Wet processing apparatus and plating apparatus

Abstract

A wet processing apparatus, such as a plating apparatus, and an etching apparatus, is disclosed. A wet processing apparatus includes a substrate-holder advancing mechanism configured to elevate a movable support to raise a substrate holder until the substrate holder is separated from a fixed support, move the movable support together with the substrate holder by a predetermined distance toward a holder takeout position, lower the movable support until the substrate holder is supported on the fixed support and the movable support is separated from the substrate holder, and move the movable support by the predetermined distance toward a holder put-in position.

What is claimed is: 
     
         1 . A wet processing apparatus comprising:
 a substrate holder configured to hold a substrate;   a processing bath configured to store a processing liquid therein; and   a substrate-holder advancing mechanism configured to move the substrate holder from a holder put-in position to a holder takeout position in the processing bath while keeping the substrate, held by the substrate holder, immersed in the processing liquid,   wherein the substrate-holder advancing mechanism includes
 a fixed support configured to support the substrate holder and suspend the substrate holder in the processing bath, 
 a movable support disposed adjacent to the fixed support and configured to support the substrate holder, and 
 an actuator configured to elevate the movable support to raise the substrate holder until the substrate holder is separated from the fixed support, move the movable support together with the substrate holder by a predetermined distance toward the holder takeout position, lower the movable support until the substrate holder is supported on the fixed support and the movable support is separated from the substrate holder, and move the movable support by the predetermined distance toward the holder put-in position. 
   
     
     
         2 . The wet processing apparatus according to  claim 1 , wherein the actuator comprises a first actuator configured to elevate and lower the movable support, and a second actuator configured to horizontally move the movable support. 
     
     
         3 . The wet processing apparatus according to  claim 1 , further comprising:
 a transporter configured to horizontally transport the substrate holder; and   a lifter configured to vertically transport the substrate holder between the transporter and the substrate-holder advancing mechanism, the lifter being configured to lower the substrate holder to immerse the substrate, held by the substrate holder, in the processing liquid in the processing bath and raise the substrate holder from the processing bath.   
     
     
         4 . The wet processing apparatus according to  claim 1 , wherein:
 the substrate holder has outwardly-projecting portions; and   the fixed support has a plurality of recesses into which the projecting portions of the substrate holder are to be fitted.   
     
     
         5 . The wet processing apparatus according to  claim 4 , wherein the movable support has a plurality of recesses into which the projecting portions of the substrate holder are to be fitted. 
     
     
         6 . A plating apparatus for plating a substrate, the plating apparatus comprising:
 a substrate holder configured to hold the substrate; and   a plurality of plating sections arranged in parallel,   wherein each of the plating sections includes
 a plurality of processing baths used for plating of the substrate, and 
 a substrate-holder transporter configured to transport the substrate holder, holding the substrate, between the processing baths, and 
   wherein a maintenance space is provided between the plating sections.   
     
     
         7 . The plating apparatus according to  claim 6 , wherein the maintenance space extends parallel to the substrate-holder transporter. 
     
     
         8 . The plating apparatus according to  claim 6 , wherein a piping space in which pipes for conveying processing liquids to the processing baths are disposed is formed below the maintenance space. 
     
     
         9 . The plating apparatus according to  claim 6 , wherein a utility fluid introduction port configured to supply a utility fluid, which is necessary for operation of the plating apparatus, to the plating sections is provided below the maintenance space. 
     
     
         10 . The plating apparatus according to  claim 6 , further comprising:
 a substrate transfer section disposed adjacent to the maintenance space and configured to transfer the substrate to the substrate holder transporter.   
     
     
         11 . The plating apparatus according to  claim 10 , wherein the substrate transfer section includes a spin-rinse-dryer configured to dry the substrate by rotating the substrate, and the spin-rinse-dryer is disposed adjacent to the maintenance space. 
     
     
         12 . The plating apparatus according to  claim 6 , wherein the plating sections are electroless plating sections. 
     
     
         13 . The plating apparatus according to  claim 6 , wherein the plating sections are electroplating sections.