Inventor · disambiguated record
Christine Y Ouyang
Also filed as: OUYANG CHRISTINE Y
21 granted patents·2 pending applications·40 citations·filing 2015–2024
92Inventor score
Top patents by PatentIndex Score
23 records- 0197US9829790B2Immersion field guided exposure and post-exposure bake processAPPLIED MATERIALS INC·Filed 2015·Granted Nov 28, 2017·12 cites·15 claims
- 0295US12013645B2Method for removing resist layer, method of forming a pattern and method of manufacturing a packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 18, 2024·2 cites·20 claims
- 0395US9823570B2Field guided post exposure bake application for photoresist microbridge defectsAPPLIED MATERIALS INC·Filed 2015·Granted Nov 21, 2017·6 cites·20 claims
- 0494US10845704B2Extreme ultraviolet photolithography method with infiltration for enhanced sensitivity and etch resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·4 cites·20 claims
- 0592US10157740B1Selective deposition process utilizing polymer structure deactivation processAPPLIED MATERIALS INC·Filed 2017·Granted Dec 18, 2018·7 cites·15 claims
- 0689US11211244B2Ultraviolet radiation activated atomic layer depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 28, 2021·2 cites·20 claims
- 0784US12379665B2Method for removing resist layer, method of forming a pattern and method of manufacturing a packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 0882US10615058B2Apparatus for field guided acid profile control in a photoresist layerAPPLIED MATERIALS INC·Filed 2017·Granted Apr 7, 2020·3 cites·20 claims
- 0981US12111576B2Extreme ultraviolet photolithography method with infiltration for enhanced sensitivity and etch resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 1081US11307500B2Method for removing photoresistor layer, method of forming a pattern and method of manufacturing a packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·2 cites·20 claims
- 1178US10048589B2Field guided post exposure bake application for photoresist microbridge defectsAPPLIED MATERIALS INC·Filed 2017·Granted Aug 14, 2018·1 cites·20 claims
- 1273US11487207B2Extreme ultraviolet photolithography method with infiltration for enhanced sensitivity and etch resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 1372US10861706B2Etch selectivity improved by laser beamTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·1 cites·20 claims
- 1470US12327721B2Ultraviolet radiation activated atomic layer depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·20 claims
- 1558US11908701B2Patterning method and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1651US11201060B2Structure and formation method of semiconductor device with metal gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·20 claims
- 1750US11087984B2Selective deposition by laser heating for forming a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·0 cites·20 claims
- 1850US9927709B2Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bakeAPPLIED MATERIALS INC·Filed 2016·Granted Mar 27, 2018·0 cites·19 claims
- 1947US9996006B2Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bakeAPPLIED MATERIALS INC·Filed 2016·Granted Jun 12, 2018·0 cites·20 claims
- 2047US9864276B2Laser annealing and electric fieldAPPLIED MATERIALS INC·Filed 2016·Granted Jan 9, 2018·0 cites·20 claims
- 2146US11545370B2Method for forming pattern and manufacturing method of packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 3, 2023·0 cites·14 claims
- 2238US2018171476A1Methods and apparatus for selective removal of self-assembled monolayers using laser annealingAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 2337US2017221701A1Rtp process for directed self-aligned patternsAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →