Electro device embedded printed circuit board and manufacturing method thereof

Abstract

An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, an electro device embedded printed circuit board is manufactured by: adhering a first electro device on a supporting body through a face-down method; adhering a second electro device on an upper surface of the first electro device through a face-up method; stacking a pure resin layer and a reinforcing layer on an upper side of the supporting body, wherein the first electro device and the second electro device are embedded in the pure resin layer; removing the supporting body; stacking an insulation layer on a lower side of the first electro device, a reinforcing material having been impregnated in the insulation layer; and patterning a circuit on each of the reinforcing layer and the insulation layer.

1 . A method of manufacturing an electro device embedded printed circuit board, the method comprising:
 adhering a first electro device on a supporting body through a face-down method;   adhering a second electro device on an upper surface of the first electro device through a face-up method;   stacking a pure resin layer and a reinforcing layer on an upper side of the supporting body, wherein the first electro device and the second electro device are embedded in the pure resin layer;   removing the supporting body;   stacking an insulation layer on a lower side of the first electro device, a reinforcing material having been impregnated in the insulation layer; and   patterning a circuit on each of the reinforcing layer and the insulation layer.   
     
     
         2 . The method of  claim 1 , wherein:
 the supporting body is a metal membrane having an adhesive layer formed on an upper surface thereof; and   the removing of the supporting body is performed by peeling off the adhesive layer.   
     
     
         3 . The method of  claim 1 , wherein, prior to the stacking of the pure resin layer and the reinforcing layer on the upper side of the supporting body, the pure resin layer and the reinforcing layer are already stacked with each other. 
     
     
         4 . The method of  claim 3 , wherein a metal membrane is stacked on a surface of the reinforcing layer and on a surface of the insulation layer. 
     
     
         5 . The method of  claim 1 , further comprising, prior to the adhering of the electro devices, forming reference holes in the supporting body, the reference holes being assisting means used to determine locations of the electro devices. 
     
     
         6 . The method of  claim 1 , the patterning of the circuit comprises forming a blind via for directly connecting a circuit formed on a surface of the reinforcing layer with an electrode of the electro devices. 
     
     
         7 . The method of  claim 1 , wherein the reinforcing layer and the insulation layer in which the reinforcing material is impregnated are symmetric about the pure resin layer. 
     
     
         8 . The method of  claim 1 , wherein at least one of a size and a type of the first electro device and the second electro device is different from each other. 
     
     
         9 . An electro device embedded printed circuit board, comprising:
 a pure resin layer;   a first electro device embedded in the pure resin layer through a face-down method;   a second electro device stacked on an upper surface of the first electro device and embedded in the pure resin layer through a face-up method;   an insulating reinforcing layer stacked on one surface of the pure resin layer;   an insulation layer stacked on the other surface of the pure resin layer and having a reinforcing material impregnated inside thereof; and   a circuit formed on each of the reinforcing layer and the insulation layer.   
     
     
         10 . The electro device embedded printed circuit board of  claim 9 , further comprising a blind via directly connecting a circuit formed on a surface of the reinforcing layer with an electrode of the electro devices. 
     
     
         11 . The electro device embedded printed circuit board of  claim 9 , wherein the reinforcing layer and the insulation layer in which the reinforcing material is impregnated are symmetric about the pure resin layer. 
     
     
         12 . The electro device embedded printed circuit board of  claim 9 , wherein at least one of a size and a type of the first electro device and the second electro device is different from each other.