Integrated stacked microchannel heat exchanger and heat spreader

Abstract

Integrated stacked microchannrel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter. The integrated stacked microchannel heat exchanger and heat spreaders are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.

1 - 30 . (canceled)  
   
   
       31 . A system, comprising: 
 an integrated circuit (IC) die; a stacked microchannel heat exchanger operatively and thermally coupled to the IC die;    a pump, having an inlet and an outlet, said outlet fluidly coupled to an inlet of the stacked microchannel heat exchanger; and    a heat rejecter, having an inlet fluidly coupled to an outlet of the stacked microchannel heat exchanger and an outlet fluidly coupled to the inlet of the pump, wherein the system employs a working fluid that transfers heat generated by the IC die to the heat rejecter using a two-phase heat exchange mechanism.    
   
   
       32 . The system of  claim 31 , wherein the working fluid is water.  
   
   
       33 . The system of  claim 31 , wherein the pump comprises an electro osmotic pump.  
   
   
       34 . The system of  claim 31 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC die by a layer of solder disposed between the stacked microchannel heat exchanger and the surface of the IC die.  
   
   
       35 . The system of  claim 31 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC die by an adhesive disposed between the stacked microchannel heat exchanger and the surface of the IC die.  
   
   
       36 . The system of  claim 31 , wherein the stacked microchannel heat exchanger is thermally coupled to the IC die by a thermal interface material (TIM) layer.  
   
   
       37 . The system of  claim 31 , further comprising: 
 a solderable layer formed on the IC die, wherein the stacked microchannel heat exchanger is operatively and thermally coupled to the IC die by the solderable layer.    
   
   
       38 . A system, comprising: 
 an integrated circuit (IC) package; a stacked microchannel heat exchanger operatively and thermally coupled to the IC die;    a pump, having an inlet and an outlet, said outlet fluidly coupled to an inlet of the stacked microchannel heat exchanger; and    a heat rejecter, having an inlet fluidly coupled to an outlet of the stacked microchannel heat exchanger and an outlet fluidly coupled to the inlet of the pump, wherein the system employs a working fluid that transfers heat generated by the IC die to the heat rejecter using a two-phase heat exchange mechanism.    
   
   
       39 . The system of  claim 38 , wherein the working fluid is water.  
   
   
       40 . The system of  claim 38 , wherein the pump comprises an electro osmotic pump.  
   
   
       41 . The system of  claim 38 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC package by a layer of solder disposed between the stacked microchannel heat exchanger and the surface of the IC package.  
   
   
       42 . The system of  claim 38 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC package by an adhesive disposed between the stacked microchannel heat exchanger and the surface of the IC package.  
   
   
       43 . The system of  claim 38 , wherein the stacked microchannel heat exchanger is thermally coupled to the IC package by a thermal interface material (TIM) layer.  
   
   
       44 . The system of  claim 38 , further comprising: 
 a solderable layer formed on the IC package, wherein the stacked microchannel heat exchanger is operatively and thermally coupled to the IC package by the solderable layer.    
   
   
       45 . A system comprising: 
 an integrated circuit (IC) die;    a network interface;    an antenna coupled to the network interface;    a bus, said bus coupling the IC die to the network interface; and    a thermal mass coupled to the IC die, the thermal mass comprising a stacked microchannel heat exchanger.    
   
   
       46 . The system of  claim 45 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC die by a layer of solder disposed between the stacked microchannel heat exchanger and the surface of the IC die.  
   
   
       47 . The system of  claim 45 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC die by an adhesive disposed between the stacked microchannel heat exchanger and the surface of the IC die.  
   
   
       48 . The system of  claim 45 , wherein the stacked microchannel heat exchanger is thermally coupled to the IC die by a thermal interface material (TIM) layer.  
   
   
       49 . The system of  claim 45 , further comprising: 
 a solderable layer formed on the IC die, wherein the stacked microchannel heat exchanger is operatively and thermally coupled to the IC die by the solderable layer.    
   
   
       50 . A system comprising: 
 an integrated circuit (IC) package;    a network interface;    an antenna coupled to the network interface;    a bus, said bus coupling the IC package to the network interface; and    a thermal mass coupled to the IC package, the thermal mass comprising a stacked microchannel heat exchanger.    
   
   
       51 . The system of  claim 50 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC package by a layer of solder disposed between the stacked microchannel heat exchanger and the surface of the IC package.  
   
   
       52 . The system of  claim 50 , wherein the stacked microchannel heat exchanger is thermally and operatively coupled to the IC package by an adhesive disposed between the stacked microchannel heat exchanger and the surface of the IC package.  
   
   
       53 . The system of  claim 50 , wherein the stacked microchannel heat exchanger is thermally coupled to the IC package by a thermal interface material (TIM) layer.  
   
   
       54 . The system of  claim 50 , further comprising: 
 a solderable layer formed on the IC package, wherein the stacked microchannel heat exchanger is operatively and thermally coupled to the IC package by the solderable layer.    
   
   
       55 . A method; comprising: 
 thermally coupling at least one stacked microchannel heat exchanger to at least one IC;    passing a working fluid through the at least one stacked microchannel heat exchanger;    transferring heat produced by the at least one IC via the at least one stacked microchannel heat exchanger to the working fluid to convert a portion of the working fluid passing through the microchannels in the at least one stacked microchannel heat exchanger from a liquid to a vapor phase; and    passing the working fluid exiting the at least one stacked microchannel heat exchanger through a heat rejecter, wherein the vapor phase portion of the working fluid is converted back to a liquid phase.    
   
   
       56 . The method of  claim 55 , wherein the at least one IC includes a processor IC and at least one additional component from the following group: a platform chipset IC, a video IC, a memory IC and a co-processor IC.  
   
   
       57 . The method of  claim 55 , wherein the working fluid comprises water.  
   
   
       58 . The method of  claim 55 , wherein the working fluid is passed through the at least one stacked microchannel heat exchanger and heat rejecter via a electro-osmotic pump.  
   
   
       59 . The method of  claim 55 , wherein the heat rejecter comprises a channeled heat sink including a plurality of hollow heat sink fins having respective channels defined therein.  
   
   
       60 . The method of  claim 55 , wherein the heat rejecter comprises a stacked microchannel heat exchanger.