Inventor · disambiguated record
Kenneth P. Rodbell
Also filed as: RODBELL KENNETH · RODBELL KENNETH P · RODBELL KENNETH PARKER
137 granted patents·16 pending applications·2,361 citations·filing 1989–2021
99Inventor score
Top patents by PatentIndex Score
153 records- 0199US6685548B2Grooved polishing pads and methods of useIBM·Filed 2003·Granted Feb 3, 2004·137 cites·13 claims
- 0298US7649257B2Discrete placement of radiation sources on integrated circuit devicesIBM·Filed 2008·Granted Jan 19, 2010·62 cites·21 claims
- 0398US4954142AMethod of chemical-mechanical polishing an electronic component substrate and polishing slurry thereforIBM·Filed 1989·Granted Sep 4, 1990·330 cites·24 claims
- 0497US9881880B2Tamper-proof electronic packages with stressed glass component substrate(s)IBM·Filed 2016·Granted Jan 30, 2018·15 cites·13 claims
- 0597US7491948B2Method of detecting and transmitting radiation detection information to a networkIBM·Filed 2006·Granted Feb 17, 2009·41 cites·9 claims
- 0697US6451712B1Method for forming a porous dielectric material layer in a semiconductor device and device formedIBM·Filed 2000·Granted Sep 17, 2002·123 cites·43 claims
- 0796US9913370B2Tamper-proof electronic packages formed with stressed glassIBM·Filed 2016·Granted Mar 6, 2018·14 cites·18 claims
- 0896US9586857B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2015·Granted Mar 7, 2017·13 cites·20 claims
- 0996US8816717B2Reactive material for integrated circuit tamper detection and responseIBM·Filed 2012·Granted Aug 26, 2014·26 cites·24 claims
- 1094US9431354B2Activating reactions in integrated circuits through electrical dischargeIBM·Filed 2014·Granted Aug 30, 2016·12 cites·9 claims
- 1194US8492897B2Microstructure modification in copper interconnect structuresCABRAL JR CYRIL·Filed 2011·Granted Jul 23, 2013·15 cites·10 claims
- 1294US8080805B2FET radiation monitorGORDON MICHAEL·Filed 2010·Granted Dec 20, 2011·16 cites·35 claims
- 1394US7843063B2Microstructure modification in copper interconnect structureIBM·Filed 2008·Granted Nov 30, 2010·29 cites·15 claims
- 1494US6383066B1Multilayered polishing pad, method for fabricating, and use thereofIBM·Filed 2000·Granted May 7, 2002·91 cites·14 claims
- 1594US6268291B1Method for forming electromigration-resistant structures by dopingIBM·Filed 1998·Granted Jul 31, 2001·183 cites·32 claims
- 1693US6656019B1Grooved polishing pads and methods of useIBM·Filed 2000·Granted Dec 2, 2003·63 cites·10 claims
- 1792US5071714AMultilayered intermetallic connection for semiconductor devicesIBM·Filed 1989·Granted Dec 10, 1991·104 cites·16 claims
- 1891US8861728B2Integrated circuit tamper detection and responseIBM·Filed 2012·Granted Oct 14, 2014·12 cites·23 claims
- 1991US8828870B2Microstructure modification in copper interconnect structuresIBM·Filed 2014·Granted Sep 9, 2014·8 cites·20 claims
- 2091US7381635B2Method and structure for reduction of soft error rates in integrated circuitsIBM·Filed 2005·Granted Jun 3, 2008·17 cites·15 claims
- 2190US8129267B2Alpha particle blocking wire structure and method fabricating sameCABRAL JR CYRIL·Filed 2008·Granted Mar 6, 2012·19 cites·30 claims
- 2290US7491643B2Method and structure for reducing contact resistance between silicide contact and overlying metallizationIBM·Filed 2006·Granted Feb 17, 2009·16 cites·1 claims
- 2390US6589874B2Method for forming electromigration-resistant structures by dopingIBM·Filed 2001·Granted Jul 8, 2003·52 cites·13 claims
- 2489US10177102B2Tamper-proof electronic packages with stressed glass component substrate(s)IBM·Filed 2017·Granted Jan 8, 2019·4 cites·7 claims
- 2589US9735077B1Heterogeneous miniaturization platformIBM·Filed 2016·Granted Aug 15, 2017·5 cites·10 claims
- 2689US7186166B2Fiber embedded polishing padFREUDENBERG NONWOVENS LTD·Filed 2005·Granted Mar 6, 2007·13 cites·5 claims
- 2788US8361829B1On-chip radiation dosimeterIBM·Filed 2011·Granted Jan 29, 2013·8 cites·13 claims
- 2888US7923838B2Method and structure for reducing contact resistance between silicide contact and overlying metallizationIBM·Filed 2008·Granted Apr 12, 2011·12 cites·6 claims
- 2988US6974531B2Method for electroplating on resistive substratesIBM·Filed 2002·Granted Dec 13, 2005·20 cites·23 claims
- 3088US6344129B1Method for plating copper conductors and devices formedIBM·Filed 1999·Granted Feb 5, 2002·46 cites·17 claims
- 3187US9659979B2Sensors including complementary lateral bipolar junction transistorsIBM·Filed 2015·Granted May 23, 2017·4 cites·16 claims
- 3287US8008199B2Microstructure modification in copper interconnect structureIBM·Filed 2010·Granted Aug 30, 2011·8 cites·12 claims
- 3386US6709562B1Method of making electroplated interconnection structures on integrated circuit chipsIBM·Filed 1999·Granted Mar 23, 2004·90 cites·49 claims
- 3485US9718728B1Chemically strengthened glass and methods of making sameIBM·Filed 2016·Granted Aug 1, 2017·2 cites·20 claims
- 3584US10257924B2Tamper-proof electronic packages formed with stressed glassIBM·Filed 2017·Granted Apr 9, 2019·3 cites·19 claims
- 3684US9738560B2Controlling fragmentation of chemically strengthened glassIBM·Filed 2016·Granted Aug 22, 2017·2 cites·20 claims
- 3784US6712681B1Polishing pads with polymer filled fibrous web, and methods for fabricating and using sameIBM·Filed 2000·Granted Mar 30, 2004·26 cites·24 claims
- 3884US6429523B1Method for forming interconnects on semiconductor substrates and structures formedIBM·Filed 2001·Granted Aug 6, 2002·32 cites·35 claims
- 3984US6340325B1Polishing pad grooving method and apparatusIBM·Filed 2000·Granted Jan 22, 2002·31 cites·19 claims
- 4083US8860176B2Multi-doped silicon antifuse device for integrated circuitIBM·Filed 2012·Granted Oct 14, 2014·6 cites·18 claims
- 4182US7517795B2Stabilization of Ni monosilicide thin films in CMOS devices using implantation of ions before silicidationIBM·Filed 2006·Granted Apr 14, 2009·9 cites·1 claims
- 4282US6632377B1Chemical-mechanical planarization of metallurgyIBM·Filed 1999·Granted Oct 14, 2003·70 cites·10 claims
- 4381US5565707AInterconnect structure using a Al2 Cu for an integrated circuit chipIBM·Filed 1994·Granted Oct 15, 1996·54 cites·3 claims
- 4480US10380284B2Heterogeneous miniaturization platformIBM·Filed 2017·Granted Aug 13, 2019·2 cites·5 claims
- 4580US6964604B2Fiber embedded polishing padFREUDENBERG NONWOVENS LTD·Filed 2004·Granted Nov 15, 2005·19 cites·22 claims
- 4679US10170361B2Thin film interconnects with large grainsIBM·Filed 2014·Granted Jan 1, 2019·4 cites·16 claims
- 4779US9997475B2Monolithic integration of III-V cells for powering memory erasure devicesIBM·Filed 2016·Granted Jun 12, 2018·2 cites·9 claims
- 4878US8476683B2On-chip radiation dosimeterGORDON MICHAEL S·Filed 2012·Granted Jul 2, 2013·4 cites·5 claims
- 4978US6333120B1Method for controlling the texture and microstructure of plated copper and plated structureIBM·Filed 1999·Granted Dec 25, 2001·49 cites·16 claims
- 5076US6946716B2Electroplated interconnection structures on integrated circuit chipsIBM·Filed 2004·Granted Sep 20, 2005·16 cites·27 claims
Showing the top 50 of 153 patent records by PatentIndex Score.
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