Inventor · disambiguated record
John J. Budnaitis
Also filed as: BUDNAITIS JOHN J
12 granted patents·1 pending application·661 citations·filing 1996–1998
94Inventor score
Files withGORE & ASS11
Top patents by PatentIndex Score
13 records- 0195US5896038AMethod of wafer level burn-inGORE & ASS·Filed 1996·Granted Apr 20, 1999·169 cites·11 claims
- 0293US5886535AWafer level burn-in base unit substrate and assemblyGORE & ASS·Filed 1996·Granted Mar 23, 1999·109 cites·92 claims
- 0389US5766979AWafer level contact sheet and method of assemblyGORE & ASS·Filed 1996·Granted Jun 16, 1998·99 cites·33 claims
- 0484US6011697AConstraining ring for use in electronic packagingGORE & ASS·Filed 1998·Granted Jan 4, 2000·43 cites·17 claims
- 0576US6184589B1Constraining ring for use in electronic packagingFiled 1998·Granted Feb 6, 2001·39 cites·7 claims
- 0672US5966022AWafer level burn-in systemGORE & ASS·Filed 1996·Granted Oct 12, 1999·35 cites·126 claims
- 0769US5966593AMethod of forming a wafer level contact sheet having a permanent z-axis materialGORE & ASS·Filed 1996·Granted Oct 12, 1999·39 cites·57 claims
- 0867US6313411B1Wafer level contact sheet and method of assemblyGORE & ASS·Filed 1997·Granted Nov 6, 2001·30 cites·56 claims
- 0966US6046060AMethod of making a high planarity, low CTE base for semiconductor reliability screeningGORE & ASS·Filed 1998·Granted Apr 4, 2000·29 cites·43 claims
- 1065US5830565AHigh planarity and low thermal coefficient of expansion base for semi-conductor reliability screeningGORE & ASS·Filed 1996·Granted Nov 3, 1998·26 cites·42 claims
- 1164US5909123AMethod for performing reliability screening and burn-in of semi-conductor wafersGORE & ASS·Filed 1996·Granted Jun 1, 1999·32 cites·18 claims
- 1249US5879786AConstraining ring for use in electronic packagingGORE & ASS·Filed 1996·Granted Mar 9, 1999·11 cites·6 claims
- 1327US2002021138A1Method of wafer level burn-inFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →