Inventor · disambiguated record
You-Hua Chou
Also filed as: CHOU YOU-HUA
108 granted patents·10 pending applications·186 citations·filing 2003–2024
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD83TAIWAN SEMICONDUCTOR MFG12CHOU YOU-HUA9KAO CHUNG-EN2LIEN MING HUEI2
Top patents by PatentIndex Score
118 records- 0197US11752638B2Substrate handling device and processing chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
- 0294US11460779B2Gamma ray generator and gamma ray lithography systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 4, 2022·2 cites·20 claims
- 0394US9735050B2Composite contact plug structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 15, 2017·8 cites·20 claims
- 0493US11067898B2Gamma ray generator, gamma ray lithography system and method of performing gamma ray lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·2 cites·20 claims
- 0593US10357867B2Polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 23, 2019·8 cites·20 claims
- 0692US10276692B1Fin diode structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·6 cites·20 claims
- 0790US10399231B2Substrate handling contacts and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 3, 2019·4 cites·20 claims
- 0890US9976215B2Semiconductor film formation apparatus and processCHOU YOU HUA·Filed 2012·Granted May 22, 2018·6 cites·17 claims
- 0989US9272315B2Mechanisms for controlling gas flow in enclosureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 1, 2016·11 cites·20 claims
- 1087US10190209B2PVD apparatus and method with deposition chamber having multiple targets and magnetsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 29, 2019·4 cites·20 claims
- 1187US9984924B2Semiconductor device and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·3 cites·20 claims
- 1286US8518818B2Reverse damascene processCHOU YOU-HUA·Filed 2011·Granted Aug 27, 2013·8 cites·11 claims
- 1385US10297505B2Semiconductor device and fabrication method thereforTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 21, 2019·2 cites·20 claims
- 1485US10175176B2Method of evaluating characteristics of ion implanted sampleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 8, 2019·3 cites·20 claims
- 1585US9589892B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·4 cites·20 claims
- 1685US9234278B2CVD conformal vacuum/pumping guiding designCHOU YOU-HUA·Filed 2012·Granted Jan 12, 2016·3 cites·12 claims
- 1785US8709528B2Wafer processing method and system using multi-zone chuckCHENG NAI-HAN·Filed 2011·Granted Apr 29, 2014·6 cites·20 claims
- 1884US12109681B2Substrate handling device and processing chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 1984US11854874B2Metal contact structure and method of forming the same in a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·1 cites·19 claims
- 2084US8926806B2Shielding design for metal gap fillTSAI MING-CHIN·Filed 2012·Granted Jan 6, 2015·6 cites·20 claims
- 2184US2024347388A1Semiconductor integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2283US10483115B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 19, 2019·2 cites·20 claims
- 2383US10276432B2Composite contact plug structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 30, 2019·2 cites·19 claims
- 2482US11669014B2Gamma ray generator and method of generating gamma rayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 6, 2023·0 cites·20 claims
- 2582US9718164B2Polishing system and polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 1, 2017·4 cites·20 claims
- 2682US9536834B2Reverse damascene processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 3, 2017·5 cites·20 claims
- 2781US10204807B2Apparatus and method for processing waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 2881US7314838B2Method for forming a high density dielectric film by chemical vapor depositionTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jan 1, 2008·7 cites·27 claims
- 2980US9460949B2Ultra-low oxygen and humility loadport and stocker systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 4, 2016·4 cites·20 claims
- 3080US9385080B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·4 cites·20 claims
- 3179US12282255B2Silver patterning and interconnect processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 22, 2025·0 cites·20 claims
- 3278US9892954B2Wafer processing system using multi-zone chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·3 cites·20 claims
- 3377US10978329B2Wafer pod handling methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·1 cites·20 claims
- 3476US12027424B2Semiconductor integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
- 3576US9966339B2Barrier structure for copper interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 8, 2018·4 cites·20 claims
- 3676US9412850B1Method of trimming fin structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 9, 2016·2 cites·20 claims
- 3776US2024087953A1Metal Contact Structure and Method of Forming the Same in a Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3876US2023381862A1Device for forming conductive powderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3975US11164937B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·2 cites·20 claims
- 4075US10088761B1Lithography device and apparatus and method for lithography deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·1 cites·20 claims
- 4175US9607946B2Reverse damascene processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 28, 2017·3 cites·20 claims
- 4275US9530736B2Semiconductor device and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 27, 2016·2 cites·28 claims
- 4375US2024297038A1Dielectric layer, interconnection structure using the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4474US12025914B2Silver patterning and interconnect processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·11 claims
- 4574US10079174B2Composite contact plug structure and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 18, 2018·2 cites·20 claims
- 4673US8541262B2Die edge contacts for semiconductor devicesLAI YI-JEN·Filed 2010·Granted Sep 24, 2013·3 cites·19 claims
- 4772US11819923B2Conductive powder formation method and device for forming conductive powderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·19 claims
- 4871US10838295B2Photomask and fabrication method thereforTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 17, 2020·1 cites·18 claims
- 4970US12014919B2Dielectric layer, interconnection structure using the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 5070US8941232B2Metal bumps for cooling device connectionCHOU YOU-HUA·Filed 2011·Granted Jan 27, 2015·2 cites·20 claims
Showing the top 50 of 118 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →