Inventor · disambiguated record
Hisao Kawasaki
Also filed as: KAWASAKI HISAO
26 granted patents·9 pending applications·504 citations·filing 1991–2024
96Inventor score
Top patents by PatentIndex Score
35 records- 0195US5382540AProcess for forming an electrically programmable read-only memory cellMOTOROLA INC·Filed 1993·Granted Jan 17, 1995·111 cites·9 claims
- 0287US5420072AMethod for forming a conductive interconnect in an integrated circuitMOTOROLA INC·Filed 1994·Granted May 30, 1995·101 cites·20 claims
- 0386US8587094B2Semiconductor device using a compound semiconductor subtrateKAWASAKI HISAO·Filed 2011·Granted Nov 19, 2013·8 cites·4 claims
- 0478US2024425916A1Systems and methods for measurement and sequencing of bio-moleculesILLUMINA CAMBRIDGE LTD·Filed 2024·Application pending·0 cites
- 0576US5358901AProcess for forming an intermetallic layerMOTOROLA INC·Filed 1993·Granted Oct 25, 1994·53 cites·36 claims
- 0674US5506450ASemiconductor device with improved electromigration resistance and method for making the sameMOTOROLA INC·Filed 1995·Granted Apr 9, 1996·47 cites·26 claims
- 0772US8253169B2Semiconductor device and manufacturing method for semiconductor deviceKAWASAKI HISAO·Filed 2009·Granted Aug 28, 2012·5 cites·6 claims
- 0870US7622776B2Semiconductor deviceTOSHIBA KK·Filed 2007·Granted Nov 24, 2009·4 cites·10 claims
- 0970US5393703AProcess for forming a conductive layer for semiconductor devicesMOTOROLA INC·Filed 1993·Granted Feb 28, 1995·37 cites·20 claims
- 1069US7888713B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2007·Granted Feb 15, 2011·4 cites·7 claims
- 1166US5240558AMethod for forming a semiconductor deviceMOTOROLA INC·Filed 1992·Granted Aug 31, 1993·37 cites·19 claims
- 1264US5190893AProcess for fabricating a local interconnect structure in a semiconductor deviceMOTOROLA INC·Filed 1991·Granted Mar 2, 1993·33 cites·14 claims
- 1362US8159027B2Semiconductor deviceKAWASAKI HISAO·Filed 2009·Granted Apr 17, 2012·2 cites·5 claims
- 1461US12091712B2Systems and methods for measurement and sequencing of bio-moleculesILLUMINA CAMBRIDGE LTD·Filed 2018·Granted Sep 17, 2024·0 cites·20 claims
- 1561US8735943B2Semiconductor device with recess having inclined sidewall and method for manufacturing the sameSENDA RYOTA·Filed 2012·Granted May 27, 2014·2 cites·11 claims
- 1661US8030691B2Semiconductor device and manufacturing method thereforTOSHIBA KK·Filed 2008·Granted Oct 4, 2011·2 cites·14 claims
- 1758US7829919B2Semiconductor deviceTOSHIBA KK·Filed 2009·Granted Nov 9, 2010·1 cites·11 claims
- 1857US5593919AProcess for forming a semiconductor device including conductive membersMOTOROLA INC·Filed 1995·Granted Jan 14, 1997·24 cites·21 claims
- 1954US2014209924A1Semiconductor device and manufacturing method for the sameTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2053US2013313563A1Semiconductor device and manufacturing method for the sameTOSHIBA KK·Filed 2013·Application pending·0 cites
- 2152US8084793B2Microwave semiconductor device using compound semiconductor and method for manufacturing the sameKAWASAKI HISAO·Filed 2009·Granted Dec 27, 2011·0 cites·9 claims
- 2250US2014231997A1Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2013·Application pending·0 cites
- 2349US2008230823A1Semiconductor device and manufacturing method thereforTOSHIBA KK·Filed 2008·Application pending·0 cites
- 2448US9269619B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2015·Granted Feb 23, 2016·0 cites·2 claims
- 2547US2010252863A1Semiconductor device and manufacturing method for the sameTOSHIBA KK·Filed 2010·Application pending·0 cites
- 2646US8338866B2Microwave semiconductor device using compound semiconductor and method for manufacturing the sameKAWASAKI HISAO·Filed 2011·Granted Dec 25, 2012·0 cites·5 claims
- 2744US7595531B2Semiconductor deviceTOSHIBA KK·Filed 2007·Granted Sep 29, 2009·0 cites·7 claims
- 2843US6218733B1Semiconductor device having a titanium-aluminum compoundMOTOROLA INC·Filed 1994·Granted Apr 17, 2001·11 cites·6 claims
- 2943US5317185ASemiconductor device having structures to reduce stress notching effects in conductive lines and method for making the sameMOTOROLA INC·Filed 1992·Granted May 31, 1994·14 cites·8 claims
- 3042US8307319B2Integrated circuit reliabilityKAWASAKI HISAO·Filed 2007·Granted Nov 6, 2012·0 cites·17 claims
- 3142US8202798B2Improvements for reducing electromigration effect in an integrated circuitBRAECKELMANN GREG·Filed 2007·Granted Jun 19, 2012·0 cites·20 claims
- 3238US5623166AAl-Ni-Cr conductive layer for semiconductor devicesMOTOROLA INC·Filed 1994·Granted Apr 22, 1997·8 cites·10 claims
- 3336US2013037850A1Semiconductor light-emitting element, protective film of semiconductor light-emitting element, and method for fabricating sameMITSUBISHI HEAVY IND LTD·Filed 2011·Application pending·0 cites
- 3435US2010252864A1Semiconductor device and manufacturing method for the sameTOSHIBA KK·Filed 2010·Application pending·0 cites
- 3531US2013049063A1Semiconductor light-emitting element, protective film for semiconductor light-emitting element, and process for production of the protective filmKAFUKU HIDETAKA·Filed 2011·Application pending·0 cites
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