Inventor · disambiguated record
Yasuhiro Amano
Also filed as: AMANO YASUHIRO
9 granted patents·20 pending applications·61 citations·filing 2001–2025
86Inventor score
Files withNITTO DENKO CORP11NINTENDO CO LTD7AMANO YASUHIRO6UENDA DAISUKE2MATSUSHITA ELECTRIC INDUSTRIAL CO LTD1
Top patents by PatentIndex Score
29 records- 0187US9123794B2Dicing die bond filmNITTO DENKO CORP·Filed 2013·Granted Sep 1, 2015·10 cites·7 claims
- 0283US7575812B2Cleaning substrate of substrate processing equipment and heat resistant resin preferable thereforNITTO DENKO CORP·Filed 2005·Granted Aug 18, 2009·7 cites·11 claims
- 0378USD589473SAdhesive film material for use in manufacturing semiconductorsNITTO DENKO CORP·Filed 2007·Granted Mar 31, 2009·23 cites·1 claims
- 0473US2025367544A1Input device and controllerNINTENDO CO LTD·Filed 2025·Application pending·0 cites
- 0572US7611926B2Thermosetting die bonding filmNITTO DENKO CORP·Filed 2008·Granted Nov 3, 2009·6 cites·15 claims
- 0663US2025262527A1Portable game deviceNINTENDO CO LTD·Filed 2025·Application pending·0 cites
- 0762US7793668B2Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKO CORP·Filed 2004·Granted Sep 14, 2010·5 cites·18 claims
- 0862US6437631B2Analog multiplying circuit and variable gain amplifying circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 20, 2002·9 cites·23 claims
- 0962US2025213968A1Vibration control system, non-transitory computer-readable storage media, and methodNINTENDO CO LTD·Filed 2024·Application pending·0 cites
- 1062US2025213969A1Vibration control system, non-transitory computer-readable storage media, and methodNINTENDO CO LTD·Filed 2024·Application pending·0 cites
- 1162US2025262526A1Portable game deviceNINTENDO CO LTD·Filed 2025·Application pending·0 cites
- 1259US2025262553A1Cover and system including coverNINTENDO CO LTD·Filed 2025·Application pending·0 cites
- 1358US7998552B2Dicing/die bonding filmNITTO DENKO CORP·Filed 2008·Granted Aug 16, 2011·1 cites·11 claims
- 1454US2009253891A1Cleaning substrate of substrate processing equipment and heat resistant resin preferable thereofNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1553US2025254820A1Electronic device and method for producing electronic deviceNINTENDO CO LTD·Filed 2025·Application pending·0 cites
- 1651US2010319151A1Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKKO CORP·Filed 2010·Application pending·0 cites
- 1750US8475600B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2006·Granted Jul 2, 2013·0 cites·9 claims
- 1848US8524007B2Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatusUENDA DAISUKE·Filed 2010·Granted Sep 3, 2013·0 cites·8 claims
- 1947US2010304092A1Method of manufacturing dicing die-bonding filmAMANO YASUHIRO·Filed 2009·Application pending·0 cites
- 2046US2010136275A1Film for manufacturing semiconductor device and method of manufacturing the sameAMANO YASUHIRO·Filed 2009·Application pending·0 cites
- 2146US2006105164A1Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using themNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 2246US2010236689A1Adhesive sheet for manufacturing semiconductor device, and semiconductor device manufacturing method using the sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 2344US2010119759A1Adhesive film for producing semiconductor deviceNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 2444US2010047968A1Adhesive sheet for producing a semiconductor device, and a method for producing a semiconductor device using the sameAMANO YASUHIRO·Filed 2007·Application pending·0 cites
- 2543US2012061805A1Dicing die bond filmAMANO YASUHIRO·Filed 2011·Application pending·0 cites
- 2636US2011074050A1Film for semiconductor deviceAMANO YASUHIRO·Filed 2010·Application pending·0 cites
- 2735US2012058625A1Film for semiconductor device, and semiconductor deviceAMANO YASUHIRO·Filed 2011·Application pending·0 cites
- 2835US2019044037A1Ceramic plate, producing method thereof, and optical semiconductor deviceNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 2933US2011052853A1Adhesive film with dicing sheet and method of manufacturing the sameSUGO YUKI·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →