Assignee
WEIDNER KARL
DE·7 granted patents·5 pending applications·40 citations·filing 2005–2011
Top patents by PatentIndex Score
12 records- 0195US8723192B2Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor componentWEIDNER KARL·Filed 2010·Granted May 13, 2014·19 cites·6 claims
- 0288US8901592B2Optoelectronic component and method for producing itWEIDNER KARL·Filed 2011·Granted Dec 2, 2014·11 cites·16 claims
- 0383US9159889B2Radiation-emitting component and method for producing radiation-emitting componentsWEIDNER KARL·Filed 2011·Granted Oct 13, 2015·7 cites·6 claims
- 0469US9105771B2Method for producing at least one optoelectronic semiconductor componentWEIDNER KARL·Filed 2011·Granted Aug 11, 2015·3 cites·12 claims
- 0545US8846456B2Method and apparatus for manufacturing an electronic module, and electronic moduleWEIDNER KARL·Filed 2007·Granted Sep 30, 2014·0 cites·21 claims
- 0642US2009109024A1Hardware Protection System For Deep-Drawn Printed Circuit Boards, As Half-ShellsWEIDNER KARL·Filed 2005·Application pending·0 cites
- 0741US8809180B2Producing SiC packs on a wafer planeWEIDNER KARL·Filed 2005·Granted Aug 19, 2014·0 cites·6 claims
- 0838US2013193470A1Optoelectronic Component and Method for Producing an Optoelectronic ComponentWEIDNER KARL·Filed 2011·Application pending·0 cites
- 0938US2008191360A1Adhesive Strip Conductor on an Insulating LayerWEIDNER KARL·Filed 2005·Application pending·0 cites
- 1037US8847247B2Optoelectronic module comprising at least one first semiconductor body having a radiation outlet side and an insulation layer and method for the production thereofWEIDNER KARL·Filed 2010·Granted Sep 30, 2014·0 cites·10 claims
- 1137US2012228663A1Optoelectronic Component Having a Semiconductor Body, an Insulating Layer, and a Planar Conductor Structure, and Method for the Production thereofWEIDNER KARL·Filed 2010·Application pending·0 cites
- 1236US2012228666A1Optoelectronic ModuleWEIDNER KARL·Filed 2010·Application pending·0 cites
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