Inventor · disambiguated record
Tomoo Matsuzawa
Also filed as: MATSUZAWA TOMOO
8 granted patents·5 pending applications·210 citations·filing 1991–2007
88Inventor score
Files withRENESAS TECH CORP4RENESAS E JP SEMICONDUCTOR INC2HITACHI HOKKAI SEMICONDUCTOR1HITACHI LTD1HITACHI ULSI SYS CO LTD1
Top patents by PatentIndex Score
13 records- 0188US6897570B2Semiconductor device and method of manufacturing sameRENESAS TECH CORP·Filed 2003·Granted May 24, 2005·54 cites·19 claims
- 0286US7005310B2Manufacturing method of solid-state image sensing deviceRENESAS E JP SEMICONDUCTOR INC·Filed 2003·Granted Feb 28, 2006·51 cites·6 claims
- 0381US6900551B2Semiconductor device with alternate bonding wire arrangementHITACHI ULSI SYS CO LTD·Filed 2003·Granted May 31, 2005·28 cites·13 claims
- 0474US5252854ASemiconductor device having stacked lead structureHITACHI LTD·Filed 1991·Granted Oct 12, 1993·51 cites·44 claims
- 0568US7449786B2Semiconductor device having improved adhesion between bonding and ball portions of electrical connectorsRENESAS TECH CORP·Filed 2006·Granted Nov 11, 2008·6 cites·8 claims
- 0665US7049214B2Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectorsRENESAS TECH CORP·Filed 2004·Granted May 23, 2006·8 cites·13 claims
- 0761US7199469B2Semiconductor device having stacked semiconductor chips sealed with a resin seal memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Apr 3, 2007·12 cites·4 claims
- 0848US2007187823A1Semiconductor deviceTANAKA NAOTAKA·Filed 2007·Application pending·0 cites
- 0945US2005121805A1Semiconductor device and a method of manufacturing the sameRENESAS TECHNOLOGY CORP HITACH·Filed 2005·Application pending·0 cites
- 1041US2005001314A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 1140US2006091487A1Manufacturing method of solid-state image sensing deviceRENESAS E JP SEMICONDUCTOR INC·Filed 2005·Application pending·0 cites
- 1239US7015127B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Mar 21, 2006·0 cites·3 claims
- 1337US2003168740A1Semiconductor device and a method of manufacturing the sameFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →