Assignee
KIM YOUNGJOON
KR·3 granted patents·69 citations·filing 2007–2011
Top patents by PatentIndex Score
3 records- 0194US8816404B2Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulantKIM YOUNGJOON·Filed 2011·Granted Aug 26, 2014·53 cites·14 claims
- 0282US8247893B2Mountable integrated circuit package system with intra-stack encapsulationKIM YOUNGJOON·Filed 2007·Granted Aug 21, 2012·11 cites·20 claims
- 0371US8110908B2Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereofKIM YOUNGJOON·Filed 2008·Granted Feb 7, 2012·5 cites·20 claims
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