Inventor · disambiguated record
Keith K. Sturcken
Also filed as: STURCKEN KEITH K
18 granted patents·4 pending applications·241 citations·filing 1998–2019
93Inventor score
Files withBAE SYS INF & ELECT SYS INTEG7BAE SYSTEMS INFORMATION7BAE SYSTEMS INFORMATION & ELEC2BAE SYSTEMS1HUGHES JOHN A1
Top patents by PatentIndex Score
22 records- 0195US6448576B1Programmable chalcogenide fuse within a semiconductor deviceBAE SYSTEMS INFORMATION·Filed 2001·Granted Sep 10, 2002·108 cites·14 claims
- 0285US6692994B2Method for manufacturing a programmable chalcogenide fuse within a semiconductor deviceBAE SYSTEMS INFORMATION·Filed 2002·Granted Feb 17, 2004·37 cites·8 claims
- 0378US9502269B2Method and apparatus for cooling electonic componentsBAE SYS INF & ELECT SYS INTEG·Filed 2015·Granted Nov 22, 2016·4 cites·16 claims
- 0478US7491577B2Method and apparatus for providing thermal management on high-power integrated circuit devicesBAE SYSTEMS INFORMATION·Filed 2007·Granted Feb 17, 2009·8 cites·14 claims
- 0572US6969869B2Programmable resistance memory element with indirect heatingOVONYX INC·Filed 2003·Granted Nov 29, 2005·19 cites·8 claims
- 0670US6734538B1Article comprising a multi-layer electronic package and method thereforBAE SYSTEMS INFORMATION & ELEC·Filed 2001·Granted May 11, 2004·18 cites·10 claims
- 0768US6547124B2Method for forming a micro column grid array (CGA)BAE SYSTEMS INFORMATION·Filed 2001·Granted Apr 15, 2003·14 cites·27 claims
- 0863US10854586B1Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare supportBAE SYS INF & ELECT SYS INTEG·Filed 2019·Granted Dec 1, 2020·1 cites·23 claims
- 0962US6504256B2Insitu radiation protection of integrated circuitsBAE SYSTEMS INFORMATION·Filed 2001·Granted Jan 7, 2003·9 cites·17 claims
- 1056US6329594B1Integrated circuit packageBAE SYSTEMS INFORMATION·Filed 1998·Granted Dec 11, 2001·22 cites·22 claims
- 1151US8586417B1Isostress grid array and method of fabrication thereofBAE SYS INF & ELECT SYS INTEG·Filed 2013·Granted Nov 19, 2013·0 cites·7 claims
- 1248US2014206153A1Method for fabricating solder columns for a column grid array packageBAE SYS INF & ELECT SYS INTEG·Filed 2014·Application pending·0 cites
- 1345US8519527B2Isostress grid array and method of fabrication thereofHUGHES JOHN A·Filed 2010·Granted Aug 27, 2013·0 cites·15 claims
- 1444US2014175675A1Devices and methods for stacking individually tested devices to form multi-chip electronic modulesBAE SYS INF & ELECT SYS INTEG·Filed 2014·Application pending·0 cites
- 1542US11894286B2Hermetically sealed electronics module with enhanced cooling of core integrated circuitBAE SYS INF & ELECT SYS INTEG·Filed 2019·Granted Feb 6, 2024·0 cites·15 claims
- 1642US8723323B2Method for fabricating solder columns for a column grid array packageMCINTYRE THOMAS J·Filed 2012·Granted May 13, 2014·0 cites·16 claims
- 1739US6544879B2Insitu radiation protection of integrated circuitsBAE SYSTEMS INFORMATION & ELEC·Filed 2002·Granted Apr 8, 2003·0 cites·12 claims
- 1838US8697457B1Devices and methods for stacking individually tested devices to form multi-chip electronic modulesSTURCKEN KEITH K·Filed 2012·Granted Apr 15, 2014·0 cites·15 claims
- 1937US9859178B2Packaging for high-power microwave moduleBAE SYS INF & ELECT SYS INTEG·Filed 2015·Granted Jan 2, 2018·0 cites·7 claims
- 2034US6492254B2Ball grid array (BGA) to column grid array (CGA) conversion processBAE SYSTEMS INFORMATION·Filed 2001·Granted Dec 10, 2002·1 cites·20 claims
- 2134US2005078436A1Method for stacking chips within a multichip module packageFiled 2003·Application pending·0 cites
- 2234US2003178715A1Method for stacking chips within a multichip module packageBAE SYSTEMS·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →