Inventor · disambiguated record
Gopalakrishna B. Prabhu
Also filed as: PRABHU GOPALAKRISHNA · PRABHU GOPALAKRISHNA B
29 granted patents·11 pending applications·670 citations·filing 1998–2025
97Inventor score
Files withAPPLIED MATERIALS INC28PETTI CHRISTOPHER J2SHANMUGASUNDRAM ARULKUMAR P2GAJARIA DHRUV1GTAT CORP1
Top patents by PatentIndex Score
40 records- 0196US6361420B1Method of chemical mechanical polishing with edge controlAPPLIED MATERIALS INC·Filed 2000·Granted Mar 26, 2002·55 cites·3 claims
- 0295US6132298ACarrier head with edge control for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1998·Granted Oct 17, 2000·118 cites·32 claims
- 0393US7553214B2Polishing article with integrated window stripeAPPLIED MATERIALS INC·Filed 2007·Granted Jun 30, 2009·23 cites·10 claims
- 0493US7160739B2Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profilesAPPLIED MATERIALS INC·Filed 2001·Granted Jan 9, 2007·58 cites·28 claims
- 0592US8173452B1Method to form a device by constructing a support element on a thin semiconductor laminaPETTI CHRISTOPHER J·Filed 2010·Granted May 8, 2012·9 cites·28 claims
- 0691US8101451B1Method to form a device including an annealed lamina and having amorphous silicon on opposing facesMURALI VENKATESAN·Filed 2010·Granted Jan 24, 2012·13 cites·14 claims
- 0790US8388412B2Retaining ring with shaped profilePRABHU GOPALAKRISHNA B·Filed 2011·Granted Mar 5, 2013·16 cites·13 claims
- 0889US8070909B2Feedback control of chemical mechanical polishing device providing manipulation of removal rate profilesSHANMUGASUNDRAM ARULKUMAR P·Filed 2006·Granted Dec 6, 2011·13 cites·16 claims
- 0988US6220942B1CMP platen with patterned surfaceAPPLIED MATERIALS INC·Filed 1999·Granted Apr 24, 2001·73 cites·26 claims
- 1088US6217426B1CMP polishing padAPPLIED MATERIALS INC·Filed 1999·Granted Apr 17, 2001·83 cites·44 claims
- 1187US6575825B2CMP polishing padAPPLIED MATERIALS INC·Filed 2001·Granted Jun 10, 2003·49 cites·23 claims
- 1286US8694145B2Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profilesSHANMUGASUNDRAM ARULKUMAR P·Filed 2011·Granted Apr 8, 2014·6 cites·20 claims
- 1386US7601050B2Polishing apparatus with grooved subpadAPPLIED MATERIALS INC·Filed 2007·Granted Oct 13, 2009·11 cites·14 claims
- 1483US8033895B2Retaining ring with shaped profileAPPLIED MATERIALS INC·Filed 2007·Granted Oct 11, 2011·7 cites·14 claims
- 1582US7063597B2Polishing processes for shallow trench isolation substratesAPPLIED MATERIALS INC·Filed 2003·Granted Jun 20, 2006·30 cites·14 claims
- 1681US7179159B2Materials for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Feb 20, 2007·8 cites·17 claims
- 1780US11768984B2Parameter sensing and computer modeling for gas delivery health monitoringAPPLIED MATERIALS INC·Filed 2020·Granted Sep 26, 2023·1 cites·19 claims
- 1880US7908743B2Method for forming an electrical connectionAPPLIED MATERIALS INC·Filed 2009·Granted Mar 22, 2011·7 cites·19 claims
- 1974US7841925B2Polishing article with integrated window stripeAPPLIED MATERIALS INC·Filed 2009·Granted Nov 30, 2010·3 cites·20 claims
- 2074US6677239B2Methods and compositions for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jan 13, 2004·16 cites·33 claims
- 2173US6220941B1Method of post CMP defect stability improvementAPPLIED MATERIALS INC·Filed 1998·Granted Apr 24, 2001·35 cites·21 claims
- 2272US8231431B2Solar panel edge deletion moduleGAJARIA DHRUV·Filed 2009·Granted Jul 31, 2012·7 cites·19 claims
- 2372US2025224228A1System and method to map thickness variations of substrates in manufacturing systemsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2471US8349626B2Creation of low-relief texture for a photovoltaic cellGTAT CORP·Filed 2010·Granted Jan 8, 2013·1 cites·19 claims
- 2571US7429210B2Materials for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 30, 2008·3 cites·18 claims
- 2670US6592438B2CMP platen with patterned surfaceAPPLIED MATERIALS INC·Filed 2001·Granted Jul 15, 2003·19 cites·10 claims
- 2769US12276490B2System and method to map thickness variations of substrates in manufacturing systemsAPPLIED MATERIALS INC·Filed 2022·Granted Apr 15, 2025·0 cites·24 claims
- 2866US8518724B2Method to form a device by constructing a support element on a thin semiconductor laminaPETTI CHRISTOPHER J·Filed 2012·Granted Aug 27, 2013·0 cites·20 claims
- 2965US2025010431A1Polishing fluid recovery and reuse system for semiconductor substrate processingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3057US2014237905A1Method of forming polishing sheetAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 3152US6558236B2Method and apparatus for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted May 6, 2003·5 cites·29 claims
- 3251US2010112919A1Monolithic linear polishing sheetAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3350US2012080083A1Semiconductor assembly with a metal oxide layer having intermediate refractive indexLIANG KATHY J·Filed 2010·Application pending·0 cites
- 3446US2009088051A1Leader and trailer for linear polishing sheetAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 3544US2008182413A1Selective chemistry for fixed abrasive cmpMENK GREGORY E·Filed 2007·Application pending·0 cites
- 3642US2007212976A1Smart polishing media assembly for planarizing substratesAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 3741US7040966B2Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafersIBM·Filed 2004·Granted May 9, 2006·1 cites·20 claims
- 3841US2012021671A1Real-time monitoring of retaining ring thickness and lifetimeMCREYNOLDS PETER·Filed 2010·Application pending·0 cites
- 3938US2004053566A1CMP platen with patterned surfaceAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
- 4037US2004072518A1Platen with patterned surface for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Application pending·0 cites
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