Inventor · disambiguated record
Milind S. Bhagavat
Also filed as: BHAGAVAT MILIND · BHAGAVAT MILIND S
65 granted patents·7 pending applications·426 citations·filing 2002–2023
98Inventor score
Files withADVANCED MICRO DEVICES INC37APPLE INC9BHAGAVAT MILIND S7AGARWAL RAHUL5MEMC ELECTRONIC MATERIALS5
Top patents by PatentIndex Score
72 records- 0198US10727204B2Die stacking for multi-tier 3D integrationAGARWAL RAHUL·Filed 2018·Granted Jul 28, 2020·34 cites·21 claims
- 0297US11002572B2Optical encoder with direction-dependent optical properties comprising a spindle having an array of surface features defining a concave contour along a first direction and a convex contour along a second directionAPPLE INC·Filed 2020·Granted May 11, 2021·24 cites·20 claims
- 0397US10937755B2Bond pads for low temperature hybrid bondingADVANCED MICRO DEVICES INC·Filed 2018·Granted Mar 2, 2021·34 cites·16 claims
- 0497US10655988B2Watch with rotatable optical encoder having a spindle defining an array of alternating regions extending along an axial direction parallel to the axis of a shaftAPPLE INC·Filed 2018·Granted May 19, 2020·23 cites·20 claims
- 0597US10510721B2Molded chip combinationBHAGAVAT MILIND S·Filed 2017·Granted Dec 17, 2019·32 cites·20 claims
- 0697US10145711B2Optical encoder with direction-dependent optical properties having an optically anisotropic region to produce a first and a second light distributionAPPLE INC·Filed 2016·Granted Dec 4, 2018·62 cites·24 claims
- 0796US11855061B2Offset-aligned three-dimensional integrated circuitADVANCED MICRO DEVICES INC·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
- 0896US10593628B2Molded die last chip combinationBHAGAVAT MILIND S·Filed 2018·Granted Mar 17, 2020·15 cites·20 claims
- 0995US10312221B1Stacked dies and dummy components for improved thermal performanceAGARWAL RAHUL·Filed 2017·Granted Jun 4, 2019·31 cites·22 claims
- 1095US9305959B2Biometric sensor chip having distributed sensor and control circuitryAPPLE INC·Filed 2014·Granted Apr 5, 2016·10 cites·13 claims
- 1194US10867978B2Integrated circuit module with integrated discrete devicesADVANCED MICRO DEVICES INC·Filed 2018·Granted Dec 15, 2020·8 cites·20 claims
- 1291US10529693B23D stacked dies with disparate interconnect footprintsAGARWAL RAHUL·Filed 2017·Granted Jan 7, 2020·8 cites·20 claims
- 1391US9236442B2Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connectionsBROADCOM CORP·Filed 2012·Granted Jan 12, 2016·13 cites·20 claims
- 1490US11804479B2Scheme for enabling die reuse in 3D stacked productsADVANCED MICRO DEVICES INC·Filed 2019·Granted Oct 31, 2023·5 cites·20 claims
- 1590US10923430B2High density cross link die with polymer routing layerADVANCED MICRO DEVICES INC·Filed 2019·Granted Feb 16, 2021·6 cites·18 claims
- 1690US10593620B2Fan-out package with multi-layer redistribution layer structureAGARWAL RAHUL·Filed 2018·Granted Mar 17, 2020·7 cites·14 claims
- 1789US12249519B2Molded chip package with anchor structuresADVANCED MICRO DEVICES INC·Filed 2022·Granted Mar 11, 2025·1 cites·19 claims
- 1889US10714462B2Multi-chip package with offset 3D structureBHAGAVAT MILIND S·Filed 2018·Granted Jul 14, 2020·5 cites·20 claims
- 1989US9883822B2Biometric sensor chip having distributed sensor and control circuitryAPPLE INC·Filed 2016·Granted Feb 6, 2018·11 cites·16 claims
- 2089US7927185B2Method for assessing workpiece nanotopology using a double side wafer grinderMEMC ELECTRONIC MATERIALS·Filed 2009·Granted Apr 19, 2011·12 cites·11 claims
- 2188US7601049B2Double side wafer grinder and methods for assessing workpiece nanotopologyMEMC ELECTRONIC MATERIALS·Filed 2006·Granted Oct 13, 2009·15 cites·28 claims
- 2286US11011466B2Integrated circuit package with integrated voltage regulatorADVANCED MICRO DEVICES INC·Filed 2019·Granted May 18, 2021·4 cites·9 claims
- 2386US10431517B2Arrangement and thermal management of 3D stacked diesWUU JOHN·Filed 2017·Granted Oct 1, 2019·6 cites·14 claims
- 2486US9679187B2Finger biometric sensor assembly including direct bonding interface and related methodsAPPLE INC·Filed 2015·Granted Jun 13, 2017·5 cites·26 claims
- 2584US11670624B2Integrated circuit module with integrated discrete devicesADVANCED MICRO DEVICES INC·Filed 2020·Granted Jun 6, 2023·1 cites·21 claims
- 2683US11810891B2Bond pads for low temperature hybrid bondingADVANCED MICRO DEVICES INC·Filed 2021·Granted Nov 7, 2023·1 cites·16 claims
- 2783US10943880B2Semiconductor chip with reduced pitch conductive pillarsADVANCED MICRO DEVICES INC·Filed 2019·Granted Mar 9, 2021·3 cites·19 claims
- 2882US11018125B2Multi-chip package with offset 3D structureADVANCED MICRO DEVICES INC·Filed 2020·Granted May 25, 2021·1 cites·22 claims
- 2979US10672712B2Multi-RDL structure packages and methods of fabricating the sameBHAGAVAT MILIND S·Filed 2018·Granted Jun 2, 2020·2 cites·21 claims
- 3079US7662023B2Double side wafer grinder and methods for assessing workpiece nanotopologyMEMC ELECTRONIC MATERIALS·Filed 2006·Granted Feb 16, 2010·10 cites·20 claims
- 3178US11367628B2Molded chip package with anchor structuresADVANCED MICRO DEVICES INC·Filed 2019·Granted Jun 21, 2022·2 cites·17 claims
- 3276US8267745B2Methods of grinding semiconductor wafers having improved nanotopologyBHAGAVAT MILIND S·Filed 2010·Granted Sep 18, 2012·3 cites·10 claims
- 3375US8593155B2MEMS in-plane resonatorsSPARKS ANDREW·Filed 2010·Granted Nov 26, 2013·2 cites·24 claims
- 3475US2024330196A1Gpu chiplets using high bandwidth crosslinksADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3574US12266585B2Arrangement and thermal management of 3D stacked diesADVANCED MICRO DEVICES INC·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 3673US11837588B2Circuit board with compact passive component arrangementADVANCED MICRO DEVICES INC·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 3772US9751756B2Method and system for CMOS based MEMS bump stop contact damage preventionAPPLE INC·Filed 2014·Granted Sep 5, 2017·1 cites·20 claims
- 3871US10573630B2Offset-aligned three-dimensional integrated circuitADVANCED MICRO DEVICES INC·Filed 2018·Granted Feb 25, 2020·1 cites·13 claims
- 3971US2024063206A1Scheme for enabling die reuse in 3d stacked productsADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 4070US11742301B2Fan-out package with reinforcing rivetsADVANCED MICRO DEVICES INC·Filed 2019·Granted Aug 29, 2023·1 cites·20 claims
- 4170US9123698B2Flexural plate wave device for chip coolingBHAGAVAT MILIND S·Filed 2011·Granted Sep 1, 2015·3 cites·22 claims
- 4269US11011495B2Multiple-die integrated circuit with integrated voltage regulatorADVANCED MICRO DEVICES INC·Filed 2018·Granted May 18, 2021·1 cites·17 claims
- 4367US11437359B2Offset-aligned three-dimensional integrated circuitADVANCED MICRO DEVICES INC·Filed 2020·Granted Sep 6, 2022·0 cites·18 claims
- 4467US8058144B2Method for capping a MEMS waferBHAGAVAT MILIND·Filed 2009·Granted Nov 15, 2011·6 cites·15 claims
- 4567US6613591B1Method of estimating post-polishing waviness characteristics of a semiconductor waferMEMC ELECTRONIC MATERIALS·Filed 2002·Granted Sep 2, 2003·12 cites·14 claims
- 4665US11841803B2GPU chiplets using high bandwidth crosslinksADVANCED MICRO DEVICES INC·Filed 2019·Granted Dec 12, 2023·0 cites·20 claims
- 4765US11715691B2Integrated circuit package with integrated voltage regulatorADVANCED MICRO DEVICES INC·Filed 2021·Granted Aug 1, 2023·0 cites·15 claims
- 4865US11676924B2Semiconductor chip with reduced pitch conductive pillarsADVANCED MICRO DEVICES INC·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 4965US8066553B2Wafer clamping device for a double side grinderBHAGAVAT MILIND S·Filed 2005·Granted Nov 29, 2011·2 cites·14 claims
- 5064US11211332B2Molded die last chip combinationADVANCED MICRO DEVICES INC·Filed 2020·Granted Dec 28, 2021·0 cites·20 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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