Inventor · disambiguated record
Wen-Chiang Tu
Also filed as: TU WEN-CHIANG
39 granted patents·22 pending applications·389 citations·filing 1996–2019
97Inventor score
Top patents by PatentIndex Score
61 records- 0196US9281253B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2013·Granted Mar 8, 2016·28 cites·13 claims
- 0294US9005999B2Temperature control of chemical mechanical polishingXU KUN·Filed 2012·Granted Apr 14, 2015·22 cites·25 claims
- 0394US8039397B2Using optical metrology for within wafer feed forward process controlAPPLIED MATERIALS INC·Filed 2009·Granted Oct 18, 2011·20 cites·24 claims
- 0493US9636797B2Adjusting eddy current measurementsAPPLIED MATERIALS INC·Filed 2014·Granted May 2, 2017·11 cites·19 claims
- 0593US9067295B2Monitoring retaining ring thickness and pressure controlAPPLIED MATERIALS INC·Filed 2013·Granted Jun 30, 2015·13 cites·18 claims
- 0693US8292693B2Using optical metrology for wafer to wafer feed back process controlDAVID JEFFREY DRUE·Filed 2009·Granted Oct 23, 2012·16 cites·24 claims
- 0791US7323416B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jan 29, 2008·20 cites·20 claims
- 0888US9023667B2High sensitivity eddy current monitoring systemIRAVANI HASSAN G·Filed 2011·Granted May 5, 2015·11 cites·13 claims
- 0986US9205527B2In-situ monitoring system with monitoring of elongated regionAPPLIED MATERIALS INC·Filed 2013·Granted Dec 8, 2015·7 cites·19 claims
- 1085US10103073B2Inductive monitoring of conductive trench depthAPPLIED MATERIALS INC·Filed 2017·Granted Oct 16, 2018·3 cites·15 claims
- 1185US9754846B2Inductive monitoring of conductive trench depthAPPLIED MATERIALS INC·Filed 2014·Granted Sep 5, 2017·5 cites·23 claims
- 1283US6372633B1Method and apparatus for forming metal interconnectsAPPLIED MATERIALS INC·Filed 1998·Granted Apr 16, 2002·58 cites·10 claims
- 1381US8860932B2Detection of layer clearing using spectral monitoringZHANG JIMIN·Filed 2011·Granted Oct 14, 2014·5 cites·21 claims
- 1480US8679979B2Using optical metrology for within wafer feed forward process controlDAVID JEFFREY DRUE·Filed 2011·Granted Mar 25, 2014·3 cites·16 claims
- 1578US9911664B2Substrate features for inductive monitoring of conductive trench depthAPPLIED MATERIALS INC·Filed 2014·Granted Mar 6, 2018·3 cites·15 claims
- 1678US9186774B2X-ray metrology for control of polishingAPPLIED MATERIALS INC·Filed 2013·Granted Nov 17, 2015·3 cites·20 claims
- 1777US6153530APost-etch treatment of plasma-etched feature surfaces to prevent corrosionAPPLIED MATERIALS INC·Filed 1999·Granted Nov 28, 2000·58 cites·30 claims
- 1875US10556315B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2019·Granted Feb 11, 2020·1 cites·19 claims
- 1973US10589397B2Endpoint control of multiple substrate zones of varying thickness in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Granted Mar 17, 2020·1 cites·16 claims
- 2072US6199927B1Robot blade for handling of semiconductor substratesAPPLIED MATERIALS INC·Filed 1999·Granted Mar 13, 2001·37 cites·30 claims
- 2171US8694144B2Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingDUBOUST ALAIN·Filed 2010·Granted Apr 8, 2014·2 cites·13 claims
- 2270US10207386B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2016·Granted Feb 19, 2019·1 cites·16 claims
- 2370US9248544B2Endpoint detection during polishing using integrated differential intensityZHANG JIMIN·Filed 2012·Granted Feb 2, 2016·2 cites·15 claims
- 2469US9472475B2Feedback control using detection of clearance and adjustment for uniform topographyAPPLIED MATERIALS INC·Filed 2013·Granted Oct 18, 2016·2 cites·19 claims
- 2568US6024393ARobot blade for handling of semiconductor substrateAPPLIED MATERIALS INC·Filed 1996·Granted Feb 15, 2000·33 cites·8 claims
- 2666US6872128B1System, method and apparatus for applying liquid to a CMP polishing padLAM RES CORP·Filed 2003·Granted Mar 29, 2005·10 cites·23 claims
- 2764US9496190B2Feedback of layer thickness timing and clearance timing for polishing controlAPPLIED MATERIALS INC·Filed 2015·Granted Nov 15, 2016·1 cites·21 claims
- 2864US8586481B2Chemical planarization of copper wafer polishingWANG YOU·Filed 2011·Granted Nov 19, 2013·2 cites·8 claims
- 2963US8989890B2GST film thickness monitoringXU KUN·Filed 2010·Granted Mar 24, 2015·1 cites·17 claims
- 3062US9073169B2Feedback control of polishing using optical detection of clearanceXU KUN·Filed 2011·Granted Jul 7, 2015·2 cites·26 claims
- 3161US10741459B2Inductive monitoring of conductive loopsAPPLIED MATERIALS INC·Filed 2018·Granted Aug 11, 2020·0 cites·19 claims
- 3260US8579675B2Methods of using optical metrology for feed back and feed forward process controlDAVID JEFFREY DRUE·Filed 2009·Granted Nov 12, 2013·0 cites·25 claims
- 3359US8639377B2Metrology for GST film thickness and phaseXU KUN·Filed 2008·Granted Jan 28, 2014·1 cites·32 claims
- 3457US6544887B1Polycide etch processLAM RES CORP·Filed 2000·Granted Apr 8, 2003·7 cites·16 claims
- 3556US2010130013A1Slurry composition for gst phase change memory materials polishingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 3655US10199281B2Substrate features for inductive monitoring of conductive trench depthAPPLIED MATERIALS INC·Filed 2018·Granted Feb 5, 2019·0 cites·12 claims
- 3755US2014222188A1Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 3853US9296084B2Polishing control using weighting with default sequenceZHANG JIMIN·Filed 2012·Granted Mar 29, 2016·0 cites·18 claims
- 3948US2010130101A1Two-line mixing of chemical and abrasive particles with endpoint control for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4046US10464184B2Modifying substrate thickness profilesAPPLIED MATERIALS INC·Filed 2014·Granted Nov 5, 2019·0 cites·19 claims
- 4146US2018056476A1Monitoring of polishing pad thickness for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 4246US2014141694A1In-Sequence Spectrographic SensorAPPLIED MATERIALS INC·Filed 2012·Application pending·0 cites
- 4346US2009061743A1Method of soft pad preparation to reduce removal rate ramp-up effect and to stabilize defect rateJEW STEPHEN·Filed 2008·Application pending·0 cites
- 4445US9275917B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2013·Granted Mar 1, 2016·0 cites·16 claims
- 4544US2012100781A1Multiple matching reference spectra for in-situ optical monitoringZHANG JIMIN·Filed 2011·Application pending·0 cites
- 4643US2014030956A1Control of polishing of multiple substrates on the same platen in chemical mechanical polishingZHANG JIMIN·Filed 2012·Application pending·0 cites
- 4742US8210900B2Dishing and defect control of chemical mechanical polishing using real-time adjustable additive deliveryTU WEN-CHIANG·Filed 2008·Granted Jul 3, 2012·0 cites·14 claims
- 4842US2012034844A1Spectrographic monitoring using index tracking after detection of layer clearingZHANG JIMIN·Filed 2010·Application pending·0 cites
- 4942US2014093987A1Residue Detection with Spectrographic SensorAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 5041US2014308814A1Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositionsAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →