Inventor · disambiguated record
Nobuhiko Noto
Also filed as: NOTO NOBUHIKO
36 granted patents·7 pending applications·375 citations·filing 1989–2012
97Inventor score
Top patents by PatentIndex Score
43 records- 0192US6589447B1Compound semiconductor single crystal and fabrication process for compound semiconductor deviceSHINETSU HANDOTAI KK·Filed 2000·Granted Jul 8, 2003·93 cites·10 claims
- 0285US7550309B2Method for producing semiconductor waferSHINETSU HANDOTAI KK·Filed 2005·Granted Jun 23, 2009·10 cites·8 claims
- 0382US7861421B2Method for measuring rotation angle of bonded waferSHINETSU HANDOTAI KK·Filed 2008·Granted Jan 4, 2011·8 cites·8 claims
- 0481US6995401B2Light emitting device and method of fabricating the sameNANOTECO CORP·Filed 2003·Granted Feb 7, 2006·35 cites·58 claims
- 0575US8823130B2Silicon epitaxial wafer, method for manufacturing the same, bonded SOI wafer and method for manufacturing the sameKATO MASAHIRO·Filed 2011·Granted Sep 2, 2014·4 cites·8 claims
- 0675US6787383B2Light-emitting device and method for manufacturing the sameSHIN ETSU HANOTAI CO LTD·Filed 2002·Granted Sep 7, 2004·33 cites·35 claims
- 0774US5442203ASemiconductor light emitting device having AlGaAsP light reflecting layersSHINETSU HANDOTAI KK·Filed 1994·Granted Aug 15, 1995·36 cites·7 claims
- 0872US7041529B2Light-emitting device and method of fabricating the sameNANOTECO CORP·Filed 2003·Granted May 9, 2006·23 cites·35 claims
- 0971US7838388B2Method for producing SOI substrateSHINETSU HANDOTAI KK·Filed 2009·Granted Nov 23, 2010·3 cites·12 claims
- 1071US7749861B2Method for manufacturing SOI substrate and SOI substrateSHINETSU HANDOTAI KK·Filed 2006·Granted Jul 6, 2010·3 cites·8 claims
- 1170US8053334B2Method for forming silicon oxide film of SOI waferSHINETSU HANDOTAI KK·Filed 2008·Granted Nov 8, 2011·3 cites·8 claims
- 1268US8361888B2Method for manufacturing SOI waferSHINETSU HANDOTAI KK·Filed 2008·Granted Jan 29, 2013·2 cites·6 claims
- 1368US6759689B2Light emitting element and method for manufacturing the sameSHINETSU HANDOTAI KK·Filed 2002·Granted Jul 6, 2004·18 cites·13 claims
- 1465US8691665B2Method for producing bonded waferOKA SATOSHI·Filed 2010·Granted Apr 8, 2014·2 cites·8 claims
- 1565US8173521B2Method for manufacturing bonded waferKOBAYASHI NORIHIRO·Filed 2008·Granted May 8, 2012·3 cites·16 claims
- 1664US8410573B2SOI (silicon on insulator) structure semiconductor device and method of manufacturing the sameOHTSUKI HIROSHI·Filed 2008·Granted Apr 2, 2013·2 cites·13 claims
- 1764US8097523B2Method for manufacturing bonded waferKOBAYASHI NORIHIRO·Filed 2009·Granted Jan 17, 2012·3 cites·6 claims
- 1864US4987472ACompound semiconductor epitaxial waferSHINETSU HANDOTAI KK·Filed 1989·Granted Jan 22, 1991·20 cites·2 claims
- 1961US7776719B2Method for manufacturing bonded waferSHINETSU HANDOTAI KK·Filed 2007·Granted Aug 17, 2010·2 cites·5 claims
- 2059US6847056B2Light emitting deviceSHINETSU HANDOTAI KK·Filed 2002·Granted Jan 25, 2005·8 cites·15 claims
- 2155US5739553AAlgainp light-emitting deviceSHINETSU HANDOTAI KK·Filed 1995·Granted Apr 14, 1998·21 cites·16 claims
- 2254US5600158ASemiconductor light emitting device with current spreading layerSHINETSU HANDOTAI KK·Filed 1995·Granted Feb 4, 1997·19 cites·8 claims
- 2349US8389382B2Method for manufacturing bonded waferOKA SATOSHI·Filed 2009·Granted Mar 5, 2013·0 cites·17 claims
- 2448US8466538B2SOI wafer, semiconductor device, and method for manufacturing SOI waferISHIZUKA TOHRU·Filed 2009·Granted Jun 18, 2013·0 cites·5 claims
- 2548US7553685B2Method of fabricating light-emitting device and light-emitting deviceSHINETSU HANDOTAI KK·Filed 2003·Granted Jun 30, 2009·2 cites·18 claims
- 2647US8202787B2Method for manufacturing SOI waferISHIZUKA TOHRU·Filed 2009·Granted Jun 19, 2012·0 cites·16 claims
- 2747US7985660B2Method for manufacturing soi waferSHINETSU HANDOTAI KK·Filed 2008·Granted Jul 26, 2011·0 cites·14 claims
- 2847US5444269AAlGaInP light emitting deviceSHINETSU HANDOTAI KK·Filed 1994·Granted Aug 22, 1995·11 cites·4 claims
- 2947US5442201ASemiconductor light emitting device with nitrogen dopingSHINETSU HANDOTAI KK·Filed 1994·Granted Aug 15, 1995·9 cites·8 claims
- 3046US7799660B2Method for manufacturing SOI substrateSHINETSU HANDOTAI KK·Filed 2008·Granted Sep 21, 2010·0 cites·8 claims
- 3146US2010003803A1Manufacturing method of strained si substrateSHINETSU HANDOTAI KK·Filed 2007·Application pending·0 cites
- 3246US2006185581A1Method for producing a semiconductor waferSHINETSU HANDOTAI KK·Filed 2006·Application pending·0 cites
- 3345US8697544B2Method for manufacturing bonded waferISHIZUKA TOHRU·Filed 2009·Granted Apr 15, 2014·0 cites·1 claims
- 3445US8076223B2Method for producing semiconductor substrateOKA SATOSHI·Filed 2007·Granted Dec 13, 2011·0 cites·9 claims
- 3542US2007287269A1Method For Producing Semiconductor WaferSHINETSU HANDOTAI KK·Filed 2005·Application pending·0 cites
- 3641US2008315349A1Method for Manufacturing Bonded Wafer and Bonded WaferSHINETSU HANDOTAI KK·Filed 2005·Application pending·0 cites
- 3738US8987109B2Method for manufacturing bonded wafer and bonded SOI waferAGA HIROJI·Filed 2012·Granted Mar 24, 2015·0 cites·17 claims
- 3838US8338277B2Method for manufacturing SOI substrateTAKENO HIROSHI·Filed 2008·Granted Dec 25, 2012·0 cites·2 claims
- 3938US2004104395A1Light-emitting device, method of fabricating the same, and OHMIC electrode structure for semiconductor deviceSHINETSU HANDOTAI KK·Filed 2003·Application pending·0 cites
- 4034US2013102126A1Method for manufacturing bonded waferAGA HIROJI·Filed 2011·Application pending·0 cites
- 4132US2011281420A1Method for manufacturing soi waferAGA HIROJI·Filed 2010·Application pending·0 cites
- 4231US9496130B2Reclaiming processing method for delaminated waferISHIZUKA TORU·Filed 2012·Granted Nov 15, 2016·0 cites·1 claims
- 4331US5597761ASemiconductor light emitting device and methods of manufacturing itSHINETSU HANDOTAI KK·Filed 1995·Granted Jan 28, 1997·2 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →