Score
31 records- 0191US6855034B2Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor waferJSR CORP·Filed 2002·Granted Feb 15, 2005·54 cites·57 claims
- 0291US6790883B2Composition for polishing pad and polishing pad using the sameJSR CORP·Filed 2001·Granted Sep 14, 2004·36 cites·18 claims
- 0390US7077879B2Composition for polishing pad and polishing pad using the sameJSR CORP·Filed 2004·Granted Jul 18, 2006·28 cites·10 claims
- 0489US6832949B2Window member for chemical mechanical polishing and polishing padJSR CORP·Filed 2002·Granted Dec 21, 2004·44 cites·24 claims
- 0588US7922783B2Polishing pad and production method thereofJSR CORP·Filed 2008·Granted Apr 12, 2011·21 cites·12 claims
- 0683US7097550B2Chemical mechanical polishing padJSR CORP·Filed 2005·Granted Aug 29, 2006·10 cites·19 claims
- 0783US6645264B2Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereofJSR CORP·Filed 2001·Granted Nov 11, 2003·29 cites·31 claims
- 0881US6992123B2Polishing padJSR CORP·Filed 2003·Granted Jan 31, 2006·28 cites·31 claims
- 0978US7183213B2Chemical mechanical polishing pad and chemical mechanical polishing methodJSR CORP·Filed 2004·Granted Feb 27, 2007·18 cites·10 claims
- 1078US7001252B2Abrasive materialJSR CORP·Filed 2001·Granted Feb 21, 2006·16 cites·22 claims
- 1178US6848974B2Polishing pad for semiconductor wafer and polishing process using thereofJSR CORP·Filed 2002·Granted Feb 1, 2005·20 cites·15 claims
- 1274US6153704AThermoplastic elastomer compositionJSR CORP·Filed 1999·Granted Nov 28, 2000·33 cites·4 claims
- 1372US7323415B2Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor waferJSR CORP·Filed 2004·Granted Jan 29, 2008·14 cites·27 claims
- 1472US6777335B2Polishing methodJSR CORP·Filed 2001·Granted Aug 17, 2004·14 cites·31 claims
- 1568US7217305B2Polishing bodyJSR CORP·Filed 2005·Granted May 15, 2007·2 cites·8 claims
- 1667US4855758AThermal transfer recording apparatus with electroconductive inkCANON KK·Filed 1988·Granted Aug 8, 1989·12 cites·40 claims
- 1760US7201641B2Polishing bodyJSR CORP·Filed 2005·Granted Apr 10, 2007·1 cites·37 claims
- 1859US5216448AInk jet recording head carriage and an apparatus with sameCANON KK·Filed 1992·Granted Jun 1, 1993·15 cites·14 claims
- 1955US2004224622A1Polishing pad and production method thereofJSR CORP·Filed 2004·Application pending·0 cites
- 2054US6976910B2Polishing padJSR CORP·Filed 2004·Granted Dec 20, 2005·5 cites·15 claims
- 2153US6022091ARecording apparatus having an adjusting member for adjusting a guiding member toward amd away from recording materialCANON KK·Filed 1995·Granted Feb 8, 2000·12 cites·12 claims
- 2248US6341844B1Apparatus using overlaid flexible cable for electrically connecting relatively moveable partsCANON KK·Filed 1999·Granted Jan 29, 2002·8 cites·19 claims
- 2346US2004224611A1Polishing pad and method of polishing a semiconductor waferJSR CORP·Filed 2004·Application pending·0 cites
- 2444US2004224616A1Polishing pad and chemical mechanical polishing methodJSR CORP·Filed 2004·Application pending·0 cites
- 2541US2005222336A1Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing processJSR CORP·Filed 2005·Application pending·0 cites
- 2640US2004063391A1Composition for polishing pad and polishing pad therewithJSR CORP·Filed 2003·Application pending·0 cites
- 2739US2004203320A1Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing methodJSR CORP·Filed 2004·Application pending·0 cites
- 2838US2004266326A1Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing padFiled 2003·Application pending·0 cites
- 2937US2005227489A1Polishing pad and method of manufacturing semiconductor devicesMINAMIHARA GAKU·Filed 2004·Application pending·0 cites
- 3036US2004014413A1Polishing pad and multi-layer polishing padJSR CORP·Filed 2003·Application pending·0 cites
- 3133US5105203AThermal transfer process with improved recording head lifeCANON KK·Filed 1991·Granted Apr 14, 1992·1 cites·9 claims
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