Inventor · disambiguated record
James F. Buller
Also filed as: BULLER JAMES · BULLER JAMES F · BULLER JAMES FRANCIS · WU DAVID
54 granted patents·1 pending application·1,752 citations·filing 1992–2012
99Inventor score
Top patents by PatentIndex Score
55 records- 0196US5569620ABonded wafer processing with metal silicidationHARRIS CORP·Filed 1994·Granted Oct 29, 1996·194 cites·13 claims
- 0295US6707106B1Semiconductor device with tensile strain silicon introduced by compressive material in a buried oxide layerADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 16, 2004·91 cites·20 claims
- 0394US8183107B2Semiconductor devices with improved local matching and end resistance of RX based resistorsMATHUR KAVERI·Filed 2009·Granted May 22, 2012·118 cites·8 claims
- 0494US7943471B1Diode with asymmetric silicon germanium anodeGLOBALFOUNDRIES INC·Filed 2006·Granted May 17, 2011·34 cites·37 claims
- 0594US5849627ABonded wafer processing with oxidative bondingHARRIS CORP·Filed 1995·Granted Dec 15, 1998·178 cites·5 claims
- 0694US5387555ABonded wafer processing with metal silicidationHARRIS CORP·Filed 1992·Granted Feb 7, 1995·149 cites·8 claims
- 0793US6506642B1Removable spacer techniqueADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 14, 2003·74 cites·19 claims
- 0892US8048753B2Charging protection deviceGLOBALFOUNDRIES INC·Filed 2009·Granted Nov 1, 2011·24 cites·8 claims
- 0991US6794256B1Method for asymmetric spacer formationADVANCED MICRO DEVICES INC·Filed 2003·Granted Sep 21, 2004·62 cites·29 claims
- 1089US5362667ABonded wafer processingHARRIS CORP·Filed 1992·Granted Nov 8, 1994·93 cites·26 claims
- 1187US6967363B1Lateral diode with multiple spacersADVANCED MICRO DEVICES INC·Filed 2003·Granted Nov 22, 2005·39 cites·17 claims
- 1286US7915658B2Semiconductor on insulator (SOI) device including a discharge path for a decoupling capacitorGLOBALFOUNDRIES INC·Filed 2010·Granted Mar 29, 2011·10 cites·14 claims
- 1386US6833307B1Method for manufacturing a semiconductor component having an early halo implantADVANCED MICRO DEVICES INC·Filed 2002·Granted Dec 21, 2004·38 cites·10 claims
- 1485US6114211ASemiconductor device with vertical halo region and methods of manufactureADVANCED MICRO DEVICES INC·Filed 1998·Granted Sep 5, 2000·62 cites·21 claims
- 1584US8050077B2Semiconductor device with transistor-based fuses and related programming methodADVANCED MICRO DEVICES INC·Filed 2009·Granted Nov 1, 2011·9 cites·8 claims
- 1684US6936506B1Strained-silicon devices with different silicon thicknessesADVANCED MICRO DEVICES INC·Filed 2003·Granted Aug 30, 2005·28 cites·14 claims
- 1783US6300205B1Method of making a semiconductor device with self-aligned active, lightly-doped drain, and halo regionsADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 9, 2001·67 cites·23 claims
- 1881US6541321B1Method of making transistors with gate insulation layers of differing thicknessADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 1, 2003·28 cites·20 claims
- 1981US5811334AWafer cleaning procedure useful in the manufacture of a non-volatile memory deviceADVANCED MICRO DEVICES INC·Filed 1995·Granted Sep 22, 1998·53 cites·11 claims
- 2080US5728624ABonded wafer processingHARRIS CORP·Filed 1995·Granted Mar 17, 1998·52 cites·11 claims
- 2180US5517047ABonded wafer processingHARRIS CORP·Filed 1994·Granted May 14, 1996·53 cites·5 claims
- 2277US6949436B2Composite spacer liner for improved transistor performanceADVANCED MICRO DEVICES INC·Filed 2004·Granted Sep 27, 2005·19 cites·8 claims
- 2377US5549786AHighly selective, highly uniform plasma etch process for spin-on glassADVANCED MICRO DEVICES INC·Filed 1995·Granted Aug 27, 1996·51 cites·16 claims
- 2476US8546855B2Charging protection deviceZHOU JINGRONG·Filed 2011·Granted Oct 1, 2013·5 cites·10 claims
- 2576US7718503B2SOI device and method for its fabricationGLOBALFOUNDRIES INC·Filed 2006·Granted May 18, 2010·8 cites·15 claims
- 2676US7417250B1Strained-silicon device with different silicon thicknessesADVANCED MICRO DEVICES INC·Filed 2005·Granted Aug 26, 2008·5 cites·1 claims
- 2775US7208383B1Method of manufacturing a semiconductor componentADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 24, 2007·19 cites·20 claims
- 2874US7633103B2Semiconductor device and methods for fabricating sameGLOBALFOUNDRIES INC·Filed 2007·Granted Dec 15, 2009·5 cites·17 claims
- 2973US8962420B2Semiconductor device comprising a buried poly resistorKURZ ANDREAS·Filed 2009·Granted Feb 24, 2015·5 cites·16 claims
- 3070US8076703B2Semiconductor device and methods for fabricating sameSULTAN AKIF·Filed 2009·Granted Dec 13, 2011·4 cites·19 claims
- 3170US7582493B2Distinguishing between dopant and line width variation componentsADVANCED MICRO DEVICES INC·Filed 2006·Granted Sep 1, 2009·3 cites·19 claims
- 3268US8035098B1Transistor with asymmetric silicon germanium source regionGLOBALFOUNDRIES INC·Filed 2006·Granted Oct 11, 2011·3 cites·17 claims
- 3368US7482252B1Method for reducing floating body effects in SOI semiconductor device without degrading mobilityADVANCED MICRO DEVICES INC·Filed 2003·Granted Jan 27, 2009·11 cites·18 claims
- 3467US6727136B1Formation of ultra-shallow depth source/drain extensions for MOS transistorsADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 27, 2004·13 cites·16 claims
- 3566US7761838B2Method for fabricating a semiconductor device having an extended stress linerGLOBALFOUNDRIES INC·Filed 2007·Granted Jul 20, 2010·3 cites·24 claims
- 3666US6727534B1Electrically programmed MOS transistor source/drain series resistanceADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 27, 2004·12 cites·11 claims
- 3765US6037224AMethod for growing dual oxide thickness using nitrided oxides for oxidation suppressionADVANCED MICRO DEVICES INC·Filed 1997·Granted Mar 14, 2000·24 cites·19 claims
- 3862US6909146B1Bonded wafer with metal silicidationINTERSIL CORP·Filed 1999·Granted Jun 21, 2005·25 cites·6 claims
- 3962US6801096B1Ring oscillator with embedded scatterometry grate arrayADVANCED MICRO DEVICES INC·Filed 2003·Granted Oct 5, 2004·10 cites·20 claims
- 4062US5293052ASOT CMOS device having differentially doped body extension for providing improved backside leakage channel stopHARRIS CORP·Filed 1992·Granted Mar 8, 1994·23 cites·17 claims
- 4159US7598161B2Method of forming transistor devices with different threshold voltages using halo implant shadowingADVANCED MICRO DEVICES INC·Filed 2007·Granted Oct 6, 2009·1 cites·16 claims
- 4255US6821853B1Differential implant oxide processADVANCED MICRO DEVICES INC·Filed 2002·Granted Nov 23, 2004·6 cites·21 claims
- 4355US6720227B1Method of forming source/drain regions in a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2002·Granted Apr 13, 2004·4 cites·34 claims
- 4454US8357584B2Metal capacitor design for improved reliability and good electrical connectionGLOBALFOUNDRIES INC·Filed 2009·Granted Jan 22, 2013·0 cites·10 claims
- 4554US6566696B1Self-aligned VT implantADVANCED MICRO DEVICES INC·Filed 2001·Granted May 20, 2003·5 cites·6 claims
- 4650US9818816B2Metal capacitor design for improved reliability and good electrical connectionGLOBALFOUNDRIES INC·Filed 2012·Granted Nov 14, 2017·0 cites·9 claims
- 4749US8377781B2Transistor with asymmetric silicon germanium source regionGLOBALFOUNDRIES INC·Filed 2011·Granted Feb 19, 2013·0 cites·9 claims
- 4849US5976925AProcess of fabricating a semiconductor devise having asymmetrically-doped active region and gate electrodeADVANCED MICRO DEVICES INC·Filed 1997·Granted Nov 2, 1999·12 cites·10 claims
- 4945US6274415B1Self-aligned Vt implantADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 14, 2001·2 cites·19 claims
- 5045US6051510AMethod of using a hard mask to grow dielectrics with varying characteristicsADVANCED MICRO DEVICES INC·Filed 1997·Granted Apr 18, 2000·11 cites·17 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when James F. Buller files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →