Inventor · disambiguated record
Yoshitaka Mukaiyama
Also filed as: MUKAIYAMA YOSHITAKA
16 granted patents·6 pending applications·108 citations·filing 1998–2021
91Inventor score
Top patents by PatentIndex Score
22 records- 0193US7402227B2Plating apparatus and methodEBARA CORP·Filed 2004·Granted Jul 22, 2008·34 cites·30 claims
- 0292US7022211B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferEBARA CORP·Filed 2001·Granted Apr 4, 2006·47 cites·9 claims
- 0389US7833393B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferEBARA CORP·Filed 2006·Granted Nov 16, 2010·11 cites·14 claims
- 0487US8012332B2Plating apparatus and methodEBARA CORP·Filed 2008·Granted Sep 6, 2011·4 cites·6 claims
- 0580US9714476B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferEBARA CORP·Filed 2015·Granted Jul 25, 2017·2 cites·8 claims
- 0675US11047063B2Plating apparatus and plating methodEBARA CORP·Filed 2019·Granted Jun 29, 2021·0 cites·7 claims
- 0774US8961755B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferYOSHIOKA JUNICHIRO·Filed 2011·Granted Feb 24, 2015·2 cites·7 claims
- 0866US12226825B2Buffer chamber and AM system including a buffer chamberEBARA CORP·Filed 2021·Granted Feb 18, 2025·0 cites·10 claims
- 0964US11891715B2Paddle, processing apparatus having the paddle, and method of producing the paddleEBARA CORP·Filed 2021·Granted Feb 6, 2024·0 cites·13 claims
- 1063US10294578B2Plating apparatus and plating methodEBARA CORP·Filed 2015·Granted May 21, 2019·0 cites·2 claims
- 1153US10665495B2Substrate attachment/detachment device, plating device, control device for a substrate attachment/detachment device, and storage medium that stores a program for causing a computer to execute a method of controlling a substrate attachment/detachment deviceEBARA CORP·Filed 2017·Granted May 26, 2020·0 cites·22 claims
- 1251US8075756B2Semiconductor wafer holder and electroplating system for plating a semiconductor waferYOSHIOKA JUNICHIRO·Filed 2010·Granted Dec 13, 2011·0 cites·15 claims
- 1346US2002027080A1Plating apparatus and methodFiled 2001·Application pending·0 cites
- 1445US10577714B2Plating apparatus and plating methodEBARA CORP·Filed 2017·Granted Mar 3, 2020·0 cites·15 claims
- 1544US11384447B2Substrate holder, plating apparatus, method for manufacturing substrate holder, and method for holding substrateEBARA CORP·Filed 2017·Granted Jul 12, 2022·0 cites·29 claims
- 1644US2004256221A1Electrolytic solution supply and recovery facility and liquid component replenishment apparatusFiled 2004·Application pending·0 cites
- 1744US2017226656A1Apparatus and method for supplying plating solution to plating tank, plating system, powder container, and plating methodEBARA CORP·Filed 2017·Application pending·0 cites
- 1844US2015013905A1Wet processing apparatus and plating apparatusEBARA CORP·Filed 2014·Application pending·0 cites
- 1943US11015261B2Substrate holder and plating apparatusEBARA CORP·Filed 2017·Granted May 25, 2021·0 cites·12 claims
- 2043US2016130702A1Method of operating an electroless plating apparatusEBARA CORP·Filed 2015·Application pending·0 cites
- 2138US6500317B1Plating apparatus for detecting the conductivity between plating contacts on a substrateEBARA CORP·Filed 1998·Granted Dec 31, 2002·8 cites·5 claims
- 2238US2020255968A1Substrate-holder inspection apparatus, plating apparatus including the same, and appearance inspection apparatusEBARA CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →