Assignee
KATO HIDETO
JP·2 granted patents·8 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0186US8785114B2Method for manufacturing micro-structureKATO HIDETO·Filed 2011·Granted Jul 22, 2014·4 cites·8 claims
- 0276US9653335B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodKATO HIDETO·Filed 2012·Granted May 16, 2017·4 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when KATO HIDETO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →