Devices and methods for stacking individually tested devices to form multi-chip electronic modules

Abstract

A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.

What is claimed is: 
     
         1 . An electronic module comprising:
 a plurality of devices; and   a plurality of substrates attached to the plurality of devices wherein the plurality of devices is tested prior to stacking at least six devices to form the electronic module.   
     
     
         2 . The electronic module of  claim 1  wherein a first substrate is electrically connected to a second substrate using at least one via. 
     
     
         3 . The electronic module of  claim 1  wherein at least one device is connected to at least one substrate using a flip chip connection. 
     
     
         4 . The electronic module of  claim 1  wherein at least one layer of conductive material is disposed onto at least one surface of at least one substrate. 
     
     
         5 . The electronic module of  claim 1  wherein the plurality of devices are dies. 
     
     
         6 . The electronic module of  claim 1  further comprising a hermetically sealed package wherein the plurality of stacked devices is disposed within the hermetically sealed package.