Inventor · disambiguated record
Jeremiah T. Pender
Also filed as: PENDER JEREMIAH · PENDER JEREMIAH T · PENDER JEREMIAH T P
24 granted patents·10 pending applications·1,276 citations·filing 2000–2016
97Inventor score
Top patents by PatentIndex Score
34 records- 0198US9543163B2Methods for forming features in a material layer utilizing a combination of a main etching and a cyclical etching processAPPLIED MATERIALS INC·Filed 2013·Granted Jan 10, 2017·114 cites·19 claims
- 0298US9478433B1Cyclic spacer etching process with improved profile controlAPPLIED MATERIALS INC·Filed 2015·Granted Oct 25, 2016·109 cites·20 claims
- 0398US9093389B2Method of patterning a silicon nitride dielectric filmAPPLIED MATERIALS INC·Filed 2014·Granted Jul 28, 2015·104 cites·19 claims
- 0498US8980758B1Methods for etching an etching stop layer utilizing a cyclical etching processAPPLIED MATERIALS INC·Filed 2013·Granted Mar 17, 2015·192 cites·18 claims
- 0598US8802572B2Method of patterning a low-k dielectric filmAPPLIED MATERIALS INC·Filed 2013·Granted Aug 12, 2014·115 cites·20 claims
- 0697US9165783B2Method of patterning a low-k dielectric filmNEMANI SRINIVAS D·Filed 2013·Granted Oct 20, 2015·118 cites·17 claims
- 0797US8748322B1Silicon oxide recess etchAPPLIED MATERIALS INC·Filed 2013·Granted Jun 10, 2014·125 cites·19 claims
- 0897US7575007B2Chamber recovery after opening barrier over copperAPPLIED MATERIALS INC·Filed 2006·Granted Aug 18, 2009·197 cites·19 claims
- 0993US6440864B1Substrate cleaning processAPPLIED MATERIALS INC·Filed 2000·Granted Aug 27, 2002·119 cites·46 claims
- 1091US7620511B2Method for determining plasma characteristicsAPPLIED MATERIALS INC·Filed 2007·Granted Nov 17, 2009·14 cites·13 claims
- 1191US7300597B2Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric materialAPPLIED MATERIALS INC·Filed 2006·Granted Nov 27, 2007·18 cites·23 claims
- 1289US7848898B2Method for monitoring process drift using plasma characteristicsAPPLIED MATERIALS INC·Filed 2009·Granted Dec 7, 2010·11 cites·20 claims
- 1387US9721807B2Cyclic spacer etching process with improved profile controlAPPLIED MATERIALS INC·Filed 2016·Granted Aug 1, 2017·4 cites·17 claims
- 1487US7286948B1Method for determining plasma characteristicsAPPLIED MATERIALS INC·Filed 2006·Granted Oct 23, 2007·9 cites·23 claims
- 1572US8143138B2Method for fabricating interconnect structures for semiconductor devicesPATZ RYAN JAMES·Filed 2008·Granted Mar 27, 2012·6 cites·6 claims
- 1671US9299577B2Methods for etching a dielectric barrier layer in a dual damascene structureAPPLIED MATERIALS INC·Filed 2014·Granted Mar 29, 2016·2 cites·18 claims
- 1770US8314033B2Method of patterning a low-k dielectric filmZHOU YIFENG·Filed 2011·Granted Nov 20, 2012·2 cites·10 claims
- 1870US7440859B2Method for determining plasma characteristicsAPPLIED MATERIALS INC·Filed 2006·Granted Oct 21, 2008·2 cites·17 claims
- 1968US11302519B2Method of patterning a low-k dielectric filmAPPLIED MATERIALS INC·Filed 2015·Granted Apr 12, 2022·1 cites·20 claims
- 2067US8980754B2Method of removing a photoresist from a low-k dielectric filmZHOU YIFENG·Filed 2011·Granted Mar 17, 2015·2 cites·20 claims
- 2167US7309448B2Selective etch process of a sacrificial light absorbing material (SLAM) over a dielectric materialAPPLIED MATERIALS INC·Filed 2003·Granted Dec 18, 2007·10 cites·41 claims
- 2265US9514953B2Methods for barrier layer removalAPPLIED MATERIALS INC·Filed 2014·Granted Dec 6, 2016·1 cites·20 claims
- 2364US8932959B2Method and system for etching plural layers on a workpiece including a lower layer containing an advanced memory materialAPPLIED MATERIALS INC·Filed 2013·Granted Jan 13, 2015·1 cites·17 claims
- 2454US2016133441A1Etch enhancement via controlled introduction of chamber contaminantsAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2551US8647990B2Method of patterning a low-K dielectric filmZHOU YIFENG·Filed 2012·Granted Feb 11, 2014·0 cites·10 claims
- 2649US2014308758A1Patterning magnetic memoryAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2746US2015200042A1Recessing ultra-low k dielectric using remote plasma sourceAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 2842US2015064921A1Low temperature plasma anneal process for sublimative etch processesAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2942US2014342569A1Near surface etch selectivity enhancementAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 3038US2010022091A1Method for plasma etching porous low-k dielectric layersLI SIYI·Filed 2008·Application pending·0 cites
- 3137US2010043821A1method of photoresist removal in the presence of a low-k dielectric layerLI SIYI·Filed 2008·Application pending·0 cites
- 3237US2011079918A1Plasma-based organic mask removal with silicon fluorideAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 3336US2003037879A1Top gas feed lid for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 3435US2011253670A1Methods for etching silicon-based antireflective layersAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
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