Method of using micro-contact imprinted features for formation of electrical interconnects for substrates

Abstract

An imprinting stamp to imprint an opening in a material layer in which the imprint stamp has a coating of a seed material. The seed material is transferred onto the surface within the opening to operate as a seed for filling the opening. In one embodiment, low surface energy material is used as a passivation layer between the imprinting surface and the seed coating to reduce adhesion during micro-contact transfer of the seed into the opening. The imprinting stamp is used to form trenches and via openings for formation of electrical interconnects.

1 - 15 . (canceled)  
   
   
       16 . An apparatus comprising: 
 an imprinting stamp to imprint an opening into a material layer;    a coating on a surface of the imprinting stamp which is to be transferred by micro-contact when the opening is imprinted by the imprinting stamp.    
   
   
       17 . The apparatus of  claim 16  further comprising a passivation layer formed between the surface of the imprinting stamp and the coating to reduce adhesion of the imprinting stamp on the coating when the coating is transferred into the opening.  
   
   
       18 . The apparatus of  claim 17 , wherein the coating is metallic and has an approximate thickness of 20-30 nanometers.  
   
   
       19 . The apparatus of  claim 17 , wherein the coating is a metal.  
   
   
       20 . The apparatus of  claim 17  wherein the coating is copper.