Inventor · disambiguated record
Yonghyuk Jeong
Also filed as: JEONG YONGHYUK
5 granted patents·3 pending applications·59 citations·filing 2011–2025
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0194US8816404B2Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulantKIM YOUNGJOON·Filed 2011·Granted Aug 26, 2014·53 cites·14 claims
- 0279US8546194B2Integrated circuit packaging system with interconnects and method of manufacture thereofCHOI JOONYOUNG·Filed 2011·Granted Oct 1, 2013·6 cites·20 claims
- 0361US2025125158A1Method for attaching a heat spreader to a semiconductor package and semiconductor package assembliesSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0454US9318380B2Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulantSTATS CHIPPAC LTD·Filed 2014·Granted Apr 19, 2016·0 cites·23 claims
- 0553US12462084B2Power envelope analysis for the thermal optimization of multi-chip modulesSTATS CHIPPAC PTE LTD·Filed 2022·Granted Nov 4, 2025·0 cites·25 claims
- 0651US2025054925A1Semiconductor pacakge and method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0746US2025379115A1Electronic device and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0843US9059108B2Integrated circuit packaging system with interconnectsCHOI DAESIK·Filed 2012·Granted Jun 16, 2015·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →