Inventor · disambiguated record
Jay D. Pinson, Ii
Also filed as: PINSON II JAY D · PINSON II JAY DEE · PINSON JAY · PINSON JAY D
54 granted patents·14 pending applications·2,957 citations·filing 1981–2025
99Inventor score
Files withAPPLIED MATERIALS INC52ISHIKAWA TETSUYA5LUBOMIRSKY DMITRY4SOKUDO CO LTD3LIFELINE TECH INC1
Top patents by PatentIndex Score
68 records- 0198US7925377B2Cluster tool architecture for processing a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 12, 2011·45 cites·3 claims
- 0298US7743728B2Cluster tool architecture for processing a substrateAPPLIED MATERIALS INC·Filed 2008·Granted Jun 29, 2010·36 cites·16 claims
- 0398US7694647B2Cluster tool architecture for processing a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 13, 2010·42 cites·19 claims
- 0498US7357842B2Cluster tool architecture for processing a substrateSOKUDO CO LTD·Filed 2005·Granted Apr 15, 2008·106 cites·11 claims
- 0598US6182602B1Inductively coupled HDP-CVD reactorAPPLIED MATERIALS INC·Filed 1997·Granted Feb 6, 2001·386 cites·20 claims
- 0698US6083344AMulti-zone RF inductively coupled source configurationAPPLIED MATERIALS INC·Filed 1997·Granted Jul 4, 2000·346 cites·18 claims
- 0798US5187454AElectronically tuned matching network using predictor-corrector control systemAPPLIED MATERIALS INC·Filed 1992·Granted Feb 16, 1993·165 cites·38 claims
- 0897US9466469B2Remote plasma source for controlling plasma skewAPPLIED MATERIALS INC·Filed 2016·Granted Oct 11, 2016·121 cites·20 claims
- 0997US6518195B1Plasma reactor using inductive RF coupling, and processesAPPLIED MATERIALS INC·Filed 2000·Granted Feb 11, 2003·162 cites·8 claims
- 1097US5556501ASilicon scavenger in an inductively coupled RF plasma reactorAPPLIED MATERIALS INC·Filed 1993·Granted Sep 17, 1996·396 cites·15 claims
- 1196US8771538B2Plasma source designLUBOMIRSKY DMITRY·Filed 2010·Granted Jul 8, 2014·28 cites·5 claims
- 1296US8146530B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2008·Granted Apr 3, 2012·22 cites·8 claims
- 1396US6488807B1Magnetic confinement in a plasma reactor having an RF bias electrodeAPPLIED MATERIALS INC·Filed 2000·Granted Dec 3, 2002·145 cites·6 claims
- 1495US8550031B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2012·Granted Oct 8, 2013·13 cites·10 claims
- 1595US7819079B2Cartesian cluster tool configuration for lithography type processesAPPLIED MATERIALS INC·Filed 2006·Granted Oct 26, 2010·26 cites·11 claims
- 1694US10403535B2Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition systemAPPLIED MATERIALS INC·Filed 2015·Granted Sep 3, 2019·11 cites·17 claims
- 1794US8215262B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2008·Granted Jul 10, 2012·15 cites·9 claims
- 1894US8181596B2Cluster tool architecture for processing a substrateISHIKAWA TETSUYA·Filed 2008·Granted May 22, 2012·15 cites·20 claims
- 1993US6545420B1Plasma reactor using inductive RF coupling, and processesAPPLIED MATERIALS INC·Filed 1995·Granted Apr 8, 2003·135 cites·13 claims
- 2093US6068784AProcess used in an RF coupled plasma reactorAPPLIED MATERIALS INC·Filed 1993·Granted May 30, 2000·173 cites·28 claims
- 2192US10428426B2Method and apparatus to prevent deposition rate/thickness drift, reduce particle defects and increase remote plasma system lifetimeAPPLIED MATERIALS INC·Filed 2017·Granted Oct 1, 2019·9 cites·20 claims
- 2292US6251792B1Plasma etch processesAPPLIED MATERIALS INC·Filed 1997·Granted Jun 26, 2001·122 cites·18 claims
- 2391US10192717B2Conditioning remote plasma source for enhanced performance having repeatable etch and deposition ratesAPPLIED MATERIALS INC·Filed 2015·Granted Jan 29, 2019·3 cites·10 claims
- 2491US10083818B2Auto frequency tuned remote plasma sourceAPPLIED MATERIALS INC·Filed 2015·Granted Sep 25, 2018·8 cites·19 claims
- 2589US8742665B2Plasma source designLUBOMIRSKY DMITRY·Filed 2010·Granted Jun 3, 2014·20 cites·24 claims
- 2689US6413145B1System for polishing and cleaning substratesAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·38 cites·23 claims
- 2789US6053801ASubstrate polishing with reduced contaminationAPPLIED MATERIALS INC·Filed 1999·Granted Apr 25, 2000·58 cites·17 claims
- 2887US10388549B2On-board metrology (OBM) design and implication in process toolAPPLIED MATERIALS INC·Filed 2016·Granted Aug 20, 2019·8 cites·14 claims
- 2986US10984990B2Electrode assemblyAPPLIED MATERIALS INC·Filed 2018·Granted Apr 20, 2021·4 cites·13 claims
- 3084US10663491B2Voltage-current probe for measuring radio-frequency electrical power in a high-temperature environment and method of calibrating the sameAPPLIED MATERIALS INC·Filed 2018·Granted May 26, 2020·1 cites·8 claims
- 3184US5574410AElectronically tuned matching networks using adjustable inductance elements and resonant tank circuitsAPPLIED MATERIALS INC·Filed 1994·Granted Nov 12, 1996·66 cites·20 claims
- 3284US5392018AElectronically tuned matching networks using adjustable inductance elements and resonant tank circuitsAPPLIED MATERIALS INC·Filed 1992·Granted Feb 21, 1995·70 cites·7 claims
- 3383US9305749B2Methods of directing magnetic fields in a plasma source, and associated systemsAPPLIED MATERIALS INC·Filed 2015·Granted Apr 5, 2016·3 cites·15 claims
- 3481US4411023ASmoke protective hoodPINSON JAY D·Filed 1981·Granted Oct 25, 1983·54 cites·18 claims
- 3579US10580623B2Plasma processing using multiple radio frequency power feeds for improved uniformityAPPLIED MATERIALS INC·Filed 2014·Granted Mar 3, 2020·3 cites·11 claims
- 3677US12203171B2Batch curing chamber with gas distribution and individual pumpingAPPLIED MATERIALS INC·Filed 2022·Granted Jan 21, 2025·0 cites·9 claims
- 3777US10113236B2Batch curing chamber with gas distribution and individual pumpingAPPLIED MATERIALS INC·Filed 2014·Granted Oct 30, 2018·2 cites·20 claims
- 3877US9285168B2Module for ozone cure and post-cure moisture treatmentLUBOMIRSKY DMITRY·Filed 2011·Granted Mar 15, 2016·4 cites·13 claims
- 3975US6887124B2Method of polishing and cleaning substratesAPPLIED MATERIALS INC·Filed 2002·Granted May 3, 2005·14 cites·9 claims
- 4072US2025293072A1Electrostatic chuck with improved temperature controlAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 4171US5572170AElectronically tuned matching networks using adjustable inductance elements and resonant tank circuitsAPPLIED MATERIALS INC·Filed 1995·Granted Nov 5, 1996·31 cites·12 claims
- 4265US11276562B2Plasma processing using multiple radio frequency power feeds for improved uniformityAPPLIED MATERIALS INC·Filed 2020·Granted Mar 15, 2022·0 cites·17 claims
- 4365US2022319841A1Deposition of low-stress carbon-containing layersAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 4464US11404263B2Deposition of low-stress carbon-containing layersAPPLIED MATERIALS INC·Filed 2020·Granted Aug 2, 2022·0 cites·17 claims
- 4563US12460298B2Showerhead design to control stray depositionAPPLIED MATERIALS INC·Filed 2021·Granted Nov 4, 2025·0 cites·18 claims
- 4663US6244931B1Buffer station on CMP systemAPPLIED MATERIALS INC·Filed 1999·Granted Jun 12, 2001·28 cites·15 claims
- 4762US12322633B2Electrostatic chuck with improved temperature controlAPPLIED MATERIALS INC·Filed 2021·Granted Jun 3, 2025·0 cites·15 claims
- 4862US11408075B2Batch curing chamber with gas distribution and individual pumpingAPPLIED MATERIALS INC·Filed 2018·Granted Aug 9, 2022·0 cites·10 claims
- 4960US10916407B2Conditioning remote plasma source for enhanced performance having repeatable etch and deposition ratesAPPLIED MATERIALS INC·Filed 2018·Granted Feb 9, 2021·0 cites·19 claims
- 5060US6251001B1Substrate polishing with reduced contaminationAPPLIED MATERIALS INC·Filed 1999·Granted Jun 26, 2001·21 cites·12 claims
Showing the top 50 of 68 patent records by PatentIndex Score.
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