Three-dimensional nanotube structure

Abstract

Embodiments of the invention provide a three-dimensional nanotube structure. For one embodiment, a connector molecule is created that has bonding sites capable of bonding with one end of an open-ended nanotube segment and bonding sites capable of bonding with the corresponding bonding sites of a plurality of other connector molecules. For one embodiment, the connector molecule is cone-shaped, with base of the cone determined so as to bond with the edge of the open-ended nanotube and the point of the cone comprising a single molecule capable of bonding with the corresponding molecules of two or more other connector molecules. In one embodiment, the three-dimensional nanotube structures are incorporated into a polymer matrix to form a composite polymer having improved thermal conductivity. For one embodiment, the composite polymer is used to form efficient and cost-effective heat dissipation devices.

1 . A method comprising: 
 opening a number of nanotubes to create open-ended nanotube segments; and    bringing a corresponding number of connector molecules into contact with the nanotube segments, each connector molecule providing first bonding sites capable of bonding with one end of the nanotube segments and second bonding sites capable of bonding with corresponding bonding sites of a plurality of other connector molecules, such that bonding occurs forming three-dimensional nanotube structures.    
     
     
         2 . The method of  claim 1  wherein the nanotubes are carbon nanotubes.  
     
     
         3 . The method of  claim 2  wherein the connector molecule is in the shape of a cone.  
     
     
         4 . The method of  claim 3  wherein the base of the cone is comprised of a ring of atoms capable of binding to an edge of an open-ended nanotube segment.  
     
     
         5 . The method of  claim 3  wherein the point of the cone is comprised of a single point atom capable of binding with a corresponding point atom of each of two or more other connector molecules.  
     
     
         6 . The method of  claim 2  further comprising: 
 allowing bonding to occur; and    filtering at least some of any misbonded nanotube segments or connector molecules.    
     
     
         7 . The method of  claim 6  further comprising: 
 mixing the three-dimensional nanotube structures with a polymer matrix material to form a composite polymer material.    
     
     
         8 . The method of  claim 6  further comprising: 
 forming a heat dissipation device from the composite polymer material.    
     
     
         9 . The method of  claim 8  wherein the heat dissipation device is a heat dissipation device selected from the group consisting of a microchannel device, a cold plate, an integrated heat spreader, and a heat sink.  
     
     
         10 . The method of  claim 8  wherein a method of forming the heat dissipation device is selected from the group consisting of molding, casting, and extruding.  
     
     
         11 . A composite polymer comprising: 
 a polymer matrix material; and    one or more three-dimensional nanotube structures incorporated within the polymer matrix material.    
     
     
         12 . The composite polymer of  claim 11  wherein each three-dimensional nanotube structure is comprised of a number of open-ended nanotube segments each having at least one connector molecule bonded thereto, at least some of the connector molecules bonded to two or more other connector molecules.  
     
     
         13 . The composite polymer of  claim 12  wherein the nanotube segments are carbon nanotube segments.  
     
     
         14 . The composite polymer of  claim 13  wherein the connector molecules are in the shape of a cone.  
     
     
         15 . The composite polymer of  claim 14  wherein the base of the cone is comprised of a ring of atoms capable of binding to an edge of each of the open-ended nanotube segments.  
     
     
         16 . The composite polymer of  claim 14  wherein the point of the cone is comprised of a single point atom capable of binding with a corresponding point atom of each of two or more other connector molecules.  
     
     
         17 . A connector molecule comprising: 
 one or more atoms providing a plurality of binding sites capable of binding to one end of an open-ended nanotube segment; and    one or more additional atoms providing one or more binding sites capable of binding to a corresponding one or more additional atoms of more than one other connector molecules.    
     
     
         18 . The connector molecule of  claim 17  wherein the connector molecule is in the shape of a cone.  
     
     
         19 . The connector molecule of  claim 18  wherein the base of the cone is comprised of a ring of atoms capable of binding to an edge of an open-ended nanotube segment.  
     
     
         20 . The connector molecule of  claim 18  wherein the point of the cone is comprised of a single point atom capable of binding with a corresponding point atom of each of two or more other connector molecules.  
     
     
         21 . The connector molecule of  claim 17  wherein the nanotube segment is a carbon nanotube segment.  
     
     
         22 . A system comprising: 
 an integrated circuit device; and    a heat dissipation device thermally coupled thereto, the heat dissipation device formed of a composite polymer comprised of a polymer matrix and one or more three-dimensional nanotube structures incorporated within the polymer matrix.    
     
     
         23 . The system of  claim 22  wherein each of the one or more three-dimensional nanotube structure is comprised of a number of open-ended nanotube segments each having at least one connector molecule bonded thereto, at least some of the connector molecules bonded to two or more other connector molecules.  
     
     
         24 . The system of  claim 23  wherein the nanotube segments are carbon nanotube segments.  
     
     
         25 . The system of  claim 22  wherein the heat dissipation device is a heat dissipation device selected from the group consisting of a microchannel device, a cold plate, an integrated heat spreader, and a heat sink.  
     
     
         26 . The system of  claim 25  wherein a method of forming the heat dissipation device is selected from the group consisting of molding, casting, and extruding.  
     
     
         27 . The system of  claim 26  wherein the heat dissipation device is a microchannel device formed by pressing wires between one or more stacked slabs of the polymer matrix such that the polymer matrix conforms to a shape of the wire and subsequently removing the wire to form one or more fluid channels for the microchannel device.