Inventor · disambiguated record
Toshio Hanada
Also filed as: HANADA TOSHIO
13 granted patents·4 pending applications·19 citations·filing 2004–2025
87Inventor score
Files withROHM CO LTD11NEXFI TECH INC3FUKUSHIMA SIC APPLIED ENG INC1HANADA TOSHIO1HITACHI HIGH TECH CORP1
Top patents by PatentIndex Score
17 records- 0191US11532537B2Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic moldROHM CO LTD·Filed 2020·Granted Dec 20, 2022·2 cites·26 claims
- 0287US9691673B2Power module semiconductor deviceROHM CO LTD·Filed 2015·Granted Jun 27, 2017·5 cites·18 claims
- 0387US9147622B2Power module semiconductor deviceROHM CO LTD·Filed 2013·Granted Sep 29, 2015·8 cites·29 claims
- 0486US12322683B2Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic moldROHM CO LTD·Filed 2024·Granted Jun 3, 2025·0 cites·20 claims
- 0586US9960103B2Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic moldROHM CO LTD·Filed 2015·Granted May 1, 2018·4 cites·17 claims
- 0685US2025266326A1Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic moldROHM CO LTD·Filed 2025·Application pending·0 cites
- 0784US11973007B2Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic moldROHM CO LTD·Filed 2023·Granted Apr 30, 2024·0 cites·17 claims
- 0880US11967543B2Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic moldROHM CO LTD·Filed 2022·Granted Apr 23, 2024·0 cites·17 claims
- 0963US10896866B2Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic moldROHM CO LTD·Filed 2019·Granted Jan 19, 2021·0 cites·14 claims
- 1058US2018182688A1Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic moldROHM CO LTD·Filed 2018·Application pending·0 cites
- 1154US2024355562A1Dc circuit breakerNEXFI TECH INC·Filed 2023·Application pending·0 cites
- 1254US2025174514A1Power semiconductor switching moduleNEXFI TECH INC·Filed 2023·Application pending·0 cites
- 1352US8981542B2Semiconductor power module and method of manufacturing the sameROHM CO LTD·Filed 2013·Granted Mar 17, 2015·0 cites·14 claims
- 1446US7438793B2Capillary array having load headerHITACHI HIGH TECH CORP·Filed 2004·Granted Oct 21, 2008·0 cites·8 claims
- 1544US12022604B2Power substrate and high-voltage module equipped with sameNEXFI TECH INC·Filed 2020·Granted Jun 25, 2024·0 cites·4 claims
- 1640US8525315B2Semiconductor power module and method of manufacturing the sameHANADA TOSHIO·Filed 2011·Granted Sep 3, 2013·0 cites·22 claims
- 1735USD963574SPower supplyFUKUSHIMA SIC APPLIED ENG INC·Filed 2020·Granted Sep 13, 2022·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →