Inventor · disambiguated record
Shohei Tagami
Also filed as: TAGAMI SHOHEI
33 granted patents·6 pending applications·97 citations·filing 2007–2021
95Inventor score
Top patents by PatentIndex Score
39 records- 0197US8715905B2Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the methodSHINETSU CHEMICAL CO·Filed 2013·Granted May 6, 2014·24 cites·6 claims
- 0293US10128143B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Nov 13, 2018·9 cites·15 claims
- 0391US9646868B2Wafer temporary bonding method and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2015·Granted May 9, 2017·7 cites·13 claims
- 0489US7638259B2Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the compositionSHINETSU CHEMICAL CO·Filed 2007·Granted Dec 29, 2009·8 cites·11 claims
- 0588US9934996B2Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 3, 2018·5 cites·12 claims
- 0687US8999817B2Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Apr 7, 2015·7 cites·44 claims
- 0783US8673537B2Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said compositionFURUYA MASAHIRO·Filed 2010·Granted Mar 18, 2014·4 cites·18 claims
- 0883US8263308B2Polyimide silicone, photosensitive resin composition containing the novel polyimide silicone, and method for pattern formationTAGAMI SHOHEI·Filed 2010·Granted Sep 11, 2012·6 cites·10 claims
- 0980US9263333B2Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Feb 16, 2016·4 cites·21 claims
- 1079US10115622B2Wafer processing laminate and method for processing waferSHINETSU CHEMICAL CO·Filed 2016·Granted Oct 30, 2018·2 cites·14 claims
- 1179US7781541B2Polyimide silicone resin and thermosetting composition comprising the sameSHINETSU CHEMICAL CO·Filed 2007·Granted Aug 24, 2010·3 cites·12 claims
- 1276US9653335B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodKATO HIDETO·Filed 2012·Granted May 16, 2017·4 cites·7 claims
- 1374US10242902B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Mar 26, 2019·2 cites·15 claims
- 1471US9096032B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2013·Granted Aug 4, 2015·2 cites·23 claims
- 1570US8785585B2Temporary adhesive composition, and method of producing thin waferFURUYA MASAHIRO·Filed 2012·Granted Jul 22, 2014·2 cites·9 claims
- 1670US8735264B2Temporary adhesive composition and method for manufacturing thin wafer using the sameSHINETSU CHEMICAL CO·Filed 2012·Granted May 27, 2014·2 cites·10 claims
- 1765US10106713B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Oct 23, 2018·1 cites·21 claims
- 1865US9472438B2Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Oct 18, 2016·1 cites·28 claims
- 1964US9458365B2Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the sameSHINETSU CHEMICAL CO·Filed 2014·Granted Oct 4, 2016·1 cites·18 claims
- 2064US9365681B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2012·Granted Jun 14, 2016·1 cites·15 claims
- 2164US9334424B2Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted May 10, 2016·1 cites·20 claims
- 2264US8048978B2Silphenylene compound and process for producing the sameSHINETSU CHEMICAL CO·Filed 2008·Granted Nov 1, 2011·0 cites·4 claims
- 2361US8748293B2Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the sameFURUYA MASAHIRO·Filed 2012·Granted Jun 10, 2014·1 cites·15 claims
- 2456US10991611B2Wafer processing laminate and method for processing waferSHINETSU CHEMICAL CO·Filed 2018·Granted Apr 27, 2021·0 cites·13 claims
- 2555US8252882B2Polyimide resin produced by using silphenylene compoundSUGO MICHIHIRO·Filed 2011·Granted Aug 28, 2012·0 cites·5 claims
- 2654US12187989B2Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrateSHINETSU CHEMICAL CO·Filed 2020·Granted Jan 7, 2025·0 cites·4 claims
- 2754US2014261978A1Temporary adhesive composition, and method of producing thin waferSHINETSU CHEMICAL CO·Filed 2014·Application pending·0 cites
- 2853US11970639B2Temporary adhesive for wafer processing, wafer laminate and method for producing thin waferSHINETSU CHEMICAL CO·Filed 2021·Granted Apr 30, 2024·0 cites·7 claims
- 2948US12322637B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2020·Granted Jun 3, 2025·0 cites·15 claims
- 3047US2017330803A1Wafer processing laminate, method for manufacturing thereof, and method for checking coverage of organic film on waferSHINETSU CHEMICAL CO·Filed 2017·Application pending·0 cites
- 3146US10854496B2Circuit substrate processing laminate and method for processing circuit substrateSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 1, 2020·0 cites·16 claims
- 3246US9063421B2Chemically amplified positive resist composition and pattern forming processSHINETSU CHEMICAL CO·Filed 2014·Granted Jun 23, 2015·0 cites·8 claims
- 3345US2011311788A1Silphenylene-containing photocurable composition, pattern formation method using same, and optical semiconductor element obtained using the methodTAGAMI SHOHEI·Filed 2011·Application pending·0 cites
- 3445US2023002647A1Wafer processing temporary adhesive, wafer laminate, thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 3544US2023178412A1Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processingSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 3643US2013129988A1Chemically amplified positive resist composition and pattern forming processSHINETSU CHEMICAL CO·Filed 2012·Application pending·0 cites
- 3742US10147632B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2016·Granted Dec 4, 2018·0 cites·19 claims
- 3842US9887118B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Feb 6, 2018·0 cites·20 claims
- 3942US8487062B2Polyimidesilicone having alcoholic hydroxyl group and process for producing the sameSUGO MICHIHIRO·Filed 2010·Granted Jul 16, 2013·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →