Inventor · disambiguated record
Stephen P. Ayotte
Also filed as: AYOTTE JR STEPHEN PETER · AYOTTE STEPHEN P · AYOTTE STEPHEN PETER
38 granted patents·4 pending applications·118 citations·filing 2007–2019
96Inventor score
Top patents by PatentIndex Score
42 records- 0197US9508680B1Induction heating for underfill removal and chip reworkGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 29, 2016·28 cites·16 claims
- 0296US9472490B1IC structure with recessed solder bump area and methods of forming sameGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 18, 2016·18 cites·17 claims
- 0388US9776270B2Chip joining by induction heatingGLOBALFOUNDRIES INC·Filed 2013·Granted Oct 3, 2017·7 cites·7 claims
- 0487US10200016B2Contactless readable programmable transponder to monitor chip joinIBM·Filed 2017·Granted Feb 5, 2019·3 cites·5 claims
- 0585US10601404B2Contactless readable programmable transponder to monitor chip joinIBM·Filed 2018·Granted Mar 24, 2020·2 cites·20 claims
- 0685US10245667B2Chip joining by induction heatingGLOBALFOUNDRIES INC·Filed 2017·Granted Apr 2, 2019·3 cites·8 claims
- 0785US9711422B2Visually detecting electrostatic discharge eventsGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 18, 2017·4 cites·19 claims
- 0885US8987010B1Microprocessor image correction and method for the detection of potential defectsIBM·Filed 2013·Granted Mar 24, 2015·10 cites·16 claims
- 0981US9190375B2Solder bump reflow by induction heatingIBM·Filed 2014·Granted Nov 17, 2015·6 cites·20 claims
- 1079US10309884B2Predicting semiconductor package warpageIBM·Filed 2017·Granted Jun 4, 2019·1 cites·20 claims
- 1177US9876487B2Contactless readable programmable transponder to monitor chip joinIBM·Filed 2013·Granted Jan 23, 2018·2 cites·10 claims
- 1277US9704830B1Semiconductor structure and method of makingIBM·Filed 2016·Granted Jul 11, 2017·2 cites·16 claims
- 1377US8829674B2Stacked multi-chip package and method of making sameIBM·Filed 2013·Granted Sep 9, 2014·4 cites·12 claims
- 1473US9548275B2Detecting sudden changes in acceleration in semiconductor device or semiconductor packaging containing semiconductor deviceGLOBALFOUNDRIES INC·Filed 2013·Granted Jan 17, 2017·4 cites·20 claims
- 1573US9230921B2Self-healing crack stop structureIBM·Filed 2013·Granted Jan 5, 2016·4 cites·14 claims
- 1671US9222707B2Temperature stabilization in semiconductors using the magnetocaloric effectIBM·Filed 2013·Granted Dec 29, 2015·3 cites·20 claims
- 1769US9105573B2Visually detecting electrostatic discharge eventsAYOTTE STEPHEN P·Filed 2012·Granted Aug 11, 2015·2 cites·21 claims
- 1867US11075619B2Contactless readable programmable transponder to monitor chip joinIBM·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 1966US8765593B2Controlled collapse chip connection (C4) structure and methods of formingAYOTTE STEPHEN P·Filed 2012·Granted Jul 1, 2014·2 cites·13 claims
- 2063US7939390B2Gap capacitors for monitoring stress in solder balls in flip chip technologyIBM·Filed 2010·Granted May 10, 2011·3 cites·10 claims
- 2162US9059097B2Inhibiting propagation of imperfections in semiconductor devicesAYOTTE STEPHEN P·Filed 2012·Granted Jun 16, 2015·1 cites·9 claims
- 2259US8426856B2Thermally sensitive material embedded in the substrateAYOTTE STEPHEN P·Filed 2010·Granted Apr 23, 2013·1 cites·17 claims
- 2358US8453843B1Tray for transporting semiconductor devices of a BGA typeAYOTTE JR STEPHEN PETER·Filed 2012·Granted Jun 4, 2013·2 cites·16 claims
- 2457US7709876B2Gap capacitors for monitoring stress in solder balls in flip chip technologyIBM·Filed 2008·Granted May 4, 2010·4 cites·10 claims
- 2556US8230903B2Low profile heat sink for semiconductor devicesAYOTTE STEPHEN P·Filed 2008·Granted Jul 31, 2012·2 cites·6 claims
- 2654US10605850B2Screening methodology to eliminate wire sweep in bond and assembly module packagingIBM·Filed 2016·Granted Mar 31, 2020·0 cites·20 claims
- 2754US9772268B2Predicting semiconductor package warpageIBM·Filed 2015·Granted Sep 26, 2017·0 cites·11 claims
- 2853US8017514B2Optically transparent wires for secure circuits and methods of making sameIBM·Filed 2008·Granted Sep 13, 2011·0 cites·14 claims
- 2951US7915732B2Production of integrated circuit chip packages prohibiting formation of micro solder ballsINTERNAT BUSINESS MAHINES CORP·Filed 2008·Granted Mar 29, 2011·0 cites·4 claims
- 3049US10429414B2Multiple contact probe head disassembly method and systemGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 1, 2019·0 cites·9 claims
- 3149US9470740B2Screening methodology to eliminate wire sweep in bond and assembly module packagingIBM·Filed 2013·Granted Oct 18, 2016·0 cites·13 claims
- 3246US10050012B2Method for semiconductor die removal reworkIBM·Filed 2015·Granted Aug 14, 2018·0 cites·13 claims
- 3346US9645573B2Reliability monitor test strategy definitionIBM·Filed 2014·Granted May 9, 2017·0 cites·20 claims
- 3446US7745256B2Rectangular-shaped controlled collapse chip connectionIBM·Filed 2008·Granted Jun 29, 2010·0 cites·5 claims
- 3546US2009218688A1Optimized passivation slope for solder connectionsIBM·Filed 2008·Application pending·0 cites
- 3645US7839002B2Partially underfilled solder grid arraysIBM·Filed 2008·Granted Nov 23, 2010·0 cites·8 claims
- 3744US9177931B2Reducing thermal energy transfer during chip-join processingIBM·Filed 2014·Granted Nov 3, 2015·0 cites·19 claims
- 3843US10256204B2Separation of integrated circuit structure from adjacent chipGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 9, 2019·0 cites·10 claims
- 3943US8207609B2Optically transparent wires for secure circuits and methods of making sameAYOTTE STEPHEN PETER·Filed 2011·Granted Jun 26, 2012·0 cites·14 claims
- 4043US2009155981A1Method and apparatus for singulating integrated circuit chipsAYOTTE STEPHEN P·Filed 2007·Application pending·0 cites
- 4141US2016079059A1Elliptical wafer manufactureIBM·Filed 2014·Application pending·0 cites
- 4239US2009279275A1Method of attaching an integrated circuit chip to a moduleAYOTTE STEPHEN PETER·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →