Inventor · disambiguated record
Tetsuya Matsuura
Also filed as: MATSUURA TETSUYA
35 granted patents·16 pending applications·391 citations·filing 2001–2023
97Inventor score
Files withMITSUBISHI ELECTRIC CORP11MURATA MACHINERY LTD11DAIKIN IND LTD5RENESAS TECH CORP5TAKEDA PHARMACEUTICAL4
Top patents by PatentIndex Score
51 records- 0198US6521984B2Semiconductor module with semiconductor devices attached to upper and lower surface of a semiconductor substrateMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Feb 18, 2003·166 cites·6 claims
- 0289US8642648B2Orally dispersible tabletTAKEDA PHARMACEUTICAL·Filed 2012·Granted Feb 4, 2014·8 cites·13 claims
- 0389US6670701B2Semiconductor module and electronic componentMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 30, 2003·48 cites·16 claims
- 0487US8735938B2Semiconductor device and method of producing the sameDOWA ELECTRONICS MATERIALS CO LTD·Filed 2013·Granted May 27, 2014·7 cites·12 claims
- 0586US11931974B2Filament winding apparatusMURATA MACHINERY LTD·Filed 2019·Granted Mar 19, 2024·2 cites·9 claims
- 0685US10532520B2Filament winding deviceMURATA MACHINERY LTD·Filed 2018·Granted Jan 14, 2020·2 cites·6 claims
- 0785US8680509B2Nitride semiconductor device and method of producing the sameOOSHIKA YOSHIKAZU·Filed 2010·Granted Mar 25, 2014·6 cites·11 claims
- 0885US6777798B2Stacked semiconductor device structureRENESAS TECH CORP·Filed 2003·Granted Aug 17, 2004·37 cites·7 claims
- 0983US12097306B2Conformal coating of biological surfacesTAKEDA PHARMACEUTICALS CO·Filed 2017·Granted Sep 24, 2024·2 cites·22 claims
- 1083US6717275B2Semiconductor moduleRENESAS TECH CORP·Filed 2002·Granted Apr 6, 2004·41 cites·5 claims
- 1181US12364791B2Conformal coating of biological surfacesTAKEDA PHARMACEUTICALS CO·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 1280US11130274B2Filament winding apparatusMURATA MACHINERY LTD·Filed 2018·Granted Sep 28, 2021·2 cites·20 claims
- 1377US9503016B2Solar panel unitDAIKIN IND LTD·Filed 2013·Granted Nov 22, 2016·3 cites·4 claims
- 1472US11274015B2Filament winding device, and yarn threading method in filament winding deviceMURATA MACHINERY LTD·Filed 2018·Granted Mar 15, 2022·1 cites·17 claims
- 1569US10454411B2Light-condensing film, solar cell module, and transfer moldDAIKIN IND LTD·Filed 2012·Granted Oct 22, 2019·2 cites·10 claims
- 1667US8765222B2Method of manufacturing a p-AlGaN layerOOSHIKA YOSHIKAZU·Filed 2010·Granted Jul 1, 2014·2 cites·10 claims
- 1763US2014235879A1Orally dispersible tabletTAKEDA PHARMACEUTICAL·Filed 2014·Application pending·0 cites
- 1863US2014235709A1Orally dispersible tabletTAKEDA PHARMACEUTICAL·Filed 2014·Application pending·0 cites
- 1962US8642649B2Orally dispersible tabletTAKEDA PHARMACEUTICAL·Filed 2012·Granted Feb 4, 2014·0 cites·24 claims
- 2060US2017065553A1Orally dispersible tabletTAKEDA PHARMACEUTICALS CO·Filed 2016·Application pending·0 cites
- 2159US11383425B2Filament winding deviceMURATA MACHINERY LTD·Filed 2018·Granted Jul 12, 2022·0 cites·15 claims
- 2258US11472095B2Filament winding apparatusMURATA MACHINERY LTD·Filed 2019·Granted Oct 18, 2022·0 cites·8 claims
- 2358US11440271B2Filament winding deviceMURATA MACHINERY LTD·Filed 2019·Granted Sep 13, 2022·0 cites·15 claims
- 2458US6798056B2Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Sep 28, 2004·8 cites·7 claims
- 2556US7487646B2Sleeping capsuleDAIKIN IND LTD·Filed 2003·Granted Feb 10, 2009·15 cites·8 claims
- 2656US2015144178A1Solar panel unit, solar photovoltaic system, and method for installing solar photovoltaic systemDAIKIN IND LTD·Filed 2013·Application pending·0 cites
- 2755US11931949B2Filament winding deviceMURATA MACHINERY LTD·Filed 2019·Granted Mar 19, 2024·0 cites·6 claims
- 2855USD465773SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 19, 2002·9 cites·1 claims
- 2955USD459317SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 25, 2002·9 cites·1 claims
- 3055US2013247962A1Solar panel unitSAKAI TOSHIYUKI·Filed 2011·Application pending·0 cites
- 3154US2015244314A1Pseudo sunlight irradiation apparatus and method for evaluating solar battery moduleDAIKIN IND LTD·Filed 2013·Application pending·0 cites
- 3254US2012282191A1Orally dispersible tabletTANOUE YUTAKA·Filed 2012·Application pending·0 cites
- 3353US8426461B2Orally dispersible tabletTANOUE YUTAKA·Filed 2012·Granted Apr 23, 2013·0 cites·10 claims
- 3453US2022118723A1Winding data creation method and filament winding apparatusMURATA MACHINERY LTD·Filed 2019·Application pending·0 cites
- 3552USD461171SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 6, 2002·8 cites·1 claims
- 3652US2014166943A1P-AlGAN LAYER AND GROUP III NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICEDOWA ELECTRONICS MATERIALS CO LTD·Filed 2014·Application pending·0 cites
- 3751US11472096B2Filament winding apparatusMURATA MACHINERY LTD·Filed 2018·Granted Oct 18, 2022·0 cites·20 claims
- 3850US2015372189A1Iii nitride semiconductor light emitting deviceDOWA ELECTRONICS MATERIALS CO LTD·Filed 2013·Application pending·0 cites
- 3945US11318661B2Filament winding device and bobbin replacement methodMURATA MACHINERY LTD·Filed 2018·Granted May 3, 2022·0 cites·9 claims
- 4044USD459316SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 25, 2002·5 cites·1 claims
- 4143US8278822B2Light-emitting elementIWATA MASATOSHI·Filed 2009·Granted Oct 2, 2012·0 cites·13 claims
- 4243US2013060052A1Orally dispersible tabletTANOUE YUTAKA·Filed 2012·Application pending·0 cites
- 4343US2012326209A1Semiconductor device and method of producing the sameOOSHIKA YOSHIKAZU·Filed 2011·Application pending·0 cites
- 4441USD460951SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jul 30, 2002·4 cites·1 claims
- 4538US6852571B2Method of manufacturing stacked semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Feb 8, 2005·0 cites·9 claims
- 4637US2002105068A1Stacked semiconductor device structureMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 4737US2004159925A1Semiconductor device and method for manufacture thereofRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 4836US2003051893A1Surface-mounting connector and semiconductor module using the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 4935USD460744SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jul 23, 2002·2 cites·1 claims
- 5035USD458234SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 4, 2002·2 cites·1 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →