Inventor · disambiguated record
Charan Gurumurthy
Also filed as: GURUMURTHY CHARAN · GURUMURTHY CHARAN K
32 granted patents·9 pending applications·597 citations·filing 2003–2017
97Inventor score
Top patents by PatentIndex Score
41 records- 0198US7402515B2Method of forming through-silicon vias with stress buffer collars and resulting devicesINTEL CORP·Filed 2005·Granted Jul 22, 2008·375 cites·22 claims
- 0292US7749900B2Method and core materials for semiconductor packagingINTEL CORP·Filed 2008·Granted Jul 6, 2010·26 cites·8 claims
- 0391US10306760B2Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the methodINTEL CORP·Filed 2017·Granted May 28, 2019·6 cites·6 claims
- 0490US8440916B2Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the methodLI YONGGANG·Filed 2007·Granted May 14, 2013·17 cites·23 claims
- 0589US8115307B2Embedding device in substrate cavityTOYAMA MUNEHIRO·Filed 2009·Granted Feb 14, 2012·18 cites·14 claims
- 0686US7592202B2Embedding device in substrate cavityINTEL CORP·Filed 2006·Granted Sep 22, 2009·12 cites·7 claims
- 0785US7915060B2Grid array connection device and methodINTEL CORP·Filed 2010·Granted Mar 29, 2011·6 cites·7 claims
- 0885US7888784B2Substrate package with through holes for high speed I/O flex cableINTEL CORP·Filed 2008·Granted Feb 15, 2011·11 cites·15 claims
- 0985US7042077B2Integrated circuit package with low modulus layer and capacitor/interposerINTEL CORP·Filed 2004·Granted May 9, 2006·35 cites·19 claims
- 1083US7956713B2Forming a helical inductorINTEL CORP·Filed 2007·Granted Jun 7, 2011·12 cites·18 claims
- 1183US7670951B2Grid array connection device and methodINTEL CORP·Filed 2005·Granted Mar 2, 2010·8 cites·6 claims
- 1281US9966351B2Grid array connection device and methodINTEL CORP·Filed 2016·Granted May 8, 2018·2 cites·20 claims
- 1379US9648733B2Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the methodLI YONGGANG·Filed 2013·Granted May 9, 2017·3 cites·4 claims
- 1479US9449936B2Grid array connection device and methodINTEL CORP·Filed 2015·Granted Sep 20, 2016·2 cites·10 claims
- 1578US7998857B2Integrated circuit and process for fabricating thereofINTEL CORP·Filed 2007·Granted Aug 16, 2011·6 cites·10 claims
- 1677US7583871B1Substrates for optical die structuresBCHIR OMAR J·Filed 2008·Granted Sep 1, 2009·8 cites·23 claims
- 1776US9554472B2Panel with releasable coreINTEL CORP·Filed 2014·Granted Jan 24, 2017·2 cites·25 claims
- 1874US8353101B2Method of making substrate package with through holes for high speed I/O flex cableINTEL CORP·Filed 2011·Granted Jan 15, 2013·3 cites·5 claims
- 1973US7517788B2System, apparatus, and method for advanced solder bumpingINTEL CORP·Filed 2005·Granted Apr 14, 2009·5 cites·10 claims
- 2072US9698114B2Grid array connection device and methodTOYAMA MUNEHIRO·Filed 2011·Granted Jul 4, 2017·2 cites·9 claims
- 2171US7831115B2Optical die structures and associated package substratesINTEL CORP·Filed 2008·Granted Nov 9, 2010·2 cites·23 claims
- 2271US6858475B2Method of forming an integrated circuit substrateINTEL CORP·Filed 2003·Granted Feb 22, 2005·18 cites·27 claims
- 2366US9554468B2Panel with releasable coreINTEL CORP·Filed 2014·Granted Jan 24, 2017·2 cites·23 claims
- 2466US8456016B2Method and core materials for semiconductor packagingLI YONGGANG·Filed 2010·Granted Jun 4, 2013·1 cites·11 claims
- 2566US7985622B2Method of forming collapse chip connection bumps on a semiconductor substrateINTEL CORP·Filed 2008·Granted Jul 26, 2011·3 cites·16 claims
- 2663US7666714B2Assembly of thin die coreless packageINTEL CORP·Filed 2006·Granted Feb 23, 2010·2 cites·4 claims
- 2762US7013562B2Method of using micro-contact imprinted features for formation of electrical interconnects for substratesINTEL CORP·Filed 2003·Granted Mar 21, 2006·8 cites·15 claims
- 2861US8395051B2Doping of lead-free solder alloys and structures formed therebyPANG MENGZHI·Filed 2008·Granted Mar 12, 2013·2 cites·6 claims
- 2955US7790598B2System, apparatus, and method for advanced solder bumpingINTEL CORP·Filed 2009·Granted Sep 7, 2010·0 cites·6 claims
- 3053US2017202080A1Panel with releasable coreINTEL CORP·Filed 2017·Application pending·0 cites
- 3152US8877565B2Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the methodLI YONGGANG·Filed 2007·Granted Nov 4, 2014·0 cites·13 claims
- 3251US2011058340A1Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the methodLI YONGGANG·Filed 2010·Application pending·0 cites
- 3351US2009166858A1Lga substrate and method of making sameBCHIR OMAR J·Filed 2007·Application pending·0 cites
- 3448US2008242063A1Solder composition doped with a barrier component and method of making samePANG MENGZHI·Filed 2007·Application pending·0 cites
- 3548US2010301484A1Lga substrate and method of making sameBCHIR OMAR J·Filed 2010·Application pending·0 cites
- 3648US2009056989A1Printed circuit board and method for preparation thereofINTEL CORP·Filed 2007·Application pending·0 cites
- 3747US9049807B2Processes of making pad-less interconnect for electrical coreless substrateSOTO JAVIER·Filed 2008·Granted Jun 2, 2015·0 cites·19 claims
- 3845US2005186774A1Method of using micro-contact imprinted features for formation of electrical interconnects for substratesFiled 2005·Application pending·0 cites
- 3944US2008251932A1Method of forming through-silicon vias with stress buffer collars and resulting devicesARANA LEONEL R·Filed 2008·Application pending·0 cites
- 4043US2009250824A1Method and apparatus to reduce pin voidsQI XIWANG·Filed 2008·Application pending·0 cites
- 4140US9941158B2Integrated circuit and process for fabricating thereofGURUMURTHY CHARAN·Filed 2011·Granted Apr 10, 2018·0 cites·10 claims
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