Inventor · disambiguated record
Seung Hyun Sohn
Also filed as: SOHN SEUNG H · SOHN SEUNG HYUN
6 granted patents·18 pending applications·128 citations·filing 2004–2015
77Inventor score
Files withSAMSUNG ELECTRO MECH20LEE JIN WON1SAMSUNG ELECTRO MACHANICS CO LTD1SOHN SEUNG HYUN1UNIV SUNGKYUNKWAN RES & BUS1
Top patents by PatentIndex Score
24 records- 0197US7293356B2Method of fabricating printed circuit board having embedded multi-layer passive devicesSAMSUNG ELECTRO MECH·Filed 2006·Granted Nov 13, 2007·124 cites·6 claims
- 0270US9105844B2Piezoelectric device with piezoelectric polymer materialSAMSUNG ELECTRO MECH·Filed 2012·Granted Aug 11, 2015·2 cites·9 claims
- 0363US7675756B2Thin film-capacitor-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 9, 2010·2 cites·12 claims
- 0455US2009314419A1Printed circuit board material for embedded passive devices and preparing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0554US7886436B2Thin film capacitor-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Feb 15, 2011·0 cites·11 claims
- 0649US2009277673A1PCB having electronic components embedded therein and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0748US2011034606A1Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 0848US2007148421A1Printed circuit board material for embedded passive devices and preparing method thereofSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 0947US7737529B2Printed circuit board with film capacitor embedded therein and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Jun 15, 2010·0 cites·18 claims
- 1047US2008158777A1Capacitor and multi-layer board embedding the capacitorSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1146US2006183872A1Resin composition for embedded capacitors having excellent adhesive strength, heat resistance and flame retardancySAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1246US2008100986A1Capacitor embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1345US2012291274A1Printed circuit board having electro-component and manufacturing method thereofLEE JIN-WON·Filed 2012·Application pending·0 cites
- 1445US2012017435A1Method of manufacturing PCB having electronic components embedded thereinSOHN SEUNG HYUN·Filed 2011·Application pending·0 cites
- 1544US2009057860A1Semiconductor memory packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1644US2011116246A1Printed circuit board having electro-component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1743US2007087929A1Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 1841US2013098668A1Conductive subtrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1940US2006062976A1Printed circuit board material for embedded passive devicesSAMSUNG ELECTRO MECH·Filed 2004·Application pending·0 cites
- 2037US2011216515A1Electro device embedded printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2137US2007094871A1Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained therebySAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2236US9673610B2Apparatus and method for controlling adaptive reclosing based on transient stabilityUNIV SUNGKYUNKWAN RES & BUS·Filed 2015·Granted Jun 6, 2017·0 cites·24 claims
- 2334US2011141711A1Electronic component embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 2431US2011214913A1Electro device embedded printed circuit board and manufacturng method thereofSAMSUNG ELECTRO MACHANICS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →