Inventor · disambiguated record
Young-Hoon Ro
Also filed as: RO YOUNG-HOON
10 granted patents·3 pending applications·181 citations·filing 2001–2015
90Inventor score
Top patents by PatentIndex Score
13 records- 0194US6891259B2Semiconductor package having dam and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 10, 2005·80 cites·5 claims
- 0287US7855895B2Universal PCB and smart card using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Dec 21, 2010·13 cites·14 claims
- 0386US7630209B2Universal PCB and smart card using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 8, 2009·13 cites·15 claims
- 0481US9502341B2Printed circuit board and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 22, 2016·4 cites·14 claims
- 0577US6518660B2Semiconductor package with ground projectionsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 11, 2003·25 cites·15 claims
- 0672US8274144B2Helical springs electrical connecting a plurality of packagesRO YOUNG-HOON·Filed 2011·Granted Sep 25, 2012·5 cites·14 claims
- 0769US7579583B2Solid-state imaging apparatus, wiring substrate and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 25, 2009·16 cites·60 claims
- 0867US7405760B2Image pickup device with non-molded DSP chip and manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 29, 2008·15 cites·18 claims
- 0961US6608380B2Semiconductor chip package having one or more sealing screwsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 19, 2003·10 cites·15 claims
- 1042US2007015338A1Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1141US8446018B2Package on packageKIM WOO-JAE·Filed 2011·Granted May 21, 2013·0 cites·20 claims
- 1239US2003085475A1Semiconductor package having dam and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Application pending·0 cites
- 1332US2009315130A1Solid-state imaging apparatus and method for manufacturing the sameRO YOUNG-HOON·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →