Inventor · disambiguated record
Oliver Wutz
Also filed as: WUTZ OLIVER
13 granted patents·1 pending application·39 citations·filing 2000–2023
89Inventor score
Top patents by PatentIndex Score
14 records- 0195US8723192B2Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor componentWEIDNER KARL·Filed 2010·Granted May 13, 2014·19 cites·6 claims
- 0285US12002901B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2023·Granted Jun 4, 2024·0 cites·16 claims
- 0382US9490396B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2015·Granted Nov 8, 2016·2 cites·14 claims
- 0478US11749776B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2021·Granted Sep 5, 2023·0 cites·17 claims
- 0578US9985171B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Granted May 29, 2018·1 cites·14 claims
- 0678US9209328B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted Dec 8, 2015·2 cites·15 claims
- 0773US11239386B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2020·Granted Feb 1, 2022·0 cites·10 claims
- 0866US10665747B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2018·Granted May 26, 2020·0 cites·8 claims
- 0966US6364751B1Method for singling semiconductor components and semiconductor component singling deviceINFINEON TECHNOLOGIES AG·Filed 2000·Granted Apr 2, 2002·11 cites·16 claims
- 1062US8461604B2Optoelectronic module having a carrier substrate and a plurality of radiation-emitting semiconductor componentsBRAUNE BERT·Filed 2009·Granted Jun 11, 2013·2 cites·9 claims
- 1160US9728683B2Optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2016·Granted Aug 8, 2017·0 cites·19 claims
- 1248US2014030829A1Optoelectronic Module Having a Carrier Substrate and a Plurality of Radiation-Emitting Semiconductor Components and Method for the Production ThereofBRAUNE BERT·Filed 2013·Application pending·0 cites
- 1345US6312962B1Method for COB mounting of electronic chips on a circuit boardINFINEON TECHNOLOGIES AG·Filed 2000·Granted Nov 6, 2001·2 cites·7 claims
- 1437US8847247B2Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereofWEIDNER KARL·Filed 2010·Granted Sep 30, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →