Inventor · disambiguated record
Mao-Hua Yeh
Also filed as: YEH MAO-HUA
13 granted patents·5 pending applications·83 citations·filing 2007–2021
89Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD15PHOENIX PREC TECHNOLOGY CORP2UNIMICRON TECHNOLOGY CORP1
Top patents by PatentIndex Score
18 records- 0190US9502335B2Package structure and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 22, 2016·13 cites·26 claims
- 0290US7968991B2Stacked package module and board having exposed endsUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Jun 28, 2011·32 cites·16 claims
- 0390US7656015B2Packaging substrate having heat-dissipating structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Granted Feb 2, 2010·24 cites·16 claims
- 0485US11152331B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Oct 19, 2021·4 cites·7 claims
- 0585US9899308B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 20, 2018·4 cites·28 claims
- 0678US10679914B2Electronic package and method for manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 9, 2020·2 cites·7 claims
- 0772US10833394B2Electronic package and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Nov 10, 2020·1 cites·32 claims
- 0870US9607939B2Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Mar 28, 2017·2 cites·21 claims
- 0967US9666536B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 30, 2017·1 cites·12 claims
- 1063US12009340B2Method for fabricating electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·13 claims
- 1163US11081415B2Method for manufacturing electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Aug 3, 2021·0 cites·8 claims
- 1253US11747382B2Test equipment and test device thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Sep 5, 2023·0 cites·11 claims
- 1349US2015035164A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1448US2017236783A1Package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 1546US2017148761A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 1645US9831191B2Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Nov 28, 2017·0 cites·8 claims
- 1741US2015035163A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1841US2008230886A1Stacked package modulePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →