Inventor · disambiguated record
Ravi Prasher
Also filed as: PRASHER RAVI · PRASHER RAVI S · PRASHER RAVI SHANKAR
36 granted patents·27 pending applications·1,307 citations·filing 2000–2025
98Inventor score
Top patents by PatentIndex Score
63 records- 0196US7259965B2Integrated circuit coolant microchannel assembly with targeted channel configurationINTEL CORP·Filed 2005·Granted Aug 21, 2007·40 cites·14 claims
- 0296US6992382B2Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline siliconINTEL CORP·Filed 2003·Granted Jan 31, 2006·122 cites·17 claims
- 0395US7435623B2Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline siliconINTEL CORP·Filed 2005·Granted Oct 14, 2008·38 cites·4 claims
- 0495US6903929B2Two-phase cooling utilizing microchannel heat exchangers and channeled heat sinkINTEL CORP·Filed 2003·Granted Jun 7, 2005·111 cites·28 claims
- 0595US6381135B1Loop heat pipe for mobile computersINTEL CORP·Filed 2001·Granted Apr 30, 2002·109 cites·19 claims
- 0694US7957137B2Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannelINTEL CORP·Filed 2009·Granted Jun 7, 2011·33 cites·5 claims
- 0794US6934154B2Micro-channel heat exchangers and spreadersINTEL CORP·Filed 2003·Granted Aug 23, 2005·91 cites·30 claims
- 0892US6661660B2Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachmentINTEL CORP·Filed 2001·Granted Dec 9, 2003·72 cites·17 claims
- 0991US6639799B2Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachmentINTEL CORP·Filed 2000·Granted Oct 28, 2003·67 cites·8 claims
- 1090US6535386B2Electronic assembly having a heat pipe that conducts heat from a semiconductor dieINTEL CORP·Filed 2000·Granted Mar 18, 2003·78 cites·35 claims
- 1190US6469893B1Direct heatpipe attachment to die using center point loadingINTEL CORP·Filed 2000·Granted Oct 22, 2002·53 cites·41 claims
- 1287US7104313B2Apparatus for using fluid laden with nanoparticles for application in electronic coolingINTEL CORP·Filed 2003·Granted Sep 12, 2006·45 cites·10 claims
- 1387US6625022B2Direct heatpipe attachment to die using center point loadingINTEL CORP·Filed 2001·Granted Sep 23, 2003·40 cites·18 claims
- 1486US6903930B2Parallel heat exchanger for a component in a mobile systemINTEL CORP·Filed 2002·Granted Jun 7, 2005·38 cites·24 claims
- 1585US7115987B2Integrated stacked microchannel heat exchanger and heat spreaderINTEL CORP·Filed 2003·Granted Oct 3, 2006·35 cites·30 claims
- 1685US6696635B2Thermoelectrically cooling electronic devicesINTEL CORP·Filed 2002·Granted Feb 24, 2004·50 cites·23 claims
- 1783US7243705B2Integrated circuit coolant microchannel with compliant coverINTEL CORP·Filed 2005·Granted Jul 17, 2007·10 cites·2 claims
- 1882US7253523B2Reworkable thermal interface materialINTEL CORP·Filed 2003·Granted Aug 7, 2007·28 cites·29 claims
- 1982US6906919B2Two-phase pumped liquid loop for mobile computer coolingINTEL CORP·Filed 2003·Granted Jun 14, 2005·34 cites·30 claims
- 2080US7031159B2Parallel heat exchanger for a component in a mobile systemINTEL CORP·Filed 2005·Granted Apr 18, 2006·8 cites·21 claims
- 2179US7212405B2Method and apparatus for providing distributed fluid flows in a thermal management arrangementINTEL CORP·Filed 2004·Granted May 1, 2007·28 cites·5 claims
- 2279US6365821B1Thermoelectrically cooling electronic devicesINTEL CORP·Filed 2000·Granted Apr 2, 2002·35 cites·19 claims
- 2378US7218519B2Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channelsINTEL CORP·Filed 2004·Granted May 15, 2007·24 cites·28 claims
- 2477US6351387B1System and method of heat extraction from an integrated circuit dieINTEL CORP·Filed 2000·Granted Feb 26, 2002·23 cites·18 claims
- 2576US6504721B1Thermal cooling apparatusINTEL CORP·Filed 2000·Granted Jan 7, 2003·25 cites·27 claims
- 2674US6992381B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2003·Granted Jan 31, 2006·16 cites·18 claims
- 2774US6981849B2Electro-osmotic pumps and micro-channelsINTEL CORP·Filed 2002·Granted Jan 3, 2006·20 cites·16 claims
- 2870US7633752B2Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannelINTEL CORP·Filed 2004·Granted Dec 15, 2009·14 cites·22 claims
- 2968US7309453B2Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing sameINTEL CORP·Filed 2006·Granted Dec 18, 2007·5 cites·35 claims
- 3068US2025210675A1Integrated fuel cell and absorption chiller system and methods of operating the sameBLOOM ENERGY CORP·Filed 2024·Application pending·0 cites
- 3164US2024183623A1Salt hydrate composites for thermochemical energy storage and methods of making thereofUNIV CALIFORNIA·Filed 2023·Application pending·0 cites
- 3260US7576432B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2005·Granted Aug 18, 2009·1 cites·15 claims
- 3359US2024199937A1Nanoparticle composites for use as an insulation and methods of making thereofUNIV CALIFORNIA·Filed 2023·Application pending·0 cites
- 3459US2025067693A1Sensor for themal properties measument using the 3 omega method and methods of use thereofUNIV CALIFORNIA·Filed 2024·Application pending·0 cites
- 3559US2025235952A1Broadband emitters for thermal radiative energy transportUNIV CALIFORNIA·Filed 2025·Application pending·0 cites
- 3658US7071552B2IC die with directly bonded liquid cooling deviceINTEL CORP·Filed 2004·Granted Jul 4, 2006·7 cites·16 claims
- 3757US2025260234A1Fuel cell system architecture for artificial intelligence model trainingBLOOM ENERGY CORP·Filed 2025·Application pending·0 cites
- 3856US11845682B2Systems and methods for water desalination using thermo-responsive ionic liquids regenerated by solar energyUNIV CALIFORNIA·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 3956US7365980B2Micropin heat exchangerINTEL CORP·Filed 2003·Granted Apr 29, 2008·6 cites·39 claims
- 4055US2005117300A1Channeled heat sink and chassis with integrated heat rejecter for two-phase coolingFiled 2005·Application pending·0 cites
- 4155US2005117299A1Channeled heat sink and chassis with integrated heat rejecter for two-phase coolingFiled 2005·Application pending·0 cites
- 4250US2018366629A1Thermoelectric device for high temperature applicationsSHEETAK INC·Filed 2018·Application pending·0 cites
- 4348US2005117301A1Channeled heat sink and chassis with integrated heat rejecter for two-phase coolingFiled 2005·Application pending·0 cites
- 4447US2007230116A1Integrated circuit coolant microchannel with compliant coverMYERS ALAN M·Filed 2007·Application pending·0 cites
- 4546US2006244127A1Integrated stacked microchannel heat exchanger and heat spreaderHOLALKERE VEN R·Filed 2006·Application pending·0 cites
- 4645US2004190253A1Channeled heat sink and chassis with integrated heat rejector for two-phase coolingFiled 2003·Application pending·0 cites
- 4745US2007217147A1Integrated circuit coolant microchannel assembly with targeted channel configurationCHANG JE-YOUNG·Filed 2007·Application pending·0 cites
- 4844US6751837B2Method of heat extraction from an integrated circuit dieINTEL CORP·Filed 2001·Granted Jun 22, 2004·1 cites·19 claims
- 4943US2008006389A1Preventing burst-related hazards in microelectronic cooling systemsSAUCIUC IOAN·Filed 2006·Application pending·0 cites
- 5043US2005169831A1Three-dimensional nanotube structureFiled 2004·Application pending·0 cites
Showing the top 50 of 63 patent records by PatentIndex Score.
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