US2023381862A1PendingUtilityA1

Device for forming conductive powder

Assignee: TAIWAN SEMICONDUCTOR MFG CO LTDPriority: Apr 18, 2017Filed: Aug 9, 2023Published: Nov 30, 2023
Est. expiryApr 18, 2037(~10.7 yrs left)· nominal 20-yr term from priority
H10P 14/46H10W 20/059H10W 20/056H10W 20/042H10W 20/033B22F 9/28H01L 21/76882H01L 21/76883H01L 21/76871H01L 21/288H01L 21/76877H01L 21/76843C23C 16/0281C23C 16/26B22F 1/0545
76
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Claims

Abstract

A device for forming a conductive powder includes a reaction chamber configured to receive a conductive powder precursor gas, an inert gas and a hydrogen gas. The device further includes a radio frequency (RF) power unit configured to ignite a plasma using the inert gas and the hydrogen gas, wherein the plasma is usable to reduce, by a reduction reaction, the conductive powder precursor gas to form the conductive powder. The device further includes powder collecting cells configured to separate the conductive powder based on particle size. The device further includes a solvent inlet configured to provide a solvent to the powder collecting cells for dispersing the conductive powder in a solvent.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A device for forming a conductive powder, the device comprising:
 a reaction chamber configured to receive a conductive powder precursor gas, an inert gas and a hydrogen gas;   a radio frequency (RF) power unit configured to ignite a plasma using the inert gas and the hydrogen gas, wherein the plasma is usable to reduce, by a reduction reaction, the conductive powder precursor gas to form the conductive powder;   powder collecting cells configured to separate the conductive powder based on particle size; and   a solvent inlet configured to provide a solvent to the powder collecting cells for dispersing the conductive powder in a solvent.   
     
     
         2 . The device of  claim 1 , further comprising a vibration unit configured to vibrate the reaction chamber during reduction of the conductive powder precursor gas. 
     
     
         3 . The device of  claim 1 , further comprising a valve configured to regulate a flow of the solvent from the solvent inlet to the powder collecting cells. 
     
     
         4 . The device of  claim 1 , further comprising a pump for removing the conductive powder dispersed in the solvent from the powder collecting cells. 
     
     
         5 . The device of  claim 1 , further comprising a valve to selectively permit the solvent to enter the powder collecting cells. 
     
     
         6 . The device of  claim 1 , further comprising a controller, wherein the controller is configured to control an operation of the RF power unit. 
     
     
         7 . The device of  claim 1 , further comprising a cooling section between the powder collecting cells and the reaction chamber. 
     
     
         8 . A device for forming a conductive powder, the device comprising:
 a reaction chamber configured to receive a conductive powder precursor gas;   a radio frequency (RF) power unit;   a valve for selectively permitting the conductive powder to pass from the reaction chamber to a powder collecting cell;   a solvent inlet for providing a solvent to the powder collecting cell; and   a controller for:
 controlling the RF power unit to ignite a plasma usable to reduce, by a reduction reaction, the conductive powder precursor gas to form the conductive powder, and 
 controlling the valve for selectively opening and closing the valve. 
   
     
     
         9 . The device of  claim 8 , wherein the valve is configured to separate the conductive powder based on particle size. 
     
     
         10 . The device of  claim 8 , further comprising a solvent valve between the solvent inlet and the powder collecting cell. 
     
     
         11 . The device of  claim 10 , wherein the controller is configured to control operation of the solvent valve. 
     
     
         12 . The device of  claim 8 , further comprising a vibration unit attached to the reaction chamber. 
     
     
         13 . The device of  claim 12 , wherein the controller is configured to control the vibration unit to cause the vibration unit to activate during the reduction reaction and to deactivate after the reduction reaction. 
     
     
         14 . The device of  claim 8 , further comprising:
 a conductive powder precursor gas input for supplying the conductive powder precursor gas to the reaction chamber;   an inert gas input for supplying an inert gas to the reaction chamber; and   a hydrogen gas input for supplying hydrogen gas to the reaction chamber.   
     
     
         15 . A device for forming a conductive powder, the device comprising:
 a reaction chamber configured to receive a conductive powder precursor gas;   a radio frequency (RF) power unit;   a cooling section for cooling the conductive powder;   a valve for selectively permitting the conductive powder to pass from the reaction chamber to a powder collecting cell, wherein the valve is downstream of the cooling section;   a solvent inlet for providing a solvent to the powder collecting cell; and   a controller for:
 controlling the RF power unit to ignite a plasma usable to reduce, by a reduction reaction, the conductive powder precursor gas to form the conductive powder. 
   
     
     
         16 . The device of  claim 15 , further comprising a pump for dispensing the solvent and the conductive powder from the powder collecting cell. 
     
     
         17 . The device of  claim 15 , further comprising a vibration unit attached to the reaction chamber. 
     
     
         18 . The device of  claim 15 , further comprising a solvent valve for selectively providing the solvent to the powder collection cell. 
     
     
         19 . The device of  claim 18 , wherein the solvent valve is separate from the valve. 
     
     
         20 . The device of  claim 15 , wherein the valve is configured to filter the conductive powder based on particle size.

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