Inventor · disambiguated record

Chun-Chi Ke

Also filed as: KE CHUN-CHI

42 granted patents·19 pending applications·362 citations·filing 1999–2020

97Inventor score

Technology areasH10W H10P Y10T B81C H05K

Files withSILICONWARE PRECISION INDUSTRIES CO LTD40 CHANG CHIANG-CHENG5 CHAN CHANG-YUEH4 LIN PANG-CHUN4 CHIU CHI-HSIN2

Top patents by PatentIndex Score

61 records

0196US7934313B1Package structure fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted May 3, 2011·132 cites·32 claims
0294US8154115B1Package structure having MEMS element and fabrication method thereofCHAN CHANG-YUEH·Filed 2011·Granted Apr 10, 2012·16 cites·15 claims
0392US8420430B2Fabrication method of package structure having MEMS elementCHIU CHI-HSIN·Filed 2010·Granted Apr 16, 2013·17 cites·9 claims
0491US7355279B2Semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Apr 8, 2008·27 cites·14 claims
0590US8736030B2Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the sameYAO CHIN-TSAI·Filed 2010·Granted May 27, 2014·14 cites·7 claims
0689US9040361B2Chip scale package with electronic component received in encapsulant, and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted May 26, 2015·13 cites·23 claims
0785US8963298B2EMI shielding package structure and method for fabricating the sameYAO CHIN-TSAI·Filed 2010·Granted Feb 24, 2015·7 cites·10 claims
0885US7863740B2Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Jan 4, 2011·11 cites·6 claims
0984US9190387B2Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding functionSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 17, 2015·6 cites·12 claims
1081US8304268B2Fabrication method of semiconductor package structureLIN PANG-CHUN·Filed 2010·Granted Nov 6, 2012·5 cites·22 claims
1180US7666779B2Fabrication method of a semiconductor deviceSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Feb 23, 2010·9 cites·12 claims
1279US9673151B2Semiconductor package having metal layerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·3 cites·10 claims
1379US8253248B2Fabrication method of semiconductor device having conductive bumpsKE CHUN-CHI·Filed 2010·Granted Aug 28, 2012·6 cites·6 claims
1477US9177837B2Fabrication method of semiconductor package having electrical connecting structuresSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 3, 2015·3 cites·13 claims
1577US7804173B2Semiconductor device having conductive bumps and deviated solder padSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Sep 28, 2010·6 cites·9 claims
1677US6258705B1Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chipSILICONEWARE PREC IND CO LTD·Filed 2000·Granted Jul 10, 2001·27 cites·4 claims
1772US10833394B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Nov 10, 2020·1 cites·32 claims
1872US8716070B2Fabrication method of package structure having MEMS elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 6, 2014·2 cites·26 claims
1970US9190296B2Fabrication method of semiconductor package without chip carrierSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 17, 2015·2 cites·18 claims
2069US8421199B2Semiconductor package structureLIN PANG-CHUN·Filed 2010·Granted Apr 16, 2013·2 cites·8 claims
2169US8390118B2Semiconductor package having electrical connecting structures and fabrication method thereofLIN PANG-CHUN·Filed 2010·Granted Mar 5, 2013·2 cites·9 claims
2269US6753609B2Circuit probing contact pad formed on a bond pad in a flip chip packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jun 22, 2004·13 cites·3 claims
2367US8198689B2Package structure having micro-electromechanical element and fabrication method thereofCHAN CHANG-YUEH·Filed 2010·Granted Jun 12, 2012·2 cites·9 claims
2466US11289409B2Method for fabricating carrier-free semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·12 claims
2565US8525348B2Chip scale package and fabrication method thereofCHANG CHIANG-CHENG·Filed 2010·Granted Sep 3, 2013·2 cites·19 claims
2663US8866236B2Package structure having MEMS elementCHIU CHI-HSIN·Filed 2010·Granted Oct 21, 2014·1 cites·14 claims
2763US8026602B2Fabrication method of semiconductor device having conductive bumpsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted Sep 27, 2011·1 cites·12 claims
2862US8975734B2Semiconductor package without chip carrier and fabrication method thereofTSAI YUEH-YING·Filed 2010·Granted Mar 10, 2015·2 cites·19 claims
2959US7358177B2Fabrication method of under bump metallurgy structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Apr 15, 2008·1 cites·13 claims
3058US9254994B2Package structure having MEMS elementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Feb 9, 2016·0 cites·13 claims
3157US6309914B1Method for making a semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Oct 30, 2001·23 cites·15 claims
3255US10566271B2Carrier-free semiconductor package and fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 18, 2020·0 cites·13 claims
3354US8981575B2Semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 17, 2015·0 cites·9 claims
3454US8716861B2Semiconductor package having electrical connecting structures and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 6, 2014·0 cites·7 claims
3553US10192834B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jan 29, 2019·0 cites·16 claims
3652US11195812B2Method for fabricating an encapsulated electronic package using a supporting plateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Dec 7, 2021·0 cites·10 claims
3750US8564115B2Package structure having micro-electromechanical elementCHAN CHANG-YUEH·Filed 2012·Granted Oct 22, 2013·0 cites·8 claims
3850US2009008801A1Semiconductor device and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
3950US2014191376A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
4049US10074613B2Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packagesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 11, 2018·0 cites·13 claims
4149US6864564B2Flash-preventing semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Mar 8, 2005·6 cites·3 claims
4249US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
4347US9425152B2Method for fabricating EMI shielding package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 23, 2016·0 cites·9 claims
4447US2009102063A1Semiconductor package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
4547US2006246706A1Conductive bump structure for semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
4646US2009261476A1Semiconductor device and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
4746US2008296716A1Sensor semiconductor device and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
4846US2008230913A1Stackable semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
4946US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
5045US2010297842A1Conductive bump structure for semiconductor device and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Application pending·0 cites

Showing the top 50 of 61 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →